Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W25Q16VSSIG | Winbond Electronics | 0.6282 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 5.28mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | unknown | 5.28mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 8 | YES | 1.27mm | S-PDSO-G8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 16Mb 2M x 8 | Non-Volatile | 0.018mA | 2.7V~3.6V | 2MX8 | 8 | 16777216 bit | 80MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS2502U-118E+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Obsolete | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V424L10PHI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 85°C | -40°C | Non-RoHS Compliant | TSOP | Parallel | RAM, SRAM - Asynchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29GL256P11TAIV20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2015 | GL-P | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | 18.4mm | Non-RoHS Compliant | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | 256 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | 110mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 3V | 30 | 0.5mm | 2.7V | 1.8/3.33/3.3V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 1.65V~3.6V | 1 | Asynchronous | 8b | 0.000005A | 110 ns | 8 | 3V | YES | YES | YES | 256 | 8/16words | YES | YES | FLASH | Parallel | 110ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IDT71V3577SA75BQI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V3577 | 165-CABGA (13x15) | 7.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC256-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Surface Mount | Tube | 2007 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | Lead Free | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 256 kb | 3mm | Surface Mount | -40°C~125°C TA | CMOS | 1.2mm | 1 | 6mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 25LC256 | 8 | 0.65mm | 2.5V | 3/5V | 5.5V | 50 ns | 256Kb 32K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT40A512M16JY-083E IT:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2017 | Obsolete | 3 (168 Hours) | 96 | 1 | 14mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-TFBGA | 8mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR4 | SYNCHRONOUS | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.2V | 30 | YES | 0.8mm | R-PBGA-B96 | 1.14V | 1.26V | 8Gb 512M x 16 | Volatile | 1.14V~1.26V | 512MX16 | 16 | 8589934592 bit | 1.2GHz | MULTI BANK PAGE BURST | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS61QDPB42M36A2-500B4L | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 15mm | ROHS3 Compliant | 165 | 165-LBGA | 13mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QUADP | 1.4mm | 1 | BOTTOM | 1.8V | YES | 1mm | 1.71V | Not Qualified | 1.8V | 1.89V | 3-STATE | 8.4ns | 72Mb 2M x 36 | Volatile | 1.2mA | 1.71V~1.89V | 2MX36 | 36 | 75497472 bit | 500MHz | 0.36A | SEPARATE | 1.71V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS25WP064A-RHLE-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24-TBGA | 6mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 1.65V | 1.95V | 64Mb 8M x 8 | Non-Volatile | 1.65V~1.95V | 8MX8 | 8 | 67108864 bit | SERIAL | 133MHz | 1.8V | FLASH | SPI - Quad I/O, QPI, DTR | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS63LV1024L-10T-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | Discontinued | 2 (1 Year) | 3.3V | 1 | Non-RoHS Compliant | 32 | 32-SOIC (0.400, 10.16mm Width) | 1 Mb | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 150mA | 1Mb 128K x 8 | Volatile | 17b | 3V~3.6V | Asynchronous | 8b | SRAM | Parallel | 10ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS61QDP2B22M36A-333M3L | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 17mm | ROHS3 Compliant | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 15mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QUADP | 1.4mm | 8542.32.00.41 | 1 | BOTTOM | 1.8V | 165 | YES | 1mm | 1.71V | Not Qualified | 1.5/1.81.8V | 1.89V | 3-STATE | 8.4ns | 72Mb 2M x 36 | Volatile | 1.2mA | 1.71V~1.89V | 2MX36 | 36 | 75497472 bit | 333MHz | 0.29A | SEPARATE | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16CVSFIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2013 | SpiFlash® | Obsolete | 3 (168 Hours) | 16 | EAR99 | 10.31mm | ROHS3 Compliant | IT ALSO OPERATES AT 2.7V TO 3.6V AT 80MHZ | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 7.49mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.64mm | 8542.32.00.51 | 1 | DUAL | 3.3V | 16 | YES | 1.27mm | R-PDSO-G16 | 3V | Not Qualified | 3/3.3V | 3.6V | 16Mb 2M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 2MX8 | 8 | 16777216 bit | 104MHz | 0.000005A | 7.5 ns | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS1225AB-150+ | Maxim Integrated | 15.9975 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2004 | yes | Active | 1 (Unlimited) | 28 | EAR99 | ROHS3 Compliant | Lead Free | 28 | 10 YEAR DATA RETENTION | 28-DIP Module (0.600, 15.24mm) | not_compliant | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8542.32.00.41 | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | DS1225A | 28 | NO | 2.54mm | 4.75V | SRAMs | Not Qualified | 5V | 5.25V | 64Kb 8K x 8 | Non-Volatile | 0.075mA | 4.75V~5.25V | 8KX8 | 8 | 65536 bit | 0.01A | 150 ns | NVSRAM | Parallel | 150ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT47H32M16CC-3E:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | Obsolete | 3 (168 Hours) | 84 | EAR99 | 1 | 12.5mm | ROHS3 Compliant | Lead Free | AUTO/SELF REFRESH | 84-TFBGA | unknown | 12mm | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | MT47H32M16 | 84 | YES | 0.8mm | R-PBGA-B84 | 1.7V | Not Qualified | 1.8V | 1.9V | 3-STATE | 450ps | 512Mb 32M x 16 | Volatile | 0.35mA | 1.7V~1.9V | 32MX16 | 16 | 536870912 bit | 333MHz | 0.007A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||||||||
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W29GL512SL9B | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Not For New Designs | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-LBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64-LFBGA (11x13) | 90ns | 512Mb 32M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 90ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7164S20DB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2007 | no | Active | 1 (Unlimited) | 28 | 125°C | -55°C | 5V | 1 | 37.2mm | RoHS Compliant | Contains Lead | No | 28 | CDIP | Parallel | 64 kb | 15.24mm | 1.65mm | CMOS | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 240 | 5V | 28 | MILITARY | NO | 2.54mm | SRAMs | 5V | 3-STATE | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 13b | 8KX8 | 0.02A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7140LA35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7025L20PFGI | Renesas Electronics America Inc. | 54.0523 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | IDT7025 | 128Kb 8K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS25LP032D-JNLE | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tube | yes | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 2.3V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 2.3V~3.6V | 4MX8 | 8 | 33554432 bit | SERIAL | 133MHz | 1 | 3V | FLASH | SPI - Quad I/O, QPI, DTR | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT40A512M8RH-062E:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR4 | 4Gb 512M x 8 | Volatile | 1.14V~1.26V | 1.6GHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S25FL032P0XMFI000M | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | FL-P | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 16 | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16-SOIC | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 5μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| S29GL256S10DHB020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | 2015 | Automotive, AEC-Q100, GL-S | Active | 3 (168 Hours) | 64 | 9mm | ROHS3 Compliant | 64 | 64-LBGA | 9mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | 2.7V | 3.6V | 100ns | 256Mb 16M x 16 | Non-Volatile | 2.7V~3.6V | 32MX8 | 8 | 268435456 bit | 3V | FLASH | Parallel | 60ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V416S12PHI | Renesas Electronics America Inc. | 4.8347 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | IDT71V416 | 44-TSOP II | 12ns | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 12ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25X80VSSIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2006 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 5.28mm | ROHS3 Compliant | Lead Free | SYNCHRONOUS MODE ALSO POSSIBLE | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | unknown | 5.28mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 2.16mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | 260 | 3V | 40 | 8 | YES | 1.27mm | S-PDSO-G8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 75 μs | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 1MX8 | 8 | 8388608 bit | 75MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
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70V7319S166BCGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2002 | yes | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 4 Mb | 166MHz | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 830mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 36b | Synchronous | 0.00004A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M27C64A-20F6 | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | Obsolete | 3 (168 Hours) | 28 | EAR99 | 5V | 37.34mm | ROHS3 Compliant | No | 28 | 28-CDIP (0.600, 15.24mm) Window | 64 kb | 4.5mm | 13.36mm | Through Hole | -40°C~85°C TA | EPROM - UV | 30mA | 8542.32.00.61 | 1 | 30mA | e3 | Matte Tin (Sn) | DUAL | 5V | M27C64 | 28 | 2.54mm | 5V | 3-STATE | 200ns | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | 8KX8 | 0.0001A | COMMON | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W632GU6MB09J | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 7.5mm | Surface Mount | -40°C~105°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.35V | YES | 0.8mm | R-PBGA-B96 | 1.283V | 1.45V | 20ns | 2Gb 128M x 16 | Volatile | 1.283V~1.45V | 128MX16 | 16 | 2147483648 bit | 1.067GHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9816G6IH-6 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2009 | Obsolete | 3 (168 Hours) | 50 | EAR99 | 3.3V | 1 | 20.95mm | ROHS3 Compliant | Tin | No | 50 | AUTO/SELF REFRESH | 50-TSOP (0.400, 10.16mm Width) | 16 Mb | Surface Mount | 0°C~70°C TA | SDRAM | 1.2mm | 8542.32.00.02 | 1 | 110mA | DUAL | 3.3V | 50 | 0.8mm | 3V | 3.6V | 3-STATE | 5ns | 16Mb 1M x 16 | Volatile | 12b | 3V~3.6V | 1MX16 | 16 | 16b | 166MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70T3519S166BF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tape & Reel (TR) | Active | 4 (72 Hours) | Non-RoHS Compliant | 208-LFBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70T3519 | 208-CABGA (15x15) | 3.6ns | 9Mb 256K x 36 | Volatile | 2.4V~2.6V | 166MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32JVSSIQ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tube | 2014 | SpiFlash® | yes | Active | 3 (168 Hours) | 8 | 3V | ROHS3 Compliant | Lead Free | 8 | 2.7V NOMINAL AVAILABLE WITH 104MHZ | 8-SOIC (0.209, 5.30mm Width) | SPI | 256 Mb | 2.16mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | W25Q32JVSSIQ | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3.3V | NOT SPECIFIED | 1.27mm | 3V | 3.6V | 85°C | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 8 | SERIAL | 133MHz | 1 | 3V | 256B | FLASH | SPI - Quad I/O | 3ms |
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