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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
24-351000-11-RC 24-351000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2007 Correct-A-Chip® 351000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant 24 SOCKET ADAPTER No SVHC Through Hole 3.175mm e4 7.62 mm IC SOCKET 0.026 0.65mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
228-1290-29-0602J 228-1290-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2000 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
248-1282-09-0602J 248-1282-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
14-354000-11-RC 14-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyester Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 Copper 3A 14 STANDARD: UL 94V-0 No SVHC Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
32-354000-10 32-354000-10 Aries Electronics 0.0000
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0.00000000 download Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder 32 Gold ROHS3 Compliant UL94 V-0 Gold 3A 32 Surface Mount 3A UL94 V-0 Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1107254-16 1107254-16 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 3A 16 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
248-1282-19-0602J 248-1282-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
800-12-6-1 800-12-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
84-652000-11-RC 84-652000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 84 ROHS3 Compliant 1A 84 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
UPD4722GS-GJG UPD4722GS-GJG 0.0000
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0.00000000 download
1107254-24 1107254-24 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free Copper SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 3A UL94 V-0 15.24 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
22-304504-18 22-304504-18 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 304504 Active 1 (Unlimited) Solder EAR99 22 Non-RoHS Compliant Lead Free 22 SOCKET ADAPTER Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
44-653000-10 44-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 44 Non-RoHS Compliant Contains Lead Tin 1A 44 UL 94V-0 1.58mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
PA-TS1D6SM18-40 PA-TS1D6SM18-40 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks 2006 Active Not Applicable Solder RoHS Compliant 40 Through Hole 0.020 0.50mm 0.125 3.18mm 0.100 2.54mm TSOP DIP
32-450001-11-RC 32-450001-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 450001 yes Active 1 (Unlimited) Solder EAR99 Gold 32 40.6mm ROHS3 Compliant Lead Free 32 SOCKET ADAPTER 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
68-304538-10 68-304538-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 304538 Active 1 (Unlimited) Solder EAR99 68 Non-RoHS Compliant Lead Free 68 SOCKET ADAPTER Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC PGA FR4 Epoxy Glass
20-350001-11-RC 20-350001-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 350000 yes Active 1 (Unlimited) Solder EAR99 GOLD (10) OVER NICKEL (100) 20 25.4mm ROHS3 Compliant Lead Free 20 SOCKET ADAPTER SOIC 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm Tin 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
264-4493-09-0602J 264-4493-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 64 150°C -55°C Female Gold Straight 6.9mm 64 100.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 64 43.2mm Through Hole -55°C~125°C Glass, Polysulfone 2.54mm 1A UL94 V-0 22.86 mm 0.070 1.78mm Gold 30.0μin 0.76μm 300.0μin 7.62μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
56-184M65 56-184M65 Aries Electronics 0.0000
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0.00000000 Obsolete 1 (Unlimited) Non-RoHS Compliant 184 QFP PGA
16-304235-10 16-304235-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 304235 Active 1 (Unlimited) Solder EAR99 Gold 16 Non-RoHS Compliant 16 STANDARD: UL 94V-0 Through Hole 105°C e0 Socket Included 1A UL94 V-0 IC SOCKET Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
240-1280-19-0602J 240-1280-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Wire Wrap 40 150°C -55°C Female Gold 32.3mm 40 65.5mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 6.9mm Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
20-301550-10 20-301550-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 301550 Active 1 (Unlimited) Solder EAR99 32 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 762μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.030 0.76mm 0.100 2.54mm SOIC PLCC FR4 Epoxy Glass
28-651000-10 28-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 28 35.6mm Non-RoHS Compliant Contains Lead 28 SOCKET ADAPTER 1.58mm Through Hole e3 1A IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-354000-11-RC 24-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2007 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant UL94 V-0 3A 24 STANDARD: UL 94V-0 Surface Mount 762μm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
20-651000-10 20-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 20 Non-RoHS Compliant 1A 20 SOCKET ADAPTER Through Hole 3.683mm e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
32-652000-10-P 32-652000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder Non-RoHS Compliant Lead Free 1A 32 PLCC Through Hole 3.175mm 1A 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
08-301296-10 08-301296-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 301296 Active 1 (Unlimited) Solder EAR99 105°C -55°C 8 Non-RoHS Compliant Lead Free Tin 8 Through Hole 3.175mm e3 1 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm SOIC JEDEC FR4 Epoxy Glass
08-354000-21-RC 08-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant UL94 V-0 3A 8 SOCKET ADAPTER, UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
95-100I25 95-100I25 Aries Electronics 0.0000
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0.00000000 download 2001 Obsolete 1 (Unlimited) Solder EAR99 Tin 100 34.3mm RoHS Compliant Lead Free Brass 100 SOCKET ADAPTER 2.39mm Through Hole 2.54 mm IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
18-35W000-11-RC 18-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 18 ROHS3 Compliant 18 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
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