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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Weight Operating Temperature Lead Length JESD-609 Code Number of Rows PCB Contact Pattern Contact Style Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
18-350000-10-HT 18-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 18 Non-RoHS Compliant 18 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
232-1285-39-0602J 232-1285-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 Gold Straight 32 RoHS Compliant Lead Free Copper Gold No 32 Through Hole -55°C~125°C 2 Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
800-3-6-1 800-3-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
44-305263-20 44-305263-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 305263 Active 1 (Unlimited) Solder EAR99 44 19.4mm Non-RoHS Compliant Lead Free 44 SOCKET ADAPTER 1.58mm Through Hole e3 IC SOCKET 0.024 0.60mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.050 1.27mm QFP PLCC FR4 Epoxy Glass
20-351000-10 20-351000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 20 Non-RoHS Compliant Contains Lead Tin 1A 20 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
LCQT-QFP0.8-32 LCQT-QFP0.8-32 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 32 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.031 0.80mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
20-354000-20 20-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 20 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 20 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
08-665000-00 08-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 8 Non-RoHS Compliant 8 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
216-3340-19-0602J 216-3340-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 16 150°C -55°C Female Gold 16 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 16 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
218-3341-09-0602J 218-3341-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 18 150°C -55°C Female Gold 18 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 18 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
14-354000-21-RC 14-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
68-652000-10 68-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 68 Non-RoHS Compliant Tin 1A 68 UL 94V-0 Through Hole 3.175mm e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
14-35W000-11-RC 14-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 14 ROHS3 Compliant 14 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
228-4817-09-0602J 228-4817-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
48-655000-10 48-655000-10 Aries Electronics 0.0000
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0.00000000 download Through Hole 2006 Correct-A-Chip® 655000 Obsolete 1 (Unlimited) Solder 48 Silver Non-RoHS Compliant Silver 48 TSOP Through Hole 3.175mm 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
16-307349-11-RC-P (170 UP) 16-307349-11-RC-P (170 UP) Aries Electronics 0.0000
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0.00000000 download 5 Weeks Correct-A-Chip® 307349 Active 1 (Unlimited) Solder Gold ROHS3 Compliant 16 Through Hole 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
24-650000-11-RC 24-650000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 650000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free 24 SOCKET ADAPTER 1.58mm Through Hole e4 IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
32-652000-11-RC 32-652000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 32 ROHS3 Compliant Lead Free 1A 32 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
20-354000-11-RC 20-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 Copper 3A 20 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
220-3342-09-0602J 220-3342-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 20 150°C -55°C Female Gold 20 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 20 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
242-1281-09-0602J 242-1281-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 42 150°C -55°C Female Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
228-4817-19-0602J 228-4817-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
240-3639-19-0602J 240-3639-19-0602J 0.0000
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0.00000000
32-655000-10-P 32-655000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 655000 Active 1 (Unlimited) Solder EAR99 Silver Non-RoHS Compliant 32 Through Hole 3.175mm IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-354000-21-RC 24-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 24 ROHS3 Compliant UL94 V-0 3A 24 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1111903 1111903 0.0000
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08-350000-10-HT 08-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks POLYAMIDE 2006 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 8 Non-RoHS Compliant 8 2.54mm Through Hole e0 2 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
1106396-24 1106396-24 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 2 RECTANGULAR RND PIN-SKT 3A UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
28-350002-11-RC 28-350002-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 28 28 35.6mm ROHS3 Compliant Lead Free Brass Gold 28 No SVHC 1.58mm Through Hole 3.81 mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
44-647-10 44-647-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Bulk 2002 647 Active 1 (Unlimited) Solder EAR99 Gold 44 69.9mm Non-RoHS Compliant Contains Lead 44 UL 94V-0 2.39mm Through Hole e4 3A IC SOCKET Tin 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Phosphor Bronze 0.180 4.57mm SOIC DIP, 0.6 (15.24mm) Row Spacing
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