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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Lead Length JESD-609 Code Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material Core Architecture
1109523 1109523 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2007 Correct-A-Chip® 1109523 Active 1 (Unlimited) Solder EAR99 Gold 8 10.2mm Non-RoHS Compliant Contains Lead 8 STANDARD: UL 94V-0 TO-8 5.85mm Through Hole e0 Socket Included 1A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing JEDEC FR4 Epoxy Glass
228-4817-09-0602J 228-4817-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
14-354W00-20 14-354W00-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant 14 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
28-354000-10 28-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 28 Non-RoHS Compliant UL94 V-0 Tin 3A 28 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
1111841 1111841 Aries Electronics 0.0000
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0.00000000 download 6 Weeks 2009 Correct-A-Chip® 1111841 Active 1 (Unlimited) Solder EAR99 10 Non-RoHS Compliant Lead Free Tin 10 UL 94V-0 Through Hole 105°C e3 2 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm MSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
24-651000-10 24-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 36 Non-RoHS Compliant 1A 24 SOCKET ADAPTER Through Hole 3.683mm e0 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
18-666000-00 18-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
1107254-32 1107254-32 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 32 ROHS3 Compliant UL94 V-0 3A 32 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
16-354000-11-RC 16-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 Lead Free Copper 3A 16 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
96-208M50 96-208M50 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 96-208M50 Active 1 (Unlimited) Solder EAR99 Tin 208 43.2mm Non-RoHS Compliant Contains Lead 208 SOCKET ADAPTER 1.58mm Through Hole IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
LCQT-QFP0.5-80 LCQT-QFP0.5-80 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 80 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
7131-108-18 7131-108-18 Aries Electronics 0.0000
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0.00000000 6 Weeks Through Hole 2013 Active 1 (Unlimited) Solder ROHS3 Compliant 8 Through Hole 3.175mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm HB2E Relay DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
220-3342-19-0602J 220-3342-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 20 150°C -55°C Female Gold 25.4mm 20 40.1mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 20 6.9mm Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
222-3343-19-0602J 222-3343-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 22 150°C -55°C Gold 22 RoHS Compliant Lead Free Copper Gold 22 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
26-665000-00 26-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder 26 Non-RoHS Compliant 26 SOIC Surface Mount 787.4μm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
20-354000-21-RC 20-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
28-653000-11-RC 28-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Box 2006 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 28 ROHS3 Compliant UL94 V-0 Lead Free 1A 28 UL 94V-0 No SVHC Through Hole 3.175mm e4 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
28-353000-10 28-353000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole RYTON 2006 Correct-A-Chip® 353000 Active 1 (Unlimited) Solder EAR99 Tin-Lead 28 Non-RoHS Compliant UL94 V-0 Lead, Tin 1A 28 Through Hole 3.175mm e3 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm 200.0μin 5.08μm Phosphor Bronze Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
16-354000-10 16-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 16 Non-RoHS Compliant UL94 V-0 Tin 3A 16 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
218-3341-09-0602J 218-3341-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 18 150°C -55°C Female Gold 18 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 18 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
800-12-6-1-3007 800-12-6-1-3007 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
84-505-110 84-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 84 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
44-647-10 44-647-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Bulk 2002 647 Active 1 (Unlimited) Solder EAR99 Gold 44 69.9mm Non-RoHS Compliant Contains Lead 44 UL 94V-0 2.39mm Through Hole e4 3A IC SOCKET Tin 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Phosphor Bronze 0.180 4.57mm SOIC DIP, 0.6 (15.24mm) Row Spacing
216-3340-19-0602J 216-3340-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 16 150°C -55°C Female Gold 16 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 16 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
14-350000-10-HT 14-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 14 Non-RoHS Compliant 14 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
800-37-6-1 800-37-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
32-653000-10 32-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2011 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 32 40.6mm Non-RoHS Compliant Contains Lead 32 UL 94V-0 6.08mm Through Hole e0 Socket Included 1A UL94 V-0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
48-655000-10 48-655000-10 Aries Electronics 0.0000
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0.00000000 download Through Hole 2006 Correct-A-Chip® 655000 Obsolete 1 (Unlimited) Solder 48 Silver Non-RoHS Compliant Silver 48 TSOP Through Hole 3.175mm 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
MIKROE-230 MIKROE-230 MikroElektronika 0.0000
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0.00000000 4 Weeks Socket Active 1 (Unlimited) Non-RoHS Compliant 40 AT90PWM1 DIP AVR
28-665000-00 28-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 28 Non-RoHS Compliant 28 SOCKET ADAPTER Surface Mount 787.4μm e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
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