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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Number of Rows PCB Contact Pattern Contact Style Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
1106396-24 1106396-24 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder 24 EAR99 Gold 24 30.5mm ROHS3 Compliant Lead Free SOCKET ADAPTER No SVHC 2.54mm 2.29mm Through Hole e3 2 RECTANGULAR RND PIN-SKT 3A UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
14-354000-21-RC 14-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
240-3639-19-0602J 240-3639-19-0602J 0.0000
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08-350000-10-HT 08-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks POLYAMIDE 2006 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 8 Non-RoHS Compliant 8 2.54mm Through Hole e0 2 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
14-354W00-20 14-354W00-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant 14 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
14-35W000-11-RC 14-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 14 ROHS3 Compliant 14 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
16-35W000-11-RC 16-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2008 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 16 ROHS3 Compliant Lead Free 16 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
12-350000-10-HT 12-350000-10-HT Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 12 Tin Non-RoHS Compliant Tin 12 SOIC Through Hole 3.175mm High Temperature 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
232-1285-29-0602J 232-1285-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold 32 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 32 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
20-354000-21-RC 20-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
220-3342-19-0602J 220-3342-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 20 150°C -55°C Female Gold 25.4mm 20 40.1mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 20 6.9mm Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
32-655000-10-P 32-655000-10-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 655000 Active 1 (Unlimited) Solder EAR99 Silver Non-RoHS Compliant 32 Through Hole 3.175mm IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm TSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
16-651000-10 16-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 16 Non-RoHS Compliant 1A 16 SOCKET ADAPTER Through Hole 3.683mm e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
84-505-110 84-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 84 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
97-AQ132D 97-AQ132D Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 97-AQ132D Active 1 (Unlimited) Solder EAR99 Gold 132 34.3mm Non-RoHS Compliant Lead Free Tin 132 SOCKET ADAPTER 1.27mm 1.58mm Through Hole e0 1 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm PQFP PGA FR4 Epoxy Glass
228-4817-09-0602J 228-4817-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
14-354W00-10 14-354W00-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 14 17.8mm ROHS3 Compliant Lead Free 14 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
97-56001 97-56001 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 97-56001 Active 1 (Unlimited) Solder 144 Gold 132 Non-RoHS Compliant Contains Lead 169 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
08-665000-00 08-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 8 Non-RoHS Compliant 8 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
160-306045-10 160-306045-10 Aries Electronics 0.0000
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0.00000000 2018 Active 1 (Unlimited) 160 EAR99 160 ROHS3 Compliant IC SOCKET
32-653000-10 32-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2011 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 32 40.6mm Non-RoHS Compliant Contains Lead 32 UL 94V-0 6.08mm Through Hole e0 Socket Included 1A UL94 V-0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
PA-SOD6SM18-44 PA-SOD6SM18-44 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks Active Not Applicable Solder RoHS Compliant 44 Through Hole 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOIC DIP
68-653000-11-RC 68-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 68 ROHS3 Compliant UL94 V-0 1A 68 UL 94V-0 Through Hole 3.175mm e4 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
16-307349-11-RC-P (170 UP) 16-307349-11-RC-P (170 UP) Aries Electronics 0.0000
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0.00000000 download 5 Weeks Correct-A-Chip® 307349 Active 1 (Unlimited) Solder Gold ROHS3 Compliant 16 Through Hole 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
240-3639-09-0602J 240-3639-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 40 150°C -55°C Female Gold Straight 40 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 Through Hole -55°C~125°C Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 25.4 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 1.0 (25.40mm) Row Spacing DIP, 1.0 (25.40mm) Row Spacing
800-27-6-1 800-27-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
248-1282-39-0602J 248-1282-39-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2009 Textool™ Active 1 (Unlimited) Wire Wrap 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
PA-SOD6SM18-40 PA-SOD6SM18-40 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks Active Not Applicable Solder RoHS Compliant 40 Through Hole 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing
28-505-111 28-505-111 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 GOLD (10) 28 Non-RoHS Compliant 28 SOCKET ADAPTER Through Hole 3.81mm e4 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
20-354000-11-RC 20-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 Copper 3A 20 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
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