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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
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Items : %s%s

IC Adapters

Additional Feature

  • ADAPTER
  • SOCKET ADAPTER
  • SOCKET ADAPTER, 94V-0
  • SOCKET ADAPTER, UL 94V-0
  • STANDARD: UL 94V-0
  • UL 94V-0

Board Material

  • FR4 Epoxy Glass
  • Polyimide (PI)

Body Breadth

  • 0.7 inch

Body Depth

  • 0.3 inch

Body Material

  • Glass, Polysulfone

Cable Length

  • 3m

Connector Type

  • DIP, Socket

Contact Finish - Mating

  • GOLD
  • GOLD (10)
  • GOLD (10) OVER NICKEL (100)
  • NOT SPECIFIED
  • Silver
  • TIN
  • TIN LEAD
  • Tin-Lead

Contact Finish - Post

  • Gold
  • Tin
  • Tin-Lead

Contact Finish Thickness - Post

  • Flash

Contact Material

  • Brass
  • Copper

Contact Material - Mating

  • Beryllium Copper
  • Brass
  • Copper
  • Phosphor Bronze

Contact Material - Post

  • Beryllium Copper
  • Brass
  • Brass Alloy
  • Phosphor Bronze

Contact Plating

  • Gold
  • Gold, Tin
  • Lead, Tin
  • Silver
  • Tin

Contact Style

  • RND PIN-SKT

Convert From (Adapter End)

  • AT90PWM1
  • AT90PWM2
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • HB2E Relay
  • MSOP
  • Multiple Packages
  • PLCC
  • PQFP
  • QFP
  • SIP
  • Socket, 0.6 (15.24mm) Row Spacing
  • SOIC
  • SOIC-W
  • SOJ
  • SSOP
  • TQFP
  • TSOP
  • VQFP

Convert To (Adapter End)

  • DIP
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • JEDEC
  • PGA
  • PLCC
  • QFP
  • SOIC
  • SOWIC

Core Architecture

  • AVR

Current Rating

  • 1A
  • 3A

Current Rating (Amps)

  • 1A
  • 3A

Depth

  • 25.4mm
  • 32.3mm
  • 32mm
  • 43.2mm
  • 6.9mm

Device Socket Type

  • IC SOCKET

ECCN Code

  • EAR99

Factory Lead Time

  • 16 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks

Feature

  • Closed Frame
  • High Temperature
  • Socket Included

Flammability Rating

  • UL94 V-0

Gender

  • Female

Height

  • 1.58mm
  • 2.29mm
  • 2.39mm
  • 5.85mm
  • 6.08mm
  • 6.9mm

Housing Material

  • Polyamide
  • Polyamide (PA46), Nylon 4/6, Glass Filled
  • Polyester
  • Polyphenylene Sulfide (PPS)
  • Polysulfone (PSU), Glass Filled
  • RYTON

Insulation Resistance

  • 1GOhm

JESD-609 Code

  • e0
  • e3
  • e4

Lead Free

  • Contains Lead
  • Lead Free

Lead Length

  • 2.032mm
  • 2.286mm
  • 3.175mm
  • 3.302mm
  • 3.683mm
  • 3.81mm
  • 3m
  • 5.9944mm

Lead Pitch

  • 1.27mm
  • 2.54mm

Length

  • 10.2mm
  • 100.3mm
  • 17.8mm
  • 19.4mm
  • 20.3mm
  • 22.2mm
  • 22.9mm
  • 25.4mm
  • 30.5mm
  • 34.3mm
  • 35.6mm
  • 39.4mm
  • 3m
  • 40.1mm
  • 40.5mm
  • 40.6mm
  • 43.2mm
  • 45mm
  • 50.3mm
  • 55.2mm
  • 65.5mm
  • 68.1mm
  • 69.9mm
  • 72.5mm
  • 95.7mm

Material

  • Glass, Polyester, Thermoplastic
  • Polyester

Material Flammability Rating

  • UL94 V-0

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • Not Applicable

Mount

  • Socket
  • Surface Mount
  • Through Hole
  • Through Hole, Wire
  • Wire

Mounting Type

  • Surface Mount
  • Through Hole

Number of Contacts

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 200
  • 208
  • 22
  • 24
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Pins

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 169
  • 18
  • 184
  • 20
  • 208
  • 22
  • 24
  • 26
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 60
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Positions

  • 10
  • 12
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 22
  • 24
  • 26
  • 28
  • 32
  • 40
  • 42
  • 48
  • 56
  • 64
  • 90
  • 95

Number of Rows

  • 1
  • 2

Orientation

  • Straight

Package / Case

  • PLCC
  • QFP
  • SOIC
  • TO-8
  • TSOP

Packaging

  • Box
  • Bulk

Part Status

  • Active
  • Obsolete

Pbfree Code

  • no
  • yes

PCB Contact Pattern

  • RECTANGULAR

PCB Contact Row Spacing

  • 0.3 mm
  • 0.6 mm

Pitch

  • 1.778mm
  • 1.78mm
  • 2.54mm

Pitch - Mating

  • 0.020 0.50mm
  • 0.024 0.60mm
  • 0.025 0.64mm
  • 0.026 0.65mm
  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Pitch - Post

  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Published

  • 2000
  • 2001
  • 2002
  • 2003
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2017
  • 2018

Radiation Hardening

  • No

REACH SVHC

  • No SVHC

RoHS Status

  • Non-RoHS Compliant
  • RoHS Compliant
  • ROHS3 Compliant

Row Spacing

  • 10.16 mm
  • 15.24 mm
  • 2.54 mm
  • 20.32 mm
  • 22.86 mm
  • 25.4 mm
  • 3.81 mm
  • 7.62 mm

Sensing Distance

  • 3 m

Series

  • 647
  • DS9075

Termination

  • Solder
  • Wire Wrap

Termination Post Length

  • 0.030 0.76mm
  • 0.031 0.80mm
  • 0.080 2.03mm
  • 0.089 2.28mm
  • 0.090 2.29mm
  • 0.125 3.18mm
  • 0.130 3.30mm
  • 0.145 3.68mm
  • 0.150 3.81mm
  • 0.180 4.57mm
  • 0.236 6.00mm
  • 0.620 15.75mm

Voltage - Rated

  • 1kV

Weight

  • 453.59237g
  • 680.388555g

Width

  • 24.4mm
  • 27.9mm
  • 32.3mm
  • 32mm
  • 38.5mm
  • 43.2mm
  • 6.9mm
Reset
Apply
    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
    14-354W00-10 14-354W00-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2005 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 14 17.8mm ROHS3 Compliant Lead Free 14 STANDARD: UL 94V-0 1.58mm Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
    20-35W000-10 20-35W000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder 20 25.4mm Non-RoHS Compliant Lead Free 20 SOIC 1.58mm Through Hole 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    18-666000-00 18-666000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 18 Non-RoHS Compliant 18 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
    160-306045-10 160-306045-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 2018 Active 1 (Unlimited) 160 EAR99 160 ROHS3 Compliant IC SOCKET
    222-3343-19-0602J 222-3343-19-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 22 150°C -55°C Gold 22 RoHS Compliant Lead Free Copper Gold 22 Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
    PA-SOD6SM18-40 PA-SOD6SM18-40 Logical Systems Inc. 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 7 Weeks Active Not Applicable Solder RoHS Compliant 40 Through Hole 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing
    28-353000-10 28-353000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole RYTON 2006 Correct-A-Chip® 353000 Active 1 (Unlimited) Solder EAR99 Tin-Lead 28 Non-RoHS Compliant UL94 V-0 Lead, Tin 1A 28 Through Hole 3.175mm e3 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm 200.0μin 5.08μm Phosphor Bronze Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    220-3342-19-0602J 220-3342-19-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 20 150°C -55°C Female Gold 25.4mm 20 40.1mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 20 6.9mm Through Hole 453.59237g -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    14-350000-10-HT 14-350000-10-HT Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 14 Non-RoHS Compliant 14 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
    1111841-8 1111841-8 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole 2006 Correct-A-Chip® 1111841 Active 1 (Unlimited) Solder EAR99 105°C -55°C 8 Non-RoHS Compliant Tin 8 UL 94V-0 Through Hole 3.175mm e0 2 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm MSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    32-653000-10 32-653000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2011 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 32 40.6mm Non-RoHS Compliant Contains Lead 32 UL 94V-0 6.08mm Through Hole e0 Socket Included 1A UL94 V-0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    28-665000-00 28-665000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 28 Non-RoHS Compliant 28 SOCKET ADAPTER Surface Mount 787.4μm e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
    16-350000-10-HT 16-350000-10-HT Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 16 EAR99 Tin Straight 16 Non-RoHS Compliant SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
    LCQT-QFP0.8-80 LCQT-QFP0.8-80 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000
    1109523 1109523 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2007 Correct-A-Chip® 1109523 Active 1 (Unlimited) Solder EAR99 Gold 8 10.2mm Non-RoHS Compliant Contains Lead 8 STANDARD: UL 94V-0 TO-8 5.85mm Through Hole e0 Socket Included 1A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing JEDEC FR4 Epoxy Glass
    68-505-110-RC 68-505-110-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2013 Correct-A-Chip® 505 Active 1 (Unlimited) Solder ROHS3 Compliant 68 PLCC Through Hole 3.81mm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
    1111841 1111841 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks 2009 Correct-A-Chip® 1111841 Active 1 (Unlimited) Solder EAR99 10 Non-RoHS Compliant Lead Free Tin 10 UL 94V-0 Through Hole 105°C e3 2 IC SOCKET 0.020 0.50mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm MSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    32-450001-10 32-450001-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 450001 Active 1 (Unlimited) Solder EAR99 105°C -55°C 32 Non-RoHS Compliant Contains Lead Brass Tin 32 SOCKET ADAPTER SOIC 1.58mm Through Hole e0 2 10.16 mm IC SOCKET 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
    248-1282-39-0602J 248-1282-39-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2009 Textool™ Active 1 (Unlimited) Wire Wrap 48 150°C -55°C Female Gold 48 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 48 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    7131-108-18 7131-108-18 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 6 Weeks Through Hole 2013 Active 1 (Unlimited) Solder ROHS3 Compliant 8 Through Hole 3.175mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm HB2E Relay DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    68-653000-11-RC 68-653000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 68 ROHS3 Compliant UL94 V-0 1A 68 UL 94V-0 Through Hole 3.175mm e4 Socket Included UL94 V-0 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    16-651000-10 16-651000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 16 Non-RoHS Compliant 1A 16 SOCKET ADAPTER Through Hole 3.683mm e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    1106396-36 1106396-36 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 36 ROHS3 Compliant UL94 V-0 3A 36 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    20-350000-10-HT 20-350000-10-HT Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole POLYAMIDE 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder EAR99 Tin 20 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 3.175mm High Temperature IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
    800-12-6-1-3007 800-12-6-1-3007 TE Connectivity Deutsch Connectors 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 16 Weeks Active 1 (Unlimited)
    16-354000-10 16-354000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 16 Non-RoHS Compliant UL94 V-0 Tin 3A 16 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    12-350000-10-HT 12-350000-10-HT Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole 2005 Correct-A-Chip® 350000 Active 1 (Unlimited) Solder 12 Tin Non-RoHS Compliant Tin 12 SOIC Through Hole 3.175mm High Temperature 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.3 (7.62mm) Row Spacing Polyimide (PI)
    1107254-32 1107254-32 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 32 ROHS3 Compliant UL94 V-0 3A 32 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    24-651000-10 24-651000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 36 Non-RoHS Compliant 1A 24 SOCKET ADAPTER Through Hole 3.683mm e0 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    32-650000-11-RC 32-650000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2008 Correct-A-Chip® 650000 yes Active 1 (Unlimited) Solder 32 EAR99 Gold 32 40.6mm ROHS3 Compliant Lead Free SOCKET ADAPTER SOIC No SVHC 2.54mm 1.58mm Through Hole e4 15.24 mm IC SOCKET 0.050 1.27mm 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOJ DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
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    Free delivery to United Kingdom on orders of £33 or more. A delivery charge of £12 will be billed on all orders less than £33.

    Incoterms Incoterms

    DDP (Duty and customs paid by HK JDW)

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    Credit account for qualified institutions and businesses

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    Average Time to Ship 1-3 Days, extra ship charges may apply. Please see product page, cart, and checkout for actual ship speed.

    Incoterms: CPT (Duty, customs, and applicable VAT/Tax due at time of delivery)

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