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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Package / Case Interface Max Supply Voltage Reach Compliance Code Min Supply Voltage Density Frequency Width Mounting Type Operating Temperature Technology Operating Supply Current Operating Mode Height Seated (Max) Number of Functions Nominal Supply Current Max Frequency JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch Supply Voltage-Min (Vsup) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Supplier Device Package Output Characteristics Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Access Time (Max) Programmable Type Write Cycle Time-Max (tWC) I/O Type Programming Voltage Data Polling Toggle Bit Command User Interface Number of Sectors/Size Page Size Ready/Busy Common Flash Interface
    AT17F16A-30CU AT17F16A-30CU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 17 Weeks Surface Mount Tube 1997 yes Active 3 (168 Hours) 8 3.3V 5.99mm ROHS3 Compliant Lead Free Gold No 8 8-TDFN 2-Wire, Serial 16 Mb 10MHz 5.99mm Surface Mount -40°C~85°C CMOS 1.14mm 1 50mA e4 DUAL 260 3.3V 40 AT17F16A 1.27mm 2.97V 3.63V 2.97V~3.63V 16MX1 1 CONFIGURATION MEMORY FLASH 0.03ms
    AT17LV65-10CC AT17LV65-10CC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1997 Active 3 (168 Hours) 70°C 0°C Non-RoHS Compliant Contains Lead 8 8-TDFN 5.5V 4.5V Surface Mount 0°C~70°C 5mA 12.5MHz AT17LV65 8-LAP (6x6) 64kb EEPROM 3V~3.6V 4.75V~5.25V Serial EEPROM
    AT17F080A-30QC AT17F080A-30QC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1997 Obsolete 3 (168 Hours) 70°C 0°C Non-RoHS Compliant Contains Lead 32 32-TQFP 3.63V 2.97V 10MHz Surface Mount 0°C~70°C 50mA AT17F080A 32-TQFP (7x7) 8Mb 2.97V~3.63V FLASH
    AT17N256-10NC AT17N256-10NC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1997 Obsolete 1 (Unlimited) Non-RoHS Compliant 8-SOIC (0.154, 3.90mm Width) Surface Mount 0°C~70°C AT17N256 8-SOIC 256Kb 3V~3.6V Serial EEPROM
    XCF128XFT64C XCF128XFT64C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Surface Mount Tray 2007 no Active 3 (168 Hours) 64 EAR99 13mm Non-RoHS Compliant Lead, Tin No 64 64-TBGA 10mm Surface Mount -40°C~85°C CMOS 1.2mm 1 e0 Tin/Lead (Sn63Pb37) BOTTOM BALL 225 1.8V 30 XCF128X 64 1mm 1.7V Flash Memories 1.81.8/3.3V 2V 128Mb 0.053mA 1.7V~2V 8MX16 16 134217728 bit FLASH PARALLEL 0.000075A 85 ns In System Programmable 1.8V NO NO YES 4127 4words YES YES
    XC17S20PD8C XC17S20PD8C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1999 no Obsolete Not Applicable 8 EAR99 9.3599mm Non-RoHS Compliant Contains Lead 8 8-DIP (0.300, 7.62mm) not_compliant 7.62mm Through Hole 0°C~70°C CMOS SYNCHRONOUS 4.5974mm 1 e0 DUAL 225 5V 30 XC17S20 8 NO 2.54mm 4.75V Not Qualified 5V 5.25V 3-STATE 200kb 0.01mA 4.75V~5.25V 1 MEMORY CIRCUIT 10MHz 0.00005A OTP COMMON
    AT17C512-10JC AT17C512-10JC Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1997 Obsolete 2 (1 Year) Non-RoHS Compliant 20-LCC (J-Lead) Surface Mount 0°C~70°C AT17C512 20-PLCC (9x9) 512kb 4.75V~5.25V Serial EEPROM
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