Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Organization | Memory Width | Memory Density | Sync/Async | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
7015L35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 72 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 9kB | RAM, SDR, SRAM | 26b | 8KX9 | Asynchronous | 0.005A | 9b | COMMON | ||||||||||||||||||||||||
.png "7025S55GB") |
7025S55GB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Through Hole | 2012 | Active | 125°C | -55°C | 5V | 2 | 27.94mm | RoHS Compliant | Contains Lead | No | 84 | Parallel | 5.5V | 4.5V | 128 kb | 27.94mm | 3.68mm | 300mA | 55 ns | RAM, SRAM | 26b | Asynchronous | 16b | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
7024S55JI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Rail/Tube | 2000 | no | Active | 1 (Unlimited) | 84 | EAR99 | 85°C | -40°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | BATTERY BACKUP OPERATION | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 29.21mm | 3.63mm | CMOS | 4.57mm | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 55 ns | 8kB | RAM, SDR, SRAM | 24b | 4KX16 | Asynchronous | 0.03A | 16b | COMMON | |||||||||||||||||||||||
 |
7134LA25JI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 3 (168 Hours) | 52 | EAR99 | 85°C | -40°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 25 ns | 4kB | RAM, SDR, SRAM | 24b | 4KX8 | Asynchronous | 0.004A | 8b | COMMON | 2V | ||||||||||||||||||||||||
 |
70V659S10BFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | yes | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Lead Free | No | 208 | Parallel | 3.45V | 3.15V | 4.5 Mb | 15mm | 1.4mm | CMOS | 1 | 500mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 10 ns | 512kB | RAM, SDR, SRAM | 34b | Asynchronous | 0.015A | 36b | COMMON | |||||||||||||||||||||||||||
 |
IDT71V424L12PH8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 44 | 3A991.B.2.A | 70°C | 0°C | 18.41mm | Non-RoHS Compliant | TSOP | Parallel | not_compliant | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 20 | 44 | COMMERCIAL | YES | 0.8mm | R-PDSO-G44 | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.155mA | 512KX8 | 8 | 4194304 bit | 0.01A | 12 ns | COMMON | 3V | |||||||||||||||||||||||||||||
 |
71T75802S150BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2012 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 2.5V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 150MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 215mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.8 ns | 150MHz | 2.3MB | RAM, SDR, SRAM | 20b | Synchronous | 0.04A | 18b | COMMON | 2.38V | ||||||||||||||||||||||||
 |
IDT71V432S8PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | no | 3 (168 Hours) | 100 | 3A991.B.2.B | 70°C | 0°C | 1 | 20mm | Non-RoHS Compliant | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | Not Qualified | 3.63V | 3-STATE | RAM, SRAM | 32KX32 | 32 | 1048576 bit | 8 ns | YES | |||||||||||||||||||||||||||||||||
 |
70914S15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; SELF TIMED WRITE | TQFP | Parallel | 5.5V | 4.5V | 36 kb | 50MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 15 ns | 4.5kB | RAM, SDR, SRAM | 24b | 4KX9 | Synchronous | 0.015A | 9b | COMMON | |||||||||||||||||||||
 |
70V9369L12PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 288 kb | 33.3MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 205mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 12 ns | 83MHz | 36kB | RAM, SDR, SRAM | 28b | 16KX18 | Synchronous | 0.005A | 18b | COMMON | 3V | |||||||||||||||||||||
 |
71V67603S150BGGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2009 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 2.15mm | 22mm | 2.15mm | CMOS | 325mA | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | YES | SRAMs | 3-STATE | 3.8 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | 0.07A | COMMON | |||||||||||||||||||||||||
|
7006S45J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; ARBITER; SEMAPHORE | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 24mm | 3.63mm | CMOS | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 45 ns | 16kB | RAM, SDR, SRAM | 28b | 0.34mA | 16KX8 | Asynchronous | 0.015A | 8b | COMMON | |||||||||||||||||||||||||
 |
71V67903S75PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2004 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | FLOW-THROUGH ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 117MHz | 14mm | 1.4mm | CMOS | 1 | 285mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 7.5 ns | 117MHz | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.07A | 18b | COMMON | ||||||||||||||||||||||||
 |
70V657S12BCI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2004 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 3.45V | 3.15V | 1.1 Mb | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 515mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.015A | 36b | COMMON | ||||||||||||||||||||||||||||
 |
IDT71V2559S80PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 70°C | 0°C | RoHS Compliant | LQFP | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70P255L65BYGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel | 2008 | yes | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 2 | RoHS Compliant | No | 100 | TFBGA | Parallel | 3V | 1.8V | 128 kb | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.8V | 30 | 100 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | 65 ns | 16kB | RAM, SDR, SRAM | 26b | 0.07mA | 8KX16 | 16 | 0.000008A | COMMON | |||||||||||||||||||||||||||||||
 |
70V3389S4PRF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | TQFP | Parallel | 3.45V | 3.15V | 1.1 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1 | 460mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 4.2 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX18 | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||
|
7133SA25J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | Active | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 24mm | 3.63mm | 300mA | 25 ns | 4kB | RAM, SDR, SRAM | 22b | Asynchronous | 16b | ||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT709389L9PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 2 | 14mm | Non-RoHS Compliant | FLOW-THROUGH OR PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | YES | 0.5mm | S-PQFP-G100 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM | 0.4mA | 64KX18 | 18 | 1179648 bit | 66MHz | 0.003A | 20 ns | COMMON | 4.5V | ||||||||||||||||||||||||||
 |
IDT71V35761SA200BQI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 85°C | -40°C | Non-RoHS Compliant | 165 | Parallel | 200MHz | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7015S12PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | yes | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 325mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 80 | COMMERCIAL | 0.65mm | SRAMs | Not Qualified | 5V | 3-STATE | 12 ns | 9kB | RAM, SDR, SRAM | 26b | 8KX9 | Asynchronous | 0.015A | 9b | COMMON | ||||||||||||||||||||||
 |
IDT71V124SA10Y8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 32 | 3A991.B.2.B | 70°C | 0°C | 20.955mm | Non-RoHS Compliant | 32 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 32 | COMMERCIAL | YES | 1.27mm | 3.15V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.145mA | 128KX8 | 8 | 1048576 bit | 0.01A | 10 ns | COMMON | 3.15V | |||||||||||||||||||||||||||||||
 |
70261L15PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | SEMAPHORE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 285mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Asynchronous | 0.005A | 16b | COMMON | ||||||||||||||||||||||
 |
70T3339S133BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||
 |
70V9089L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 512 kb | 28.5MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 185mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 30 ns | RAM, SRAM | 32b | 64KX8 | Synchronous | 0.003A | 8b | COMMON | 3V | ||||||||||||||||||||||
|
7133SA45G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Bulk | 2013 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 29.46mm | RoHS Compliant | Contains Lead | No | 68 | Parallel | 5.5V | 4.5V | 32 kb | 29.46mm | 3.68mm | CMOS | 1 | 290mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 45 ns | 4kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.015A | 16b | COMMON | 2V | ||||||||||||||||||||||||||
 |
IDT71V416L15PH8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape and Reel | 2007 | no | 3 (168 Hours) | 44 | 70°C | 0°C | 3.3V | 1 | Non-RoHS Compliant | 44 | TSOP | Parallel | 3.6V | not_compliant | 3V | 4 Mb | CMOS | 1 | 160mA | e0 | DUAL | GULL WING | 225 | 3.3V | 20 | 44 | COMMERCIAL | 0.8mm | SRAMs | Not Qualified | 3-STATE | 15 ns | RAM, SRAM - Asynchronous | 18b | 16 | Asynchronous | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||
 |
7025L55J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 84 | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 29.21mm | 3.63mm | CMOS | 4.57mm | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | ||||||||||||||||||||||||
 |
70V631S15PRF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | TQFP | Parallel | 3.45V | 3.15V | 4.5 Mb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 440mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 18b | Asynchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||
|
7005S35JI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2005 | no | Active | 3 (168 Hours) | 68 | EAR99 | 85°C | -40°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 24mm | 3.63mm | CMOS | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | INDUSTRIAL | YES | SRAMs | 5V | 3-STATE | 35 ns | 8kB | RAM, SDR, SRAM | 26b | 0.3mA | 8KX8 | 0.03A | COMMON |
-
7015L35J8 Integrated Device Technology (IDT)
5V V Surface Mount 68 Pin Memory IC 72 kb kb 24mm mm 210mA mA 9b b
Price: 0.0000
RFQ -
7025S55GB Integrated Device Technology (IDT)
Through Hole Memory IC 128 kb kb 27.94mm mm 300mA mA 16b b
Price: 0.0000
RFQ -
7024S55JI Integrated Device Technology (IDT)
5V V Surface Mount 84 Pin Memory IC 64 kb kb 29.21mm mm 300mA mA 16b b
Price: 0.0000
RFQ -
7134LA25JI Integrated Device Technology (IDT)
5V V Surface Mount 52 Pin Memory IC 32 kb kb 19mm mm 260mA mA 8b b
Price: 0.0000
RFQ -
70V659S10BFG Integrated Device Technology (IDT)
Surface Mount 208 Pin Memory IC 4.5 Mb kb 15mm mm 500mA mA 36b b
Price: 0.0000
RFQ -
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