Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Organization | Memory Width | Memory Density | Sync/Async | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
IDT71V2558S200PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 200MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.4mA | 256KX18 | 18 | 4718592 bit | 0.04A | 3.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
IDT6116LA45SO8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 1 | 15.4mm | Non-RoHS Compliant | SOIC | Parallel | not_compliant | 7.5mm | CMOS | 2.65mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 225 | 5V | 30 | 24 | COMMERCIAL | YES | 1.27mm | R-PDSO-G24 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.075mA | 2KX8 | 8 | 16384 bit | 0.00002A | 45 ns | YES | COMMON | 2V | |||||||||||||||||||||||||||
 |
71V3556SA150BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2015 | yes | Active | 3 (168 Hours) | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 4.5 Mb | 150MHz | 22mm | 2.15mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 119 | RAM, SRAM | 17b | ||||||||||||||||||||||||||||||||||||||||||||||
 |
7034L20PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | Active | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | 320mA | 20 ns | 9kB | RAM, SDR, SRAM | 12b | Asynchronous | 18b | |||||||||||||||||||||||||||||||||||||||||||||
 |
7026L35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 256 kb | 29.21mm | 3.63mm | 255mA | 84 | 35 ns | 32kB | RAM, SDR, SRAM | 14b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||
 |
71V65703S85BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | Parallel | 9 Mb | 13mm | 1.2mm | CMOS | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | YES | SRAMs | 3-STATE | RAM, SRAM | 18b | 0.225mA | 256KX36 | 90MHz | 0.04A | 8.5 ns | COMMON | ||||||||||||||||||||||||||||||||
 |
IDT71V3577SA75BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | Non-RoHS Compliant | 165 | FLOW-THROUGH ARCHITECTURE | Parallel | not_compliant | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.255mA | 128KX36 | 36 | 4718592 bit | 117MHz | 0.03A | 7.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
 |
IDT6116LA35TP | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 24 | EAR99 | 70°C | 0°C | 1 | 31.75mm | Non-RoHS Compliant | DIP | Parallel | not_compliant | 7.62mm | CMOS | 4.191mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | THROUGH-HOLE | 225 | 5V | 30 | 24 | COMMERCIAL | NO | 2.54mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.095mA | 2KX8 | 8 | 16384 bit | 0.00002A | 35 ns | YES | COMMON | 2V | ||||||||||||||||||||||||||||||
 |
71V35761SA183BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 183MHz | 22mm | 2.15mm | CMOS | 1 | 340mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.3 ns | 183MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.035A | 36b | COMMON | |||||||||||||||||||||||||
 |
IDT709389L7PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 2 | 14mm | Non-RoHS Compliant | FLOW-THROUGH OR PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | YES | 0.5mm | S-PQFP-G100 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM | 0.465mA | 64KX18 | 18 | 1179648 bit | 83MHz | 0.003A | 18 ns | COMMON | 4.5V | ||||||||||||||||||||||||||
 |
IDT71V546XS133PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 70°C | 0°C | Non-RoHS Compliant | LQFP | Parallel | 133MHz | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416VS15PHGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | yes | 3 (168 Hours) | 44 | 3A991.B.2.A | 85°C | -40°C | 18.41mm | RoHS Compliant | TSOP | Parallel | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 30 | 44 | INDUSTRIAL | YES | 0.8mm | R-PDSO-G44 | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.17mA | 256KX16 | 16 | 4194304 bit | 0.02A | 15 ns | COMMON | 3V | ||||||||||||||||||||||||||||||
 |
IDT71V2559S75BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.275mA | 256KX18 | 18 | 4718592 bit | 100MHz | 0.04A | 7.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||
.png "70P269L65BYGI8") |
70P269L65BYGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel | 2008 | yes | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 2 | RoHS Compliant | No | 100 | TFBGA | Parallel | 3V | 1.8V | 256 kb | CMOS | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 1.8V | 30 | 100 | INDUSTRIAL | YES | 65 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | 16 | ||||||||||||||||||||||||||||||||||||||
 |
IDT71T75602S100PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape and Reel | 2015 | 3 (168 Hours) | 100 | 70°C | 0°C | 2.5V | 1 | 20mm | RoHS Compliant | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | unknown | 2.375V | 18 Mb | 100MHz | CMOS | 1 | 175mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 2.5V | 100 | COMMERCIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 5 ns | RAM, SRAM | 19b | 36 | Synchronous | 0.04A | 36b | COMMON | 2.38V | ||||||||||||||||||||||||||||||
 |
7025S55J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 84 | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 29.21mm | 3.63mm | CMOS | 4.57mm | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 0.015A | 16b | COMMON | |||||||||||||||||||||||||
 |
70T653MS12BCI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 2.5V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 2.6V | 2.4V | 18 Mb | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 790mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 12 ns | 2.3MB | RAM, SDR, SRAM | 38b | Asynchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||||
 |
IDT71V65903S85PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.225mA | 512KX18 | 18 | 9437184 bit | 90MHz | 0.04A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
IDT71V65802S133BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 70°C | 0°C | Non-RoHS Compliant | 165 | Parallel | 133MHz | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7134LA25JGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 52 | EAR99 | 85°C | -40°C | 5V | 2 | 19mm | RoHS Compliant | Lead Free | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 260mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | 52 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 25 ns | 4kB | RAM, SDR, SRAM | 24b | 4KX8 | Asynchronous | 0.004A | 8b | COMMON | 2V | ||||||||||||||||||||||||
 |
70V631S10BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | Parallel | 3.45V | 3.15V | 4.5 Mb | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 500mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 10 ns | RAM, SRAM | 36b | Asynchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||
 |
70V05L35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2006 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 3.6V | 3V | 64 kb | 24mm | 3.63mm | CMOS | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | YES | SRAMs | 3-STATE | 35 ns | 8kB | RAM, SDR, SRAM | 26b | 0.155mA | 8KX8 | COMMON | 3V | ||||||||||||||||||||||||||||
 |
IDT71V25761S166PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 166MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.32mA | 128KX36 | 36 | 4718592 bit | 0.03A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
71T75802S200PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2012 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 200MHz | 14mm | 1.4mm | CMOS | 1 | 295mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 3.2 ns | 200MHz | 2.3MB | RAM, SDR, SRAM | 20b | Synchronous | 18b | COMMON | 2.38V | ||||||||||||||||||||||||
 |
70121S55J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 18 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 55 ns | 2.3kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.015A | 9b | COMMON | 2V | |||||||||||||||||||||||||
 |
70V3389S6BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 1.1 Mb | 83.3MHz | 1.4mm | 15mm | 1.4mm | CMOS | 310mA | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 6 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX18 | Synchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||
|
7130SA100CB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Through Hole | Bulk | 2013 | Active | 125°C | -55°C | 5V | 2 | 61.72mm | RoHS Compliant | Contains Lead | No | 48 | DIP | Parallel | 5.5V | 4.5V | 8 kb | 15.24mm | 3.3mm | 190mA | 100 ns | RAM, SRAM | 20b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||
 |
70V261L25PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 185mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Asynchronous | 0.003A | 16b | COMMON | 3V | ||||||||||||||||||||||
 |
71V3558S100PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 14mm | 1.4mm | CMOS | 1 | 250mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 5 ns | 100MHz | 512kB | RAM, SDR, SRAM | 18b | Synchronous | 0.04A | 18b | COMMON | |||||||||||||||||||||||||
 |
71T75802S200PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 200MHz | 14mm | 1.4mm | CMOS | 1 | 275mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 3.2 ns | RAM, SRAM | 20b | Synchronous | 0.04A | 18b | COMMON | 2.38V |
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IDT71V2558S200PF8 Integrated Device Technology (IDT)
2.53.3V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
-
71V3556SA150BGG8 Integrated Device Technology (IDT)
119 Pin Memory IC 4.5 Mb kb 14mm mm
Price: 0.0000
RFQ -
7034L20PFI Integrated Device Technology (IDT)
Surface Mount Memory IC 72 kb kb 14mm mm 320mA mA 18b b
Price: 0.0000
RFQ -
7026L35J8 Integrated Device Technology (IDT)
Surface Mount 84 Pin Memory IC 256 kb kb 29.21mm mm 255mA mA 16b b
Price: 0.0000
RFQ -
71V65703S85BQ8 Integrated Device Technology (IDT)
165 Pin Memory IC 9 Mb kb 15mm mm
Price: 0.0000
RFQ -
IDT71V3577SA75BQ Integrated Device Technology (IDT)
3.3V V 165 Pin Memory IC 15mm mm
Price: 0.0000
RFQ -
-
71V35761SA183BGG Integrated Device Technology (IDT)
Surface Mount 119 Pin Memory IC 4.5 Mb kb 14mm mm 340mA mA 36b b
Price: 0.0000
RFQ -
-
-
IDT71V416VS15PHGI Integrated Device Technology (IDT)
3.3V V 44 Pin Memory IC 18.41mm mm
Price: 0.0000
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