Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W988D6FBGX6E | Winbond Electronics | 1.6167 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Not For New Designs | 3 (168 Hours) | 54 | EAR99 | 1 | 9mm | ROHS3 Compliant | AUTO/SELF REFRESH | 54-TFBGA | 8mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPSDR | SYNCHRONOUS | 1.025mm | 8542.32.00.24 | 1 | BOTTOM | 1.8V | 54 | YES | 0.8mm | R-PBGA-B54 | 1.7V | Not Qualified | 1.8V | 1.95V | 3-STATE | 5.4ns | 256Mb 16M x 16 | Volatile | 0.075mA | 1.7V~1.95V | 8MX32 | 32 | 268435456 bit | 166MHz | 0.00001A | 16 | COMMON | 8192 | DRAM | Parallel | 15ns | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||
.png "W25Q128FVSJQ TR") |
W25Q128FVSJQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~105°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W98AD2KBJX6E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25X80AVDAIZ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 9.27mm | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | SPI, Serial | unknown | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | SYNCHRONOUS | 5.33mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | NO | 2.54mm | R-PDIP-T8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 1MX8 | 8 | 8388608 bit | 100MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||
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W25X10VSNIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2006 | SpiFlash® | yes | Obsolete | 3 (168 Hours) | 8 | EAR99 | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 1 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1.72mm | 1 | 20mA | e3 | MATTE TIN | DUAL | 260 | 3V | 40 | 8 | 1.27mm | 2.7V | 3/3.3V | 3.6V | 7 ns | 1Mb 128K x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 75MHz | 0.00001A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||
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W631GU8KB-12 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Obsolete | 3 (168 Hours) | 78 | EAR99 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-TFBGA | 8mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | BOTTOM | NOT SPECIFIED | 1.35V | NOT SPECIFIED | 78 | YES | 0.8mm | R-PBGA-B78 | 1.283V | Not Qualified | 1.35V | 1.45V | 3-STATE | 20ns | 1Gb 128M x 8 | Volatile | 0.36mA | 1.283V~1.45V | 128MX8 | 8 | 1073741824 bit | 800MHz | COMMON | 8192 | DRAM | Parallel | 8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V124SA10YGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape and Reel | 2007 | 85°C | -40°C | 3.3V | 1 | RoHS Compliant | 32 | Parallel | 3.6V | 3.15V | 1 Mb | 150mA | 10 ns | RAM, SRAM - Asynchronous | 17b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT29LV512-15JC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | 0°C~70°C TC | FLASH | AT29LV512 | 32-PLCC (13.97x11.43) | 150ns | 512Kb 64K x 8 | Non-Volatile | 3V~3.6V | FLASH | Parallel | 20ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7005L20PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 1999 | no | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | TQFP | Parallel | 5.5V | 4.5V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 320mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | INDUSTRIAL | 0.8mm | SRAMs | 5V | 3-STATE | 20 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | Asynchronous | 0.004A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||
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W97AH6KBVX2E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 134 | 1 | 11.5mm | ROHS3 Compliant | 134 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 134-VFBGA | 10mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.2V | YES | 0.65mm | 1.14V | 1.3V | 1Gb 64M x 16 | Volatile | 1.14V~1.95V | 64MX16 | 16 | 1073741824 bit | 400MHz | MULTI BANK PAGE BURST | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q256JVBIM TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W987D2HBJX7E TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2011 | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 90-TFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPSDR | 5.4ns | 128Mb 4M x 32 | Volatile | 1.7V~1.95V | 133MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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EDFA232A2PB-GD-F-R TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | Surface Mount | -30°C~85°C TC | SDRAM - Mobile LPDDR3 | 216-FBGA (12x12) | 16Gb 512M x 32 | Volatile | 1.14V~1.95V | 800MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7140LA35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | YES | SRAMs | 5V | 3-STATE | 35 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | 0.0015A | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||
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IS61LV5128AL-10BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | no | Obsolete | 2 (1 Year) | 36 | 3A991.B.2.A | 10mm | Non-RoHS Compliant | 36 | 36-TFBGA | not_compliant | 8mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 36 | YES | 0.75mm | 3.135V | Not Qualified | 3.3V | 3.63V | 3-STATE | 4Mb 512K x 8 | Volatile | 0.095mA | 3.135V~3.6V | 512KX8 | 8 | 4194304 bit | 0.02A | 10 ns | COMMON | 3.14V | SRAM | Parallel | 10ns | |||||||||||||||||||||||||||||||||||||||||||||||||||
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EDB5432BEBH-1DAAT-F-D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Bulk | Last Time Buy | 3 (168 Hours) | 134 | EAR99 | 1 | 11.5mm | ROHS3 Compliant | Copper, Silver, Tin | 134 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 134-VFBGA | 512 Mb | Surface Mount | -40°C~105°C TC | SDRAM - Mobile LPDDR2 | SYNCHRONOUS | 1mm | 1 | 533MHz | BOTTOM | 1.2V | 0.65mm | 1.14V | 1.3V | 512Mb 16M x 32 | Volatile | 1.14V~1.95V | 16MX32 | 32 | 32b | SINGLE BANK PAGE BURST | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY62136FV30LL-55ZSXET | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel (TR) | 2001 | MoBL® | yes | Active | 3 (168 Hours) | 44 | 3V | 1 | ROHS3 Compliant | Lead Free | 44 | 44-TSOP (0.400, 10.16mm Width) | 2 Mb | Surface Mount | -40°C~125°C TA | SRAM - Asynchronous | 1 | 25mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 3V | 30 | CY62136 | 0.8mm | 2.2V | Not Qualified | 3.6V | 3-STATE | 2Mb 128K x 16 | Volatile | 17b | 2V~3.6V | 16 | Asynchronous | 55 ns | 16b | COMMON | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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11LC080T-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 5mA | e3 | DUAL | 260 | 5V | 40 | 11LC080 | 8 | 0.65mm | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 100kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 10ms | 1-WIRE | EEPROM | Single Wire | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC32A/SM | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tube | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5.26mm | ROHS3 Compliant | Lead Free | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-SOIC (0.209, 5.30mm Width) | I2C, Serial | No SVHC | 32 kb | 1.98mm | 5.25mm | Surface Mount | 0°C~70°C TA | CMOS | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3.3V | 40 | 24LC32A | 8 | 1.27mm | 2.5V | 3/5V | 6V | 900ns | 32Kb 4K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||
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IDT71V65802S150PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 150MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.325mA | 512KX18 | 18 | 9437184 bit | 0.04A | 3.8 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
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S99FL256SAGMFIR00 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT27BV512-12RC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1998 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 28-SOIC (0.342, 8.69mm Width) | Surface Mount | 0°C~70°C TC | EPROM - OTP | AT27BV512 | 28-SOIC | 120ns | 512Kb 64K x 8 | Non-Volatile | 2.7V~3.6V 4.5V~5.5V | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS28E04S-224-BB+T | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25P16VSSIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2006 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 5.27mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 16 Mb | Surface Mount | -40°C~85°C TA | CMOS | 2.16mm | 1 | e3 | MATTE TIN | DUAL | 260 | 3V | 40 | 8 | YES | 1.27mm | 2.7V | 3/3.3V | 3.6V | 50 μs | 16Mb 2M x 8 | Non-Volatile | 1b | 0.032mA | 2.7V~3.6V | 16MX1 | 1 | 50MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 7ms | |||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1165KV18-400BZXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tray | 2003 | Active | 3 (168 Hours) | 165 | 1.8V | 2 | 15mm | ROHS3 Compliant | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 18 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II+ | 1.4mm | 1 | 850mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY7C1165 | 1mm | 1.7V | 1.9V | 3-STATE | 450 ps | 18Mb 512K x 36 | Volatile | 17b | 1.7V~1.9V | 36 | Synchronous | 400MHz | 36b | SEPARATE | 1.7V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC16B-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2007 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 1 MILLION ERASE/WRITE CYCLES | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 2-Wire, I2C, Serial | No SVHC | 16 kb | 850μm | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24LC16B | 8 | 0.65mm | 2.5V | 2/5V | 5.5V | 900ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||
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W25Q64FVSF00 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | Surface Mount | FLASH - NOR | 16-SOIC | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT49F002NT-70PC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1999 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 32-DIP (0.600, 15.24mm) | Through Hole | 0°C~70°C TC | FLASH | AT49F002 | 32-PDIP | 70ns | 2Mb 256K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS1230AB-85+ | Maxim Integrated | 22.1780 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tube | 2002 | yes | Active | 1 (Unlimited) | 28 | EAR99 | 5V | ROHS3 Compliant | Contains Lead | 28 | 28-DIP Module (0.600, 15.24mm) | not_compliant | 256 kb | 85GHz | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 85mA | ASYNCHRONOUS | 8473.30.11.40 | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | DS1230AB | 28 | NO | 2.54mm | SRAMs | Not Qualified | 5V | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 8b | 0.0006A | 85 ns | NVSRAM | Parallel | 85ns | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1062AV33-10BGC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2005 | Obsolete | 3 (168 Hours) | 119 | 3A991.B.2.A | 22mm | Non-RoHS Compliant | 119 | 119-BGA | unknown | 14mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 2.4mm | 8542.32.00.41 | 1 | e0 | TIN LEAD | BOTTOM | 220 | 3.3V | NOT SPECIFIED | CY7C1062 | 119 | YES | 1.27mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 16Mb 512K x 32 | Volatile | 0.275mA | 3V~3.6V | 512KX32 | 32 | 16777216 bit | 0.05A | 10 ns | COMMON | 3V | SRAM | Parallel | 10ns |
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W25X80AVDAIZ Winbond Electronics
3/3.3V V SpiFlash® 8 Pin Memory IC SpiFlash® Series 9.27mm mm
Price: 0.0000
RFQ -
W25X10VSNIG Winbond Electronics
3/3.3V V Surface Mount SpiFlash® 8 Pin Memory IC SpiFlash® Series 1 Mb kb 20mA mA 8b b
Price: 0.0000
RFQ -
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IDT71V124SA10YGI8 Integrated Device Technology (IDT)
Surface Mount Memory IC 1 Mb kb 150mA mA 8b b
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24LC16B-I/MS Microchip Technology
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CY7C1062AV33-10BGC Cypress Semiconductor Corp
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