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BQ2205LYPWR
BQ2205LYPWR
815-BQ2205LYPWR
16-TSSOP (0.173, 4.40mm Width)
BQ2205LYPWR datasheet pdf and Memory - Controllers product details from Texas Instruments stock available at HK JDW
In Stock : 999
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Product Details
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BQ2205LYPWR Overview
Tape & Reel (TR) has packaged it with its materials. This information is provided in the 16-TSSOP (0.173, 4.40mm Width) in order to save space on the board. This is a high quality and reliable type of Nonvolatile SRAM. A temperature of -20°C~70°C should be set for the operating environment. To ensure the proper operation of the unit, a voltage of 3V~3.6V must be supplied. The mounting technique used is Surface Mount. In addition to this part number, there are other electronic components that can be found based on its base part number BQ2205. Signals are prevented from reflecting off the transmission line end by means of 16 terminations. Approximately 3.3V volts are supplied to the device. It is configured with 16 pins. The reflow temperaure limit of 260 is determined by the component with the lowest tolerance for high temperatures. This is a type of electronic apart with 16 channels. This item belongs to the Power Management Circuits subcategory. 1 channels are designed to ensure data transmission. High efficiency can be achieved by using the power supplies of 3.3V. POWER SUPPLY SUPPORT CIRCUIT is the type of analog integrated circuit used in this device. Voltage must be higher than 3V as the minimum value of supply voltage. In terms of voltage, a maximum voltage of 3.6V is possible without causing characteristics to degrade or internal circuit damage. An internal circuit can be supplied with a maximum current of 0.5mA without causing any degradation of its characteristics or damage to its integrity.
BQ2205LYPWR Features
Available in the 16-TSSOP (0.173, 4.40mm Width) package
Nonvolatile SRAM as controller type
Operating temperature of -20°C~70°C
BQ2205LYPWR Applications
There are a lot of Texas Instruments BQ2205LYPWR Memory Controllers applications.
- SecureDigitial- SD Cards for industrial and consumer applications
- eUSB, embedded USB module
- Embedded Systems
- Embedded modules including U.2, M.2, MO-297 and MO-300
- Industrial USB Flash Drive
- IDE Disk-on-Modules (DoM)
- Multi-Chip-Packages (MCP)
- eMMC embedded Flash
- Discrete on-board flash drive or disk-on-board (DoB) integration
- System-in-Package (SiP) embedded flash drives (eSSD)
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BQ2205LYPWR
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