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DS3173N
DS3173N
503-DS3173N
349-BBGA, CSBGA Exposed Pad
400 Terminations400 Pin DS3173 Telecom device3 Circuits
In Stock : 999
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Product Details
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DS3173N Overview
Space is saved on the board by using the 349-BBGA, CSBGA Exposed Pad package.To pack telecommunications equipment, the way of Tray is used.Surface Mount is used as telecommunications equipment mounting type.3 circuits make up this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.At -40°C~85°C, reliable performance can be achieved.The mounting is in the way of Surface Mount.Telecom switching configuration contains 400 terminations.There is a voltage supply called 3.3V that it uses.Telecom interfaces contain 400 pins.Telecom switching's base part number, DS3173, can be used to find related parts.The type of telecom IC it uses is FRAMER.Telecom product operates with the supply current of 449mA to provide much flexibility for designers.Other Telecom ICs subcategories telecommunications device .
DS3173N Features
Available in the 349-BBGA, CSBGA Exposed Pad package
FRAMER as telecom IC type
Operating supply current of 449mA
DS3173N Applications
There are a lot of Maxim Integrated DS3173N Telecom applications.
- ATM equipment with integrated DS1 interfaces
- SDH/SONET multiplexers
- Interfaces to DS3
- LAN Routers
- Fiber in the loop (FITL)
- T1/E1/J1 Multiplexer and Channel Banks
- Fractional T1/E1/J1
- Cable modem
- CSU/DSU E1 Interface
- T1/E1/J1 add/drop multiplexers (MUX)
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DS3173N
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