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  • EP2S30F672C4

EP2S30F672C4

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Manufacturer No:

EP2S30F672C4

Manufacturer:

Intel

HK JDW NO:

386-EP2S30F672C4

Package:

672-BBGA, FCBGA

Datasheet:

EP2S30F672C4

Description:

2.6mm mm FPGAs Stratix? II Series 672-BBGA, FCBGA 1.27mm mm 672

Quantity:

In Stock : 999

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EP2S30F672C4 Overview


This package is included in the 672-BBGA, FCBGA package and is available for purchase. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. 500 I/Os are available for transferring data more efficiently. A fundamental building block is made up of 33880 logic elements/cells. The supply voltage is 1.2V volts. The Field Programmable Gate Arrays family of FPGA parts includes this part. Using a Surface Mount connector, you can mount this FPGA module on the development board. Fpga chips operates at a voltage of 1.15V~1.25V and uses a battery to supply power. This is a type of FPGA that is part of the Stratix? II series of FPGAs. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. A device such as this one has 492 outputs built into it. Unlike other FPGA models, this one is contained in Tray for the sake of space saving. In total, the terminations of this piece are 672. Fpga chips is important to note that this device has a RAM capacFpga chipsy of 1369728 bFpga chipss. If you are looking for related parts, you can use the base part number EP2S30 as a starting point. 1694 LABs/CLBs are integrated into this FPGA. The device runs on a 1.21.5/3.33.3V battery and requires no additional power supply to operate. Most of the time, it uses a crystal oscillating at 717MHz to generate the signal. The architecture of the system is based on 13552 CLBs.

EP2S30F672C4 Features


500 I/Os
Up to 1369728 RAM bits

EP2S30F672C4 Applications


There are a lot of Intel EP2S30F672C4 FPGAs applications.

  • Integrating multiple SPLDs
  • Data Center
  • Image processing
  • Radar and Sensors
  • Development Boards and Shields for Microcontrollers
  • Artificial intelligence (AI)
  • Video & Image Processing
  • Solar Energy
  • ASIC prototyping
  • Medical Applications
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

EP2S30F672C4

technical specifications, attributes, parameters and parts with similar specifications to EP2S30F672C4.

  • Type
    Parameter
    Select All
  • Number of LABs/CLBs

    1694

  • Combinatorial Delay of a CLB-Max

    5.117 ns

  • Number of CLBs

    13552

  • Height Seated (Max)

    2.6mm

  • Length

    35mm

  • Width

    35mm

  • RoHS Status

    Non-RoHS Compliant

  • Mounting Type

    Surface Mount

  • Package / Case

    672-BBGA, FCBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Series

    Stratix® II

  • JESD-609 Code

    e0

  • Part Status

    Not For New Designs

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    672

  • ECCN Code

    3A001.A.7.A

  • Terminal Finish

    TIN LEAD

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Voltage - Supply

    1.15V~1.25V

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    220

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1.27mm

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Base Part Number

    EP2S30

  • JESD-30 Code

    S-PBGA-B672

  • Number of Outputs

    492

  • Qualification Status

    Not Qualified

  • Power Supplies

    1.21.5/3.33.3V

  • Number of I/O

    500

  • Clock Frequency

    717MHz

  • Number of Inputs

    500

  • Organization

    13552 CLBS

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Number of Logic Elements/Cells

    33880

  • Total RAM Bits

    1369728

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