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  • IDT72V7230L10BBG

IDT72V7230L10BBG

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Manufacturer No:

IDT72V7230L10BBG

HK JDW NO:

378-IDT72V7230L10BBG

Package:

BGA

Datasheet:

IDT72V7230L10BBG

Description:

256 Terminations3.3V 256 Pin FIFO memory IC10 ns Min 3.15V VMax 3.45V V

Quantity:

In Stock : 999

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Product Details

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IDT72V7230L10BBG Overview


FIFO memory chip is included in the BGA package.Memory IC's recommended mounted way is Surface Mount .When the supply voltage is 3.3V there is the possibility of high efficiency.256 terminations are contained in FIFO means.The operation pins are 256 pins.In order to maximize efficiency, the supply voltage should be set to 3.3V .It is designed to run at a minimum temperature of 0°C degrees Celsius to ensure reliability.A memory logic's maximum operating temperature of 70°C degrees Celsius assures stable operation.The FIFO memory chip may be operated at very low supply voltages, such as3.15V volts.FIFO memory can handle a maximum supply voltage of 3.45V V.There are a total of 256 pins on this FIFO memory IC.A frequency of 100MHz is capable of maintaining good accuracy.It is also possible to generate RETRANSMIT using this FIFO memory.

IDT72V7230L10BBG Features



IDT72V7230L10BBG Applications


There are a lot of Integrated Device Technology (IDT) IDT72V7230L10BBG FIFOs Memory applications.

  • Thermal Management for DDR3 Memory Modules
  • General Data Collection Applications at Extreme High-Temperatures
  • Multimedia
  • Measurement Equipment
  • Magnetic memories
  • Game Controller
  • Portable Information Devices
  • Fabrication Site
  • Look-up Tables
  • Laser Receiver System
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FedEx International, 5-7 business days.
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UPS(www.ups.com)
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

IDT72V7230L10BBG

technical specifications, attributes, parameters and parts with similar specifications to IDT72V7230L10BBG.

  • Type
    Parameter
    Select All
  • Mount

    Surface Mount

  • Package / Case

    BGA

  • Number of Pins

    256

  • Published

    2005

  • JESD-609 Code

    e1

  • Moisture Sensitivity Level (MSL)

    3

  • Number of Terminations

    256

  • ECCN Code

    EAR99

  • Terminal Finish

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Max Operating Temperature

    70°C

  • Min Operating Temperature

    0°C

  • Additional Feature

    RETRANSMIT

  • HTS Code

    8542.32.00.71

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    260

  • Number of Functions

    1

  • Supply Voltage

    3.3V

  • Terminal Pitch

    1mm

  • Frequency

    100MHz

  • Time@Peak Reflow Temperature-Max (s)

    30

  • Pin Count

    256

  • Qualification Status

    Not Qualified

  • Operating Supply Voltage

    3.3V

  • Temperature Grade

    COMMERCIAL

  • Max Supply Voltage

    3.45V

  • Min Supply Voltage

    3.15V

  • Element Configuration

    Dual

  • Nominal Supply Current

    75mA

  • Access Time

    10 ns

  • Direction

    Unidirectional

  • Organization

    512X72

  • Memory Width

    72

  • Density

    36 kb

  • Parallel/Serial

    PARALLEL

  • Sync/Async

    Synchronous

  • Word Size

    72b

  • Output Enable

    YES

  • Height Seated (Max)

    3.5mm

  • Length

    17mm

  • Width

    17mm

  • RoHS Status

    RoHS Compliant

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