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  • IRF9395MTRPBF

IRF9395MTRPBF

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Manufacturer No:

IRF9395MTRPBF

Manufacturer:

Infineon Technologies

HK JDW NO:

376-IRF9395MTRPBF

Package:

DirectFET™ Isometric MC

Datasheet:

IRF9395MTRPBF

Description:

IRF9395MTRPBF datasheet pdf and Transistors - FETs, MOSFETs - Arrays product details from Infineon Technologies stock available at HK JDW

Quantity:

In Stock : 999

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IRF9395MTRPBF             Description


IRF9395MTRPbF combines the latest HEXFET P-channel power MOSFET silicon technology with advanced DirectFETTM packaging to achieve the lowest on-resistance in a 0.6 mm package. The DirectFET package is compatible with existing layout geometry used in power applications, printed circuit board assembly equipment and gas phase, infrared or convection soldering technologies, as long as the manufacturing method and process instructions in the AN-1035 application instructions are followed. The DirectFET package allows double-sided cooling to maximize heat transfer in the power system, increasing the previously optimal thermal resistance by 80 per cent.

 

IRF9395MTRPBF                 Applications


·Isolation Switch for Input Power or Battery Application

 

IRF9395MTRPBF                        Features


Environmentaly Friendly Product

RoHs Compliant Containing no Lead no Bromide and no Halogen

Dual Common-Drain P-Channel MOSFETs Provides High Level of Integration and Very Low RDS(on)

 





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Payment Method

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East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

IRF9395MTRPBF

technical specifications, attributes, parameters and parts with similar specifications to IRF9395MTRPBF.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    17 Weeks

  • Mount

    Surface Mount

  • Mounting Type

    Surface Mount

  • Package / Case

    DirectFET™ Isometric MC

  • Number of Pins

    10

  • Transistor Element Material

    SILICON

  • Operating Temperature

    -40°C~150°C TJ

  • Packaging

    Tape & Reel (TR)

  • Published

    2007

  • Series

    HEXFET®

  • JESD-609 Code

    e3

  • Part Status

    Last Time Buy

  • Moisture Sensitivity Level (MSL)

    1 (Unlimited)

  • Number of Terminations

    6

  • ECCN Code

    EAR99

  • Terminal Finish

    Matte Tin (Sn)

  • Subcategory

    Other Transistors

  • Max Power Dissipation

    2.1W

  • Terminal Position

    BOTTOM

  • JESD-30 Code

    R-XBCC-N6

  • Number of Elements

    1

  • Element Configuration

    Dual

  • Operating Mode

    ENHANCEMENT MODE

  • Power Dissipation

    2.1W

  • Case Connection

    DRAIN

  • Turn On Delay Time

    19 ns

  • FET Type

    2 P-Channel (Dual)

  • Transistor Application

    SWITCHING

  • Rds On (Max) @ Id, Vgs

    7m Ω @ 14A, 10V

  • Vgs(th) (Max) @ Id

    2.4V @ 50μA

  • Input Capacitance (Ciss) (Max) @ Vds

    3241pF @ 15V

  • Gate Charge (Qg) (Max) @ Vgs

    64nC @ 10V

  • Rise Time

    142ns

  • Drain to Source Voltage (Vdss)

    30V

  • Fall Time (Typ)

    121 ns

  • Turn-Off Delay Time

    76 ns

  • Continuous Drain Current (ID)

    14A

  • Gate to Source Voltage (Vgs)

    20V

  • Drain Current-Max (Abs) (ID)

    75A

  • Drain-source On Resistance-Max

    0.007Ohm

  • Drain to Source Breakdown Voltage

    -30V

  • FET Technology

    METAL-OXIDE SEMICONDUCTOR

  • FET Feature

    Logic Level Gate

  • Radiation Hardening

    No

  • RoHS Status

    ROHS3 Compliant

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