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  • XC7K325T-1FBG900C

XC7K325T-1FBG900C

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Manufacturer No:

XC7K325T-1FBG900C

Manufacturer:

Xilinx

HK JDW NO:

903-XC7K325T-1FBG900C

Package:

900-BBGA, FCBGA

Datasheet:

XC7K325T-1FBG900C

Description:

1GB B FPGAs Kintex?-7 Series 900-BBGA, FCBGA

Quantity:

In Stock : 6904

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XC7K325T-1FBG900C Overview


A 900-BBGA, FCBGA package is provided with this component. The I/Os are designed to facilitate a more coherent transfer of data. A fundamental building block consists of 326080 logic elements/cells. Using a Surface Mount connector, you can mount this FPGA module on the development board. The supply voltage of the device is 0.97V~1.03V , at which it runs. It is a type of FPGA that belongs to the Kintex?-7 series of FPGAs. When operating the machine, it is important to keep the temperature within 0°C~85°C TJ range. In order to save space, this FPGA model has been contained in Tray. There are 16404480 RAM bits that are available with this device. Its base part number XC7K325T can be used to find related parts. It is crucial that the RAM si2MBe of this FPGA module reaches 2MB so that the program can run normally. In this case, 900 pins are used in the design. Fpga electronics contains 25475 LABs/CLBs in an array. The maximal operating temperature of this module reaches 85°C. In order to achieve 0°C, the operating temperature must be higher than 0°C. Fpga semiconductor consists of 25475 logic blocks (LABs). For storing programs and data, this FPGA module embeds memory 1GB. There are 407600 registers used to store and transfer data. Fpga semiconductor supports the maximal supply voltage of 1.03V. The minimal supply voltage required for it is 970mV. There is a device package provided by 900-FCBGA (31x31) as its supplier. The DDR3 memory is adopted for storing data and avoiding resource conflicts.

XC7K325T-1FBG900C Features


500 I/Os
Up to 16404480 RAM bits
900 LABs/CLBs
85°C gates
25475 logic blocks (LABs)
407600 registers

XC7K325T-1FBG900C Applications


There are a lot of Xilinx Inc. XC7K325T-1FBG900C FPGAs applications.

  • High Performance Computing
  • Scientific Instruments
  • ADAS
  • Filtering and communication encoding
  • Automotive Applications
  • Secure Communication
  • Audio
  • OpenCL
  • Aerospace and Defense
  • Solar Energy
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7K325T-1FBG900C

technical specifications, attributes, parameters and parts with similar specifications to XC7K325T-1FBG900C.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    11 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Mounting Type

    Surface Mount

  • Package / Case

    900-BBGA, FCBGA

  • Number of Pins

    900

  • Supplier Device Package

    900-FCBGA (31x31)

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    Kintex®-7

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Max Operating Temperature

    85°C

  • Min Operating Temperature

    0°C

  • Voltage - Supply

    0.97V~1.03V

  • Base Part Number

    XC7K325T

  • Max Supply Voltage

    1.03V

  • Min Supply Voltage

    970mV

  • Memory Size

    1GB

  • Number of I/O

    500

  • RAM Size

    2MB

  • Memory Type

    DDR3

  • Number of Logic Elements/Cells

    326080

  • Total RAM Bits

    16404480

  • Number of LABs/CLBs

    25475

  • Number of Logic Blocks (LABs)

    25475

  • Speed Grade

    -1

  • Number of Registers

    407600

  • RoHS Status

    ROHS3 Compliant

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