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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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RF Directional Coupler

Additional Feature

  • HIGH ISOLATION
  • HIGH RELIABILITY
  • IT CAN ALSO OPERATE AT 1700-1800 MHZ
  • N
  • N, I/P POWER-MAX(PEAK)=2000WATT
  • N, I/P POWER-MAX(PEAK)=3000WATT
  • N, I/P POWER-MAX(PEAK)=4000WATT
  • N-F
  • N-F, I/P POWER-MAX(PEAK)=10000WATT
  • N-F, I/P POWER-MAX(PEAK)=5000WATT
  • N-F; N-M, I/P POWER-MAX (PEAK)=5000WATT
  • N-F; N-M, I/P POWER-MAX(PEAK)=3000WATT
  • SMA
  • SMA, I/P POWER-MAX(PEAK)=2000WATT
  • SMA, I/P POWER-MAX(PEAK)=3000WATT
  • SMA, I/P POWER-MAX(PEAK)=4000WATT
  • SMA-F
  • SMA-F, HIGH ISOLATION
  • SMA-F, I/P POWER-MAX(PEAK)=1000WATT
  • SMA-F, I/P POWER-MAX(PEAK)=2000WATT
  • SMA-F, I/P POWER-MAX(PEAK)=3000WATT
  • SMA-F; TNC-F; TNC-M, I/P POWER-MAX (PEAK)=3000WATT
  • SMA-F; TNC-F; TNC-M, I/P POWER-MAX (PEAK)=5000WATT
  • TNC
  • TNC, I/P POWER-MAX(PEAK)=2000WATT
  • TNC, I/P POWER-MAX(PEAK)=3000WATT
  • TNC, I/P POWER-MAX(PEAK)=4000WATT
  • TNC-F

Applications

  • -
  • AGSM, DCS, PCS
  • AGSM, GSM
  • AMPS
  • AMPS, CDMA, WCDMA
  • AMPS, GSM, LTE, WCDMA
  • CATV
  • CATV, Cellular
  • CDMA
  • CDMA, DCS, GPS, ISM, PCS, TDMA, UMTS
  • CDMA, PCS, DCS
  • CDMA, WCDMA
  • Cellular
  • Cellular, PCN, PCS
  • Cellular, PCS
  • DCS
  • DCS, LTE, PCS, WCDMA
  • DCS, LTE, PCS, WiMax
  • DCS, PCS
  • DCS, PCS, WCDMA
  • DECT
  • E-GSM
  • General Purpose
  • GPS
  • GSM
  • GSM, LTE
  • GSM, W-CDMA, WiMax
  • LTE, WiMAX
  • LTE, WWAN
  • Military
  • PCN
  • PCN, PCS
  • PCS
  • PCS, LTE, ISM, UMTS, WiMAX, Wi-Fi
  • PDC
  • PHP
  • S-Band Radar
  • Telecom/Datacom Systems
  • UMTS
  • W-CDMA
  • Wireless LAN
  • WLAN
  • X-Band Radar

Composition

  • Ceramic
  • Thin Film

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 5A991.G
  • EAR99

Factory Lead Time

  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 5 Weeks
  • 6 Weeks
  • 8 Weeks
  • 9 Weeks

HTS Code

  • 8517.70.00.00
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e3
  • e4

Lifecycle Status

  • ACTIVE (Last Updated: 8 months ago)
  • EOL ANNOUNCED (Last Updated: 2 months ago)
  • NRND (Last Updated: 1 month ago)
  • NRND (Last Updated: 3 weeks ago)
  • OBSOLETE (Last Updated: 1 month ago)
  • PRODUCTION (Last Updated: 2 months ago)
  • PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 1 month ago)
  • PRODUCTION (NOT RECOMMENDED FOR NEW DESIGN) (Last Updated: 2 months ago)

Manufacturer Package Identifier

  • X3C19P2-30S

Max Operating Temperature

  • 85°C
  • 95°C

Mfr

  • Johanson Technology Inc.
  • KYOCERA AVX
  • MACOM Technology Solutions
  • Mini-Circuits
  • Murata Electronics
  • Pulse Electronics
  • Radiall USA, Inc.
  • Taiyo Yuden
  • TDK Corporation

Min Operating Temperature

  • -30°C
  • -40°C
  • -50°C
  • -55°C

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2 (1 Year)
  • 2 (1 Year)
  • Not Applicable
  • Vendor Undefined

Mount

  • Screw
  • Surface Mount

Mounting Feature

  • SURFACE MOUNT

Number of Pins

  • 10
  • 4
  • 5
  • 6
  • 8

Number of Terminations

  • 4
  • 6

Package / Case

  • -
  • 0202 (0505 Metric), 4 PC Pad
  • 0302 (0806 Metric), 4 Lead
  • 0402
  • 0402 (1005 Metric)
  • 0402 (1005 Metric), 4 PC Pad
  • 0402 (1005 Metric), 6 PC Pad
  • 0603
  • 0603 (1608 Metric)
  • 0603 (1608 Metric), 4 PC Pad
  • 0603 (1608 Metric), 6 PC Pad
  • 0606 (1616 Metric)
  • 0805
  • 0805 (2012 Metric)
  • 0805 (2012 Metric), 4 PC Pad
  • 0805 (2012 Metric), 8 PC Pad
  • 100
  • 1206 (3216 Metric)
  • 1210 (3225 Metric)
  • 125
  • 200
  • 24-VFQFN Exposed Pad
  • 2520 (6450 Metric)
  • 4-SMD
  • 4-SMD, Flat Leads
  • 4-SMD, Gull Wing
  • 4-SMD, No Lead
  • 4-SMD, No Lead Exposed Pad
  • 5-SMD Module
  • 5-SMD, No Lead
  • 5-UFBGA, FCBGA
  • 6-SMD
  • 6-SMD (5 Leads), Flat Lead
  • 6-SMD (5 Leads), Gull Wing
  • 6-SMD Module
  • 6-SMD Module, No Lead
  • 6-SMD, Flat Leads
  • 6-SMD, No Lead
  • 6-UFBGA, FCBGA
  • 6-VFDFN Exposed Pad
  • 6-WFBGA, FCBGA
  • 6-WFDFN Exposed Pad
  • 7-WFBGA, FCBGA
  • 8-SMD, J-Lead
  • 8-SMD, No Lead
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-UFBGA, FCBGA
  • Flat Box, Terminator
  • FlatPack
  • FP-2
  • LGA
  • Module
  • Module, SMA Connectors
  • N-Type In-Line Module
  • Nonstandard
  • SC-74, SOT-457
  • SF-1
  • SM-22
  • SM-55
  • SMA
  • SMA In-Line Module
  • SMD/SMT
  • SOT-23-6
  • TNC In-Line Module

Packaging

  • Box
  • Bulk
  • Cut Tape (CT)
  • Digi-Reel®
  • Strip
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray

Packing Method

  • TR, EMBOSSED, 7 INCH

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • *
  • -
  • 1608
  • 2020
  • 605
  • FI
  • HDH
  • HHM
  • SURFCOIL® GLSL
  • TSC1
  • Xinger III®
  • Xinger II®
  • Xinger®
  • Xinger® IV

Supplier Device Package

  • -
  • 0202
  • 0402
  • 0603
  • 0603 (1608 Metric)
  • 0805
  • 0805 (2012 Metric)
  • 1206
  • 6-SMD
  • 6-TDFN (1.5x1.2)
  • 8-SOIC
  • FP-2
  • Module
  • SF-1
  • SM-22
  • SM-55
  • SMD

Surface Mount

  • YES

Terminal Finish

  • GOLD
  • Gold (Au)
  • Gold (Au) - with Nickel (Ni) barrier
  • Matte Tin (Sn)
  • MATTE TIN OVER COPPER
  • Nickel/Gold (Ni/Au) - ENIG
  • TIN
  • Tin (Sn)
  • Tin (Sn) - immersion
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn10Pb90)
  • Tin/Lead (Sn63Pb37)
  • Tin/Silver/Copper (Sn/Ag/Cu)

Termination

  • SMD/SMT
  • Through Hole

Weight

  • 2.012816mg
  • 5.499807mg
  • 50.008559mg
  • 652.039032μg
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