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RF/IF & RFID

RF IF & RFID.jpg
RF power dividers/splitters are electronic components that are used to divide or split an incoming RF signal into multiple output signals. These components are commonly used in communication systems, such as radio and television broadcasting, as well as in radar and satellite communication systems. RF power dividers/splitters are designed to maintain signal integrity and minimize signal loss, ensuring that each output signal is of equal strength and quality. They come in various configurations, including 2-way, 3-way, 4-way, and 8-way, and can be used in both indoor and outdoor applications. RF power dividers/splitters are essential components in any RF system that requires signal distribution.
Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Lifecycle Status Mount Material Shape Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination ECCN Code Max Operating Temperature Min Operating Temperature Length RoHS Status Lead Free Voltage - Rated Current Rating Radiation Hardening Number of Pins Package / Case Interface Frequency Height Width Impedance Thickness Mfr Mounting Type Operating Temperature HTS Code Physical Dimension Evaluation Kit Type JESD-609 Code Terminal Finish Frequency Range Surface Mount Subcategory Application Composition Case Code (Metric) Case Code (Imperial) Characteristic Impedance Construction RF/Microwave Device Type Operating Frequency-Max Operating Frequency-Min VSWR-Max Insertion Loss (Max) Adhesive DC Resistance (DCR) Transformer Type Insertion Loss Applications Power - Output Memory Size Insertion Loss (dB) Turns Ratio - Primary:Secondary Return Loss Receive Center Frequency Transmit Center Frequency Voltage - Supply Protocol Isolation Sensitivity (dBm) Return Loss-Min Cut-off Frequency-Max Cut-off Frequency-Min Impedance - Unbalanced/Balanced Phase Difference RF Family/Standard Coupler Type Coupling Factor Supplied Contents Current - Receiving Current - Transmitting Frequency Bands (Low / High) High Band Attenuation (min / max dB) Low Band Attenuation (min / max dB) Return Loss (Low Band / High Band) Serial Interfaces GPIO Thickness - Overall
IFL04-050RN1HRX300 IFL04-050RN1HRX300 TDK Corporation 0.0000
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0.00000000 download 16 Weeks PRODUCTION (Last Updated: 2 months ago) Tape & Reel (TR) 2013 Active 3 (168 Hours) ROHS3 Compliant 36-SMD Module I2C, SPI, UART 2.4GHz Surface Mount -20°C~70°C 8542.39.00.01 TxRx + MCU 0dBm 32kB OTP 84kB ROM 50kB SRAM 2.35V~3.3V Bluetooth v4.1 -94 dBm Bluetooth 5.4mA 5mA I2C, SPI, UART 12
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