Items : %s%s
SoC
Additional Feature
- ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY
- ALSO OPERATES AT 0.85V
- ALSO OPERATES AT 0.92-0.98 V SUPPLY
- ALSO OPERATES WITH 0.85 VOLT
- GPIO WITH FOUR 32-BIT BANKS
- IT ALSO OPERATES AT 0.85V NOMINAL SUPPLY(PROCESSING SYSTEM)
- IT ALSO OPERATES AT 0.95V NOMINAL VCC
- LG-MIN, WD-MIN
- LG-MIN,WD-MIN
- PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY
Contact Plating
- Copper, Silver, Tin
ECCN Code
- 3A001.A.2.C
- 3A991
- 3A991.D
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 2 Weeks
- 22 Weeks
- 25 Weeks
- 26 Weeks
- 3 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 99 Weeks
HTS Code
- 8542.31.00.01
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e3
Lifecycle Status
- IN PRODUCTION (Last Updated: 1 month ago)
- IN PRODUCTION (Last Updated: 2 days ago)
- IN PRODUCTION (Last Updated: 2 weeks ago)
- IN PRODUCTION (Last Updated: 3 days ago)
- IN PRODUCTION (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 3 weeks ago)
Max Operating Temperature
- 100°C
- 125°C
- 85°C
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- Not Applicable
Mount
- Surface Mount
Number of Pins
- 1152
- 1156
- 144
- 2
- 208
- 225
- 256
- 288
- 325
- 400
- 484
- 485
- 676
- 896
- 900
Number of Terminals
- 1517
Number of Terminations
- 1152
- 144
- 208
- 225
- 256
- 288
- 325
- 400
- 484
- 485
- 536
- 625
- 672
- 676
- 780
- 784
- 896
- 900
Operating Temperature
- -30°C~85°C
- -40°C~100°C TJ
- -40°C~125°C TJ
- -40°C~85°C
- -55°C~125°C TJ
- 0°C~100°C TJ
- 0°C~85°C TJ
Package / Case
- 100-LQFP
- 1152-BBGA, FCBGA
- 1156-BBGA, FCBGA
- 144-LQFP
- 1517-BBGA, FCBGA
- 1760-BBGA, FCBGA
- 1924-BBGA, FCBGA
- 208-BFQFP
- 225-LFBGA, CSPBGA
- 2397-BBGA, FCBGA
- 256-LBGA
- 256-LFBGA
- 288-TFBGA, CSPBGA
- 2912-BBGA, FCBGA
- 325-TFBGA, CSPBGA
- 400-LFBGA
- 400-LFBGA, CSPBGA
- 449-BGA
- 484-BBGA, FCBGA
- 484-BFBGA
- 484-BFBGA, FCBGA
- 484-BGA
- 484-FBGA
- 484-FBGA, FCBGA
- 484-LFBGA, CSPBGA
- 536-LFBGA, CSPBGA
- 625-BFBGA, FCBGA
- 64-LQFP
- 672-BBGA, FCBGA
- 672-FBGA
- 676-BBGA, FCBGA
- 676-BGA
- 780-BBGA, FCBGA
- 784-BFBGA, FCBGA
- 896-BBGA, FCBGA
- 896-BGA
- 900-BBGA, FCBGA
- BGA
- Module
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Discontinued
- Obsolete
Pbfree Code
- no
- yes
Peak Reflow Temperature (Cel)
- 225
- 235
- 245
- 250
- 260
- NOT SPECIFIED
Published
- 1997
- 2000
- 2001
- 2002
- 2003
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- Arria 10 SX
- Arria V ST
- Arria V SX
- Automotive, AEC-Q100, Cyclone® V SE
- Automotive, AEC-Q100, SmartFusion®2
- Automotive, AEC-Q100, Zynq®-7000 XA
- BCM7405
- Cyclone® V SE
- Cyclone® V ST
- Cyclone® V SX
- Sipeed MAIX-I
- SmartFusion®
- SmartFusion®2
- Stratix® 10 SX
- Zynq® UltraScale+™ MPSoC CG
- Zynq® UltraScale+™ MPSoC EG
- Zynq® UltraScale+™ MPSoC EV
- Zynq®-7000
Subcategory
- Field Programmable Gate Arrays
- Other Microprocessor ICs
- Other uPs/uCs/Peripheral ICs
Supplier Device Package
- 1152-FBGA, FC (35x35)
- 1152-FCBGA (35x35)
- 144-TQFP (20x20)
- 1517-FBGA, FC (40x40)
- 1517-FCBGA (40x40)
- 208-PQFP (28x28)
- 256-FPBGA (17x17)
- 288-CSP (11x11)
- 325-CSPBGA (11x11)
- 400-CSPBGA (17x17)
- 400-VFBGA (17x17)
- 484-CSPBGA (19x19)
- 484-FBGA (19x19)
- 484-FCBGA (19x19)
- 484-FPBGA (23x23)
- 485-CSBGA (19x19)
- 485-FCBGA (19x19)
- 672-UBGA (23x23)
- 676-FBGA (27x27)
- 676-FCBGA (27x27)
- 784-FCBGA (23x23)
- 896-FBGA (31x31)
- 900-FCBGA (31x31)
Surface Mount
- YES
Technology
- CMOS
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Pure Matte Tin (Sn)
- TIN LEAD
- TIN LEAD SILVER
- TIN LEAD/TIN LEAD SILVER
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead/Silver (Sn/Pb/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Terminal Form
- BALL
- GULL WING
Terminal Position
- BOTTOM
- QUAD
Weight
- 1.319103g
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Reach Compliance Code | Frequency | Width | Operating Temperature | Technology | Height Seated (Max) | HTS Code | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Number of Outputs | Supplier Device Package | Core Architecture | Speed | Number of Inputs | Core Processor | RAM Size | Number of I/O | Boundary Scan | Data Bus Width | Bus Compatibility | Architecture | uPs/uCs/Peripheral ICs Type | Peripherals | RAM (words) | UV Erasable | Primary Attributes | Speed Grade | Programmable Logic Type | Number of Logic Cells | Flash Size | Connectivity |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
10AS032E3F29I2LG | Altera | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2016 | 780 | 29mm | Non-RoHS Compliant | 29mm | CMOS | 3.35mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | INDUSTRIAL | YES | 1mm | S-PBGA-B780 | 0.87V | 100°C | -40°C | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 360 | 360 | FIELD PROGRAMMABLE GATE ARRAY | 320000 | ||||||||||||||||||||||||||||||||||||||||||
.png "10AS048K3F35E2SG") |
10AS048K3F35E2SG | Altera | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | 2016 | 1152 | 35mm | Non-RoHS Compliant | 35mm | CMOS | 3.5mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | OTHER | YES | 1mm | S-PBGA-B1152 | 0.87V | 100°C | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 396 | 396 | FIELD PROGRAMMABLE GATE ARRAY | 480000 | |||||||||||||||||||||||||||||||||||||||||||
 |
XA7Z010-1CLG400Q | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2010 | Automotive, AEC-Q100, Zynq®-7000 XA | Active | 4 (72 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, GPIO, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~125°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | NOT SPECIFIED | NOT SPECIFIED | 0.8mm | Other uPs/uCs/Peripheral ICs | Not Qualified | 11.8V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | 32b | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA | N | Artix™-7 FPGA, 28K Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||
|
IB899F-371 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB897-I45/I45P (V2.0 ; D-1 STEPPING) | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB822F-5005 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB898-I25 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XCZU19EG-2FFVB1517I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 1517-BBGA, FCBGA | -40°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 644 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
XC7Z030-1FBG676I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 4 (72 Hours) | 676 | 3A991.D | 1V | 27mm | ROHS3 Compliant | Copper, Silver, Tin | No | 676 | 676-BBGA, FCBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 667MHz | -40°C~100°C TJ | CMOS | 2.54mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | 245 | 1V | 30 | XC7Z030 | YES | 1mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Kintex™-7 FPGA, 125K Logic Cells | -1 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||
|
IB899F-301 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB811F-I30 (F-1 STEPPING) V2.0 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB898-I15 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB903FC-12 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB899F-370 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
XCZU11EG-1FFVC1156E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | 1156-BBGA, FCBGA | 0°C~100°C TJ | 8542.31.00.01 | NOT SPECIFIED | NOT SPECIFIED | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 360 | MCU, FPGA | DMA, WDT | Zynq®UltraScale+™ FPGA, 653K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB897-I15 (V2.0 ; D-1 STEPPING) | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB811F-335 (B-1 STEPPING) | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XCZU7EG-L2FFVF1517E | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 1517-BBGA, FCBGA | 0°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B1517 | 0.698V | 0.742V | 533MHz, 600MHz, 1.3GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 464 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||
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IB811F-I50 (F-1 STEPPING) V2.0 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IB892-13T | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IB918F-1605 | iBASE Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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XCZU9EG-L1FFVB1156I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Bulk | 2013 | Zynq® UltraScale+™ MPSoC EG | Active | 4 (72 Hours) | ROHS3 Compliant | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 1156-BBGA, FCBGA | -40°C~100°C TJ | CMOS | 8542.31.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.72V | NOT SPECIFIED | YES | R-PBGA-B1156 | 0.698V | 0.742V | 500MHz, 600MHz, 1.2GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | 256KB | 328 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||
 |
1SX280LN3F43I1VG | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | RoHS Compliant | 1760-BBGA, FCBGA | -40°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | 688 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | FPGA - 2800K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
XC7Z020-2CLG400I | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2009 | Zynq®-7000 | Active | 3 (168 Hours) | 400 | EAR99 | 1V | 17mm | ROHS3 Compliant | Copper, Silver, Tin | No | 400 | 400-LFBGA, CSPBGA | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | 766MHz | -40°C~100°C TJ | CMOS | 1.6mm | 8542.39.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1V | 30 | XC7Z020 | YES | 0.8mm | 1.05V | ARM | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | 256KB | 130 | YES | 32b | CAN; ETHERNET; I2C; SPI; UART; USB | MCU, FPGA | DMA | 256000 | Artix™-7 FPGA, 85K Logic Cells | -2 | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | ||||||||||||||||||||||||||
 |
A2F060M3E-TQG144 | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | 2000 | SmartFusion® | Obsolete | 3 (168 Hours) | 85°C | 0°C | RoHS Compliant | 144-LQFP | EBI/EMI, I2C, SPI, UART, USART | 80MHz | 0°C~85°C TJ | A2F060M3E | 144-TQFP (20x20) | ARM | 80MHz | ARM® Cortex®-M3 | 16KB | MCU - 21, FPGA - 33 | MCU, FPGA | DMA, POR, WDT | ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops | 128KB | EBI/EMI, I2C, SPI, UART/USART | ||||||||||||||||||||||||||||||||||||||||||||||
 |
10AS027H3F34I2LG | Altera | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | 2016 | 1152 | 35mm | Non-RoHS Compliant | 35mm | CMOS | 3.65mm | 8542.39.00.01 | BOTTOM | BALL | NOT SPECIFIED | 0.9V | NOT SPECIFIED | INDUSTRIAL | YES | 1mm | S-PBGA-B1152 | 0.87V | 100°C | -40°C | Field Programmable Gate Arrays | Not Qualified | 0.9V | 0.93V | 384 | 384 | FIELD PROGRAMMABLE GATE ARRAY | 270000 | ||||||||||||||||||||||||||||||||||||||||||
 |
M2S150T-1FC1152I | Microsemi Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Tray | 2009 | SmartFusion®2 | Active | 3 (168 Hours) | 35mm | Non-RoHS Compliant | 1152-BBGA, FCBGA | CAN, Ethernet, I2C, SPI, UART, USART, USB | not_compliant | 166MHz | 35mm | -40°C~100°C TJ | CMOS | 2.9mm | 8542.39.00.01 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | M2S150T | YES | 1mm | S-PBGA-B1152 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 574 | ARM | 574 | ARM® Cortex®-M3 | 64KB | 574 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 150K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 146124 | 512KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB | ||||||||||||||||||||||||
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BCM3384EKFSBG | Broadcom | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 1 (Unlimited) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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1SX250LU3F50I2LG | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Stratix® 10 SX | Active | 3 (168 Hours) | RoHS Compliant | 2397-BBGA, FCBGA | -40°C~100°C TJ | 1.5GHz | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ | 256KB | 704 | MCU, FPGA | MICROPROCESSOR CIRCUIT | DMA, WDT | FPGA - 2500K Logic Elements | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M2S025T-1FGG484M | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | SmartFusion®2 | Active | 3 (168 Hours) | 484 | 23mm | RoHS Compliant | 484-BGA | 23mm | -55°C~125°C TJ | CMOS | 2.44mm | 8542.39.00.01 | e3 | MATTE TIN | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 1mm | S-PBGA-B484 | 1.14V | Field Programmable Gate Arrays | Not Qualified | 1.2V | 1.26V | 267 | 166MHz | 267 | ARM® Cortex®-M3 | 64KB | 267 | MCU, FPGA | DDR, PCIe, SERDES | FPGA - 25K Logic Modules | FIELD PROGRAMMABLE GATE ARRAY | 27696 | 256KB | CANbus, Ethernet, I2C, SPI, UART/USART, USB |
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XA7Z010-1CLG400Q Xilinx
400 Terminations-40°C~125°C TJ 400 Pin System On ChipAutomotive, AEC-Q100, Zynq?-7000 XA Series 130 I/O
Price: 0.0000
RFQ -
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XCZU19EG-2FFVB1517I Xilinx
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 644 I/O
Price: 0.0000
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XC7Z030-1FBG676I Xilinx
676 Terminations-40°C~100°C TJ 676 Pin XC7Z030 System On ChipZynq?-7000 Series 130 I/O1V
Price: 0.0000
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XCZU11EG-1FFVC1156E Xilinx
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 360 I/O
Price: 0.0000
RFQ -
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XCZU7EG-L2FFVF1517E Xilinx
0°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 464 I/O0.72V
Price: 0.0000
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XCZU9EG-L1FFVB1156I Xilinx
-40°C~100°C TJ System On ChipZynq? UltraScale+? MPSoC EG Series 328 I/O0.72V
Price: 0.0000
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XC7Z020-2CLG400I Xilinx
400 Terminations-40°C~100°C TJ 400 Pin XC7Z020 System On ChipZynq?-7000 Series 130 I/O1V
Price: 0.0000
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A2F060M3E-TQG144 Microsemi
0°C~85°C TJ A2F060M3E System On ChipSmartFusion? Series MCU - 21, FPGA - 33 I/O
Price: 0.0000
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M2S150T-1FC1152I Microsemi Corporation
-40°C~100°C TJ M2S150T System On Chip SmartFusion®2 Series 574 I/O 1.2V
Price: 0.0000
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M2S025T-1FGG484M Microsemi
484 Terminations-55°C~125°C TJ System On ChipSmartFusion?2 Series 267 I/O1.2V
Price: 0.0000
RFQ
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