Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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RASW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||||||
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91-7012-9820 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.020 0.51mm | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Spool, 8.8 oz (250g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||||||||
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4944-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2016 | 4944 | Active | Not Applicable | 0.032 0.81mm | ROHS3 Compliant | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn99.5Cu0.5 (99.5/0.5) | 20 AWG, 21 SWG | Spool, 4 oz (113.40g) | Lead Free | 442°F 228°C | Rosin Activated (RA) | ||||||||||
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SMD2SWLF.020 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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24-7080-9710 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Lead Free | 453.59237g | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Sb5 (95/5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 450°F~464°F 232°C~240°C | Rosin Mildly Activated (RMA) | |||||||||||
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92-7058-8842 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.025 0.64mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F 217°C | No-Clean | |||||||||||||
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SMD3SW.020 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 24 AWG, 25 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||||||
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SMD291SNL15T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Jar | 2015 | Active | Not Applicable | 63.5mm | ROHS3 Compliant | No SVHC | 57.15mm | 63.5mm | 15g | Solder Paste, Two Part Mix | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 0.53 oz (15g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||
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92-7068-7678 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.078 1.98mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 12 AWG, 14 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||
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SMD2165-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.012 0.31mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | ||||||||||||||
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WBRC9645 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.062 1.57mm | RoHS Compliant | Wire Solder | Sn96Ag4 (96/4) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | Rosin Activated (RA) | |||||||||||||||||
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24-7050-0066 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.093 2.36mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.3Ag3.7 (96.3/3.7) | 11 AWG, 13 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~444°F 221°C~223°C | Rosin Activated (RA) | ||||||||||||
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4915-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2006 | 4915 | Obsolete | Not Applicable | 0.040 1.02mm | Wire Solder | 65°F~80°F 18°C~27°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 4 oz (113.40g) | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | |||||||||||||
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WB964 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | SUPER-PURE™ | Active | 1 (Unlimited) | RoHS Compliant | Bar Solder | Sn96Ag4 (96/4) | Bar, 1 lb (454g) | Lead Free | 430°F 221°C | |||||||||||||||||||
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04-7012-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Bar | 2007 | E-Bar | Obsolete | Not Applicable | 342.9mm | Non-RoHS Compliant | Lead Free | 25.4mm | 25.4mm | 1.7lbs 771.1g | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1.66 lbs (750g) | Lead Free | 441°F 227°C | ||||||||||
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SMD4300SNL10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | |||||||||||
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70-1002-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Jar | 2005 | HydroMark 531 | Active | Not Applicable | Non-RoHS Compliant | 1.1lbs 499g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||
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4900-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2006 | 4900 | Active | Not Applicable | 0.032 0.81mm | ROHS3 Compliant | Lead Free | 0.25lb 113.4g | 20 AWG | Wire Solder | 65°F~80°F 18°C~27°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Spool, 4 oz (113.40g) | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | |||||||||
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NC191AX50T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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SMD2190 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2013 | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||
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386818 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | Hydro-X | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1lb 453.59g | Wire Solder | 70°F~85°F 20°C~30°C | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||
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91-7068-7615 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||
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1844674 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | HF212 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | Jar, 21.16 oz (600g) | Lead Free | 411°F~424°F 209°C~218°C | No-Clean | ||||||||||||||||
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NC2SWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||||||||
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893358 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Hydro-X | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||||||
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4900P-250G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2014 | 4900 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 35°F~50°F 2°C~10°C | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | |||||||||||||
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07-7068-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | ULTRAPURE® | Active | 1 (Unlimited) | ROHS3 Compliant | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 5 lbs (2.27kg) | Lead Free | 423°F~424°F 217°C~218°C | ||||||||||||||||||
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70-0605-0810 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2011 | EM907 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||
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70-2102-0618 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | R562 | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 49.38 oz (1.4kg) | Leaded | 361°F 183°C | Water Soluble | ||||||||||||||
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SMDLTLFP500T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 17.64 oz (500g) | Lead Free | 281°F 138°C | No-Clean |
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SMD291SNL15T4 Chip Quik Inc.
CHIP QUIK SMD291SNL15T4 SOLDER PASTE, SN, AG, CU, 217DEG C, 15G
Price: 0.0000
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