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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Package / Case | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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24-7068-6417 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 331 | Active | Not Applicable | 0.025 0.64mm | ROHS3 Compliant | Lead Free | 217 | 1lb 453.59g | 22 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | |||||
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91-7059-8843 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2015 | 245 | Obsolete | 1 (Unlimited) | 0.015 0.38mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn95.8Ag3.5Cu0.7 (95.8/3.5/0.7) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Lead Free | No-Clean | |||||||||||||
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16-7068-0040 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 5 lbs (2.27kg) | Lead Free | 423°F~424°F 217°C~218°C | |||||||||||||
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16-5050-0062 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2010 | Solid Core Wire | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn50Pb50 (50/50) | 14 AWG, 16 SWG | Spool, 5 lbs (2.27kg) | Leaded | 361°F~420°F 183°C~216°C | ||||||||||
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90-7068-8851 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.010 0.25mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 30 AWG, 33 SWG | Spool, 3.53 oz (100g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||
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70-0902-0511 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | FL250D | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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NC3SW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean | |||||||||||||
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70-0902-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | FL250D | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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SMD2SW.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 4 oz (113.40g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||||||
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SMDSW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | ||||||||||||
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SMD291AX500T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||
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1354291 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | WS300 | Not For New Designs | Not Applicable | RoHS Compliant | Solder Paste | 35.6°F~46.4°F 2°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||||
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NC191SNL35T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||
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1405650 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | WS300 | Not For New Designs | Not Applicable | RoHS Compliant | Solder Paste | 35.6°F~46.4°F 2°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||||
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RASWLF.031 .7OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21 AWG, 20 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||
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SMD2SWLF.031 .7OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||
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4944-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2016 | 4944 | Active | Not Applicable | 0.032 0.81mm | ROHS3 Compliant | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn99.5Cu0.5 (99.5/0.5) | 20 AWG, 21 SWG | Spool, 4 oz (113.40g) | Lead Free | 442°F 228°C | Rosin Activated (RA) | |||||||
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SMD2050 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.024 0.61mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||
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92-7068-9836 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.025 0.64mm | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||
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4901-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2006 | 4901 | Active | Not Applicable | 0.032 0.81mm | ROHS3 Compliant | Lead Free | 0.25lb 113.4g | 20 AWG | Wire Solder | 65°F~80°F 18°C~27°C | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Spool, 4 oz (113.40g) | Lead Free | 442°F 227°C | No-Clean | ||||||
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SMD2170-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.014 0.36mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||||
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70-4823-0911 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | NP560 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 9 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||
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SMD4300AX250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | Water Soluble | ||||||||||
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SMD2032 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.016 0.40mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||||
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1007354 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | 2000 | LM100 | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Bi58Sn42 (58/42) | Jar, 17.64 oz (500g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||
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SMD291SNL50T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.113lb 51.26g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||
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NC2SW.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||
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SMD3SW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||||
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SMD4300SNL250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||
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TS391SNL10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean |
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NC2SW.015 1OZ Chip Quik Inc.
Solder Solder Wire 60/40 Tin/Lead (Sn60/Pb40) No-Clean .015 1oz
Price: 0.0000
RFQ -
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