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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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07-7033-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | ULTRAPURE® | Active | 1 (Unlimited) | ROHS3 Compliant | Bar Solder | Sn97Ag3 (97/3) | Bar, 5 lbs (2.27kg) | Lead Free | 430°F~435°F 221°C~224°C | ||||||||||||||||||
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18-7000-0045 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | Solid Core Wire | Active | 1 (Unlimited) | 0.045 1.14mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99 (99) | 17 AWG, 18 SWG | Spool, 20 lbs (9.07kg) | Lead Free | |||||||||||||||
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24-6337-7616 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Spool | 2007 | 275 | Obsolete | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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24-6337-9628 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2017 | 285 | Obsolete | 1 (Unlimited) | 0.037 0.94mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 19 AWG, 20 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||||
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SS-S020AS | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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SMDLTLFP250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | Lead Free | 281°F 138°C | No-Clean | |||||||||||||
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SMD2032-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.016 0.40mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||||||
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397952 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | 366 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | 0.551lb 249.93g | 23 AWG | Wire Solder | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | Leaded | 565°F~574°F 296°C~301°C | Rosin Activated (RA) | |||||||||||
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24-6040-0038 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||||
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70-0403-0823 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EnviroMark™ 828 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | ||||||||||||||
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92-6337-7603 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.020 0.51mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||
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SMD291AX250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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70-4823-0911 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | NP560 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 9 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||
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24-6040-8816 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2012 | 245 | Obsolete | 1 (Unlimited) | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | No-Clean | |||||||||||||
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RASW.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Tube, 0.4 oz (11.34g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||||||
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403674 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | 381™ | Not For New Designs | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||||
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RASW.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||||||
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70-0605-0910 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EM907 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||
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SMDAL10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3.5 (96.5/3.5) | Syringe, 0.88 oz (25g), 10cc | Lead Free | 430°F 221°C | Water Soluble | ||||||||||||||
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NC3SW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean | ||||||||||||||||
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NC191LT250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||
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04-7012-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Bar | 2007 | E-Bar | Obsolete | Not Applicable | 342.9mm | Non-RoHS Compliant | Lead Free | 25.4mm | 25.4mm | 1.7lbs 771.1g | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1.66 lbs (750g) | Lead Free | 441°F 227°C | ||||||||||
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SMD2180-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.016 0.40mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||
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84-7068-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 0.118 3.00mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 9 AWG, 11 SWG | Spool, 11.02 lbs (5kg) | Lead Free | 423°F~424°F 217°C~218°C | ||||||||||||||||
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96-6337-9515 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 268 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Date of Manufacture | Sn63Pb37 (63/37) | 26 AWG, 27 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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24-7012-0655 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2007 | OR421 | Obsolete | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | Water Soluble | |||||||||||||
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24-7068-9720 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | 285 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | RoHS Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Mildly Activated (RMA) | ||||||||||||
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389283 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | Hydro-X | Not For New Designs | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | Water Soluble | ||||||||||||||
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981501 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bar | 2000 | Obsolete | Not Applicable | 2.5lbs 1.1kg | Bar Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 2.5 lbs (1.13kg) | Lead Free | 423°F 217°C | ||||||||||||||||||
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SMD291SNL15T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Jar | 2015 | Active | Not Applicable | 63.5mm | ROHS3 Compliant | No SVHC | 57.15mm | 63.5mm | 15g | Solder Paste, Two Part Mix | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 0.53 oz (15g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean |
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SMD291SNL15T4 Chip Quik Inc.
CHIP QUIK SMD291SNL15T4 SOLDER PASTE, SN, AG, CU, 217DEG C, 15G
Price: 0.0000
RFQ