Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TS991AX500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||
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4916-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2006 | 4916 | Obsolete | Not Applicable | 0.050 1.27mm | Wire Solder | 65°F~80°F 18°C~27°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 16 AWG, 18 SWG | Spool, 4 oz (113.40g) | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | ||||||||
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SSLFNC-T5-15G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||
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92-7068-8800 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||
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727190 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C511™ | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 23 AWG, 24 SWG | Spool, 1 lb (454 g) | Lead Free | 440°F~464°F 227°C~240°C | No-Clean | |||||||||
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SSLFNC-T5-250G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||
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91-7012-9820 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.020 0.51mm | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Spool, 8.8 oz (250g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||
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WBNCC633732 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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24-7080-9702 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Sb5 (95/5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 450°F~464°F 232°C~240°C | Rosin Mildly Activated (RMA) | |||||||
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SS-S031AS | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||
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14-6040-0040 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | Solid Core Wire | Active | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | ||||||||
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92-7068-7642 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||
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SMD4300AX250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | Water Soluble | ||||||||
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SMD3SW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||
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24-6337-0017 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.025 0.64mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||
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1405650 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | WS300 | Not For New Designs | Not Applicable | RoHS Compliant | Solder Paste | 35.6°F~46.4°F 2°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||
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92-7068-7678 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.078 1.98mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 12 AWG, 14 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||
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16-7068-0040 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 5 lbs (2.27kg) | Lead Free | 423°F~424°F 217°C~218°C | |||||||||||
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1354225 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | WS300 | Not For New Designs | Not Applicable | RoHS Compliant | Solder Paste | 35.6°F~46.4°F 2°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 2.65 oz (75g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||
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692857 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | 2000 | C511™ | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | 59°F~86°F 15°C~30°C | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | ||||||||
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662727 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | MP218 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Leaded | No-Clean | |||||||||||
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721473 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2016 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Syringe, 1.06 oz (30g) | Lead Free | No-Clean | |||||||||||
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392249 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.064 1.63mm | Non-RoHS Compliant | 1.1lbs 499g | 14 AWG | Wire Solder | 59°F~86°F 15°C~30°C | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||
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386927 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Spool | C400 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1.1lbs 499g | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||
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721472 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 2.65 oz (75g) | Lead Free | 423°F 217°C | No-Clean | |||||||||||
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4900P-250G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2014 | 4900 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 35°F~50°F 2°C~10°C | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | ||||||||
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NC191SNL50T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||
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24-7068-8846 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 245 | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||
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SMD2180-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.016 0.40mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||
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4880-18G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Bulk | 2009 | 4880 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 0.04lb 18.14g | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Tube, 0.63 oz (18g) | Leaded | 361°F 183°C | Rosin Activated (RA) |
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TS991AX500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn63/Pb37 T4 (500g jar)
Price: 0.0000
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