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Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Package / Case | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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92-6337-9756 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.010 0.25mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 30 AWG, 33 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | |||||||||
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70-0202-0311 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EP256HA | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn62Pb36Ag2 (62/36/2) | Cartridge, 21.16 oz (600g) | Leaded | 354°F 179°C | No-Clean | |||||||||||
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4944-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2016 | 4944 | Obsolete | Not Applicable | 0.032 0.81mm | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn99.5Cu0.5 (99.5/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 442°F 228°C | Rosin Activated (RA) | |||||||
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SMDLTLFP50T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.113lb 51.26g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | ||||||||
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24-7050-0075 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.3Ag3.7 (96.3/3.7) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~444°F 221°C~223°C | Rosin Activated (RA) | |||||||||
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4888-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4880 | Active | Not Applicable | 0.062 1.57mm | Non-RoHS Compliant | 062 | 0.5lb 226.8g | 14 AWG | Wire Solder | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||
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24-6337-7614 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 275 | Active | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||
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CQ100GE.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||||
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24-6337-8808 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||
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RASW.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
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24-6337-8846 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||
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92-6040-0038 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 44 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||
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24-7068-1401 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2007 | 48 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Lead Free | 217 | 1lb 453.59g | 24 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | ||||
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SMD2SWLF.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||
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SMDBI100-S-16 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | Bi100(100) | Bag, 1 lb (454g) | Lead Free | 521°F 271°C | ||||||||||||||
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SSLFNC-50G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||
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24-9574-1411 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 48 | Active | 1 (Unlimited) | 0.093 2.36mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 11 AWG, 13 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | Rosin Activated (RA) | |||||||||
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86-6337-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 0.118 3.00mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 9 AWG, 11 SWG | Spool, 5.51 lbs (2.5kg) | Leaded | 361°F 183°C | |||||||||||||
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24-7040-8801 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3.5 (96.5/3.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | No-Clean | ||||||||
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57-3201-5515 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Cartridge | 2003 | R560 | Obsolete | Not Applicable | Non-RoHS Compliant | 2.2lbs 997.9g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 35.27 oz (1kg) | Leaded | 361°F 183°C | Water Soluble | |||||||
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24-7040-1403 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2015 | 48 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | RoHS Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3.5 (96.5/3.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | Rosin Activated (RA) | ||||||||
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70-4722-0910 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | WP601-ZH | Obsolete | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | ||||||||||||
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70-0605-0911 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EM907 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||
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24-6040-8802 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | No-Clean | ||||||||
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SMD2165 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.012 0.31mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||
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RASW.031 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 21 AWG, 20 SWG | Spool, 2 oz (56.70g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
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SMDSWLF.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | 0.062lb 28.12g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||
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SMDSWLF.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | 0.25lb 113.4g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||
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BARSN99.3CU0.7 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (454g) | Lead Free | 441°F 227°C | ||||||||||||||
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554889 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bar | 2000 | Obsolete | Not Applicable | Non-RoHS Compliant | 2lbs 907.2g | Bar Solder | 59°F~86°F 15°C~30°C | Sn63Pb37 (63/37) | Bar, 2 lbs (907g) | Leaded | 361°F 183°C |

















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