Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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TS391LT50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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RASWLF.015 .3OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Tube, 0.3 oz (8.51g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | ||||||||||||||||
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4865-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4860 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 0.5lb 226.8g | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | No-Clean | |||||||||||
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SMD2195 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||
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NC191SNL35 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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SMD2SWLF.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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24-6337-8850 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 245 | Active | 1 (Unlimited) | 0.010 0.25mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 30 AWG, 33 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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4942-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2016 | 4942 | Obsolete | Not Applicable | 0.032 0.81mm | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn99.5Cu0.5 (99.5/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 442°F 228°C | Rosin Activated (RA) | |||||||||||
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2164169 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | LM100 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Bi58Sn42 (58/42) | Jar | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||||
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96-7068-8820 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||
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24-6337-0069 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.125 3.18mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 8 AWG, 10 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
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24-6337-9744 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.010 0.25mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 30 AWG, 33 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||
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70-0605-0811 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2011 | EM907 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||
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4867-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Spool | 2009 | 4860 | Obsolete | Not Applicable | 0.050 1.27mm | Non-RoHS Compliant | 226.796185g | Wire Solder | Sn63Pb37 (63/37) | 16 AWG, 18 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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70-3213-0810 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | NXG1 | Active | 1 (Unlimited) | 25.4μm | ROHS3 Compliant | 25.4μm | 25.4μm | Solder Paste | 32°F~50°F 0°C~10°C | 8 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||
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24-6337-8803 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2012 | 245 | Obsolete | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||
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24-7080-0060 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.062 1.57mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Sb5 (95/5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 450°F~464°F 232°C~240°C | Rosin Activated (RA) | |||||||||||||
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SSNC-T5-50G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Lead Free | 361°F 183°C | No-Clean | ||||||||||||||||
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SMD291SNL250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||||||
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70-4823-0910 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | NP560 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 9 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||
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24-6337-8813 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 245 | Active | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Contains Lead | 1lb 453.59g | 18 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||
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SMD291AX10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Solder | Syringe | 2005 | Active | Not Applicable | 139.7mm | Non-RoHS Compliant | No SVHC | 25.4mm | 76.2mm | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | |||||||
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24-7068-1405 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 48 | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | ||||||||||||
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386844 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | 0.551lb 249.93g | 26 AWG | Wire Solder | 59°F~86°F 15°C~30°C | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | ||||||||||
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4925-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2017 | 4926 | Obsolete | Not Applicable | 0.032 0.81mm | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~430°F 217°C~221°C | Rosin Activated (RA) | |||||||||||
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70-4105-0919 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | NP545 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 24.69 oz (700g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||
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SSLTNC-T5-35G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn42Bi57Ag1 (42/57/1) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 279°F 137°C | No-Clean | ||||||||||||||||
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SMD291SNL50T6 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||||
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70-1608-0820 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2007 | R276 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||
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SMD2016-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.008 0.20mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C |
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24-6337-9744 Kester Solder
285 Rosin Mildly Activated Core 63% Tin 37% Lead Solder Wire
Price: 0.0000
RFQ -
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4867-227G MG Chemicals
Solder;0.050 Dia.;SN63/PB37;1/2 Lbs.;No Clean;Flux Core 2.20%
Price: 0.0000
RFQ -
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SMD291AX10 Chip Quik Inc.
CHIP QUIK SMD291AX10 Solder Paste, No-Clean, 183 C, 35 g
Price: 0.0000
RFQ -
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