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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | REACH SVHC | Height | Width | Weight | Power Rating | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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SMD4300AX10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Syringe | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | Water Soluble | |||||||||||||
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SMDLTLFP | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | No SVHC | 15g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||
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SMD3SW.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||||||
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NC2SW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean | ||||||||||||||||
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SMD291AX500T3C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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WBNCSAC20 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | No-Clean | |||||||||||||||||
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SMDAL200 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3.5 (96.5/3.5) | Jar, 7.05 oz (200g) | Lead Free | 430°F 221°C | Water Soluble | ||||||||||||||
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RASWLF.015 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 4 oz (113.40g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | ||||||||||||||||
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4925-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2017 | 4926 | Obsolete | Not Applicable | 0.032 0.81mm | Wire Solder | 65°F~80°F 18°C~27°C | 60 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~430°F 217°C~221°C | Rosin Activated (RA) | |||||||||||
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583489 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Cartridge | 2000 | MP200 | Obsolete | Not Applicable | Non-RoHS Compliant | 0.055lb 24.95g | Solder Paste | Room Temperature | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 0.88 oz (25g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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NC191SNL250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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SMD2SWLF.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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24-6337-7631 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2015 | 275 | Obsolete | 1 (Unlimited) | 0.010 0.25mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 30 AWG, 33 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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SMDSWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
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NC2SWLF.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||||||||
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SMD2140 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.008 0.20mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||
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SMD2SWLF.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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RASW.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||||||
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SMD2SWLF.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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24-7068-8213 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 88 | Obsolete | 1 (Unlimited) | 0.031 0.79mm | RoHS Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | |||||||||||||
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4902P-15G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | 4902 | Active | Not Applicable | Solder Paste | 35°F~50°F 2°C~10°C | 12 Months | Date of Manufacture | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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CQ100GE.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||||||||
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35232 | Master Appliance Corp. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Solder | Tube | Active | Not Applicable | Non-RoHS Compliant | 300W | Wire Solder | Tube | Lead Free | |||||||||||||||||||
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NC191LT50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||
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SMDSWLTLFP32 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2015 | Active | 1 (Unlimited) | 0.030 0.76mm | ROHS3 Compliant | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 21 AWG, 22 SWG | Lead Free | 281°F 138°C | |||||||||||||||||
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BARSN62PB36AG2-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn62Pb36Ag2 (62/36/2) | Bar, 0.5 lb (227g) | Leaded | 354°F 179°C | ||||||||||||||||||
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24-6337-9758 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2012 | 285 | Obsolete | 1 (Unlimited) | 0.032 0.81mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||
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SMDLTLFP60T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | 2015 | Active | Not Applicable | 76.2mm | ROHS3 Compliant | No SVHC | 76.2mm | 76.2mm | 60g | Solder Paste, Two Part Mix | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 2.12 oz (60g) | Lead Free | 281°F 138°C | No-Clean | |||||||||
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SMDSW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | |||||||||||||||
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15-7000-0050 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Solid Core Wire | Active | 1 (Unlimited) | 0.050 1.27mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99 (99) | 16 AWG, 18 SWG | Spool, 4 lbs (1.81kg) | Lead Free |
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SMDLTLFP60T4 Chip Quik Inc.
CHIP QUIK SMDLTLFP60T4 SOLDER PASTE, SN, BI, AG, 138DEG C, 60G
Price: 0.0000
RFQ -
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