
Items : %s%s
Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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CQ-SS-SNBIAG-0.60MM-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||
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TS991SNL35T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||
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07-7031-1900 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | ULTRAPURE® | Active | 1 (Unlimited) | ROHS3 Compliant | Lead Free | Bar Solder | Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2) | Bar, 7.4 lbs (3.36kg) | Lead Free | ||||||||||||||||||
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SSLTNC-T5-35G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn42Bi57Ag1 (42/57/1) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 279°F 137°C | No-Clean | |||||||||||||||||
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NCSWLF.015 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||
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TS991SNL500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||
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848874 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | 2000 | C502 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | 361°F 183°C | No-Clean | |||||||||||||||||
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NC191AX15T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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RASWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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23-6040-0018 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Spool | 2006 | 44 | Obsolete | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | 0.5lb 226.8g | 22 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 22 AWG, 23 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | |||||||||||
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18-6337-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Solid Core Wire | Obsolete | 1 (Unlimited) | 0.118 3.00mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 9 AWG, 11 SWG | Spool, 20 lbs (9.07kg) | Leaded | 361°F 183°C | ||||||||||||||
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BARSN63PB37-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn63Pb37 (63/37) | Bar, 0.5 lb (227g) | Leaded | 361°F 183°C | |||||||||||||||||||
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SMDLTLFP10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||
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SSLTNC-35G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn42Bi57Ag1 (42/57/1) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 279°F 137°C | No-Clean | |||||||||||||||||
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WBNCSAC32 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.032 0.81mm | RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | No-Clean | ||||||||||||||||||
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SSLTNC-10G-SQ | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn42Bi57Ag1 (42/57/1) | Bag, 0.35 oz (10g) | Lead Free | 279°F 137°C | No-Clean | |||||||||||||||||
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WB63/37 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | SUPER-PURE™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Bar Solder | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | 361°F 183°C | |||||||||||||||||||||
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WBNCSAC20-2OZ | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 2 oz (56.70g) | Lead Free | 430°F 221°C | No-Clean | ||||||||||||||||||
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SSLFNC-50G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||||
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386874 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C400 | Active | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | Wire Solder | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | No-Clean | ||||||||||||||||||
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4901-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2006 | 4901 | Active | Not Applicable | 0.032 0.81mm | ROHS3 Compliant | Lead Free | 1lb 453.59g | 20 AWG | Wire Solder | 65°F~80°F 18°C~27°C | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 442°F 227°C | No-Clean | ||||||||||
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RASWLF.015 .3OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Tube, 0.3 oz (8.51g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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SMD2165 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.012 0.31mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||
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SMD2SW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||||||||||
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SMDSWLT.040 10G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.040 1.02mm | ROHS3 Compliant | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 18 AWG, 19 SWG | Spool, 0.35 oz (10g) | Lead Free | 280°F 138°C | No-Clean, Rosin Activated (RA) | ||||||||||||||||
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SMDSWLF.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||||||
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SMD2SW.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||||||
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SMD291SNL10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Solder | Syringe | 2009 | Active | Not Applicable | 127mm | ROHS3 Compliant | 217 | No SVHC | 25.4mm | 76.2mm | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||
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SMDSWLF.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | 0.062lb 28.12g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||||
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SMD3SW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean, Water Soluble |
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CQ-SS-SNBIAG-0.60MM-25000 Chip Quik Inc.
Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.60mm diameter 25K Bottle
Price: 0.0000
RFQ -
TS991SNL35T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe)
Price: 0.0000
RFQ -
07-7031-1900 Kester Solder
SN97AG.20SB.80CU02 FLO-BAR Solder - Sold IN 50 LB Boxes
Price: 0.0000
RFQ -
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NCSWLF.015 1LB Chip Quik Inc.
Solder LF Solder Wire 96.5/3/0.5 Tin/Silver/Copper No-Clean .015 1lb
Price: 0.0000
RFQ -
TS991SNL500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)
Price: 0.0000
RFQ -
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BARSN63PB37-8OZ Chip Quik Inc.
BARSN63PB37-8OZ datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
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SMD291SNL10 Chip Quik Inc.
CHIP QUIK SMD291SNL10 Solder Paste, No-Clean, 217 C, 35 g
Price: 0.0000
RFQ -
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