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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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70-1003-0519 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | HydroMark 531 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 24.69 oz (700g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||||||
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24-6040-8815 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 245 | Active | 1 (Unlimited) | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | No-Clean | ||||||||||||
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SSLTNC-250G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn42Bi57Ag1 (42/57/1) | Jar, 8.8 oz (250g) | Lead Free | 279°F 137°C | No-Clean | ||||||||||||||||
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SMD2SW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||||||
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WBRC63/3732 | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||||||
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NC191LT50T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 1.76 oz (50g) | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||
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SMDIN52SN48-R | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Ribbon Solder | In52Sn48 (52/48) | Spool | Lead Free | 244°F 118°C | ||||||||||||||||||
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18-7000-0078 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Solid Core Wire | Active | 1 (Unlimited) | 0.078 1.98mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn99 (99) | 12 AWG, 14 SWG | Spool, 20 lbs (9.07kg) | Lead Free | ||||||||||||||||
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24-7340-0009 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 565°F~574°F 296°C~301°C | Rosin Activated (RA) | ||||||||||||
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24-7150-8802 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean | ||||||||||||
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SMD2SWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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SS-S031AS | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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673828 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.022 0.56mm | RoHS Compliant | 0.55lb 249.48g | 23 AWG | Wire Solder | 59°F~86°F 15°C~30°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F 217°C | No-Clean | ||||||||||
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24-9574-1406 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2007 | 48 | Active | Not Applicable | 0.025 0.64mm | ROHS3 Compliant | Lead Free | 0101 | 453.59237g | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | Rosin Activated (RA) | |||||||||
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70-2102-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Jar | 2004 | R562 | Active | Not Applicable | Non-RoHS Compliant | 1.1lbs 499g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||
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733010 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | C511™ | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | ||||||||||||||||
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SMDSW.020 8OZ | Chip Quik Inc. | 24.6290 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | No-Clean, Water Soluble | ||||||||||||||||
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SMDPB100-S-16 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | Non-RoHS Compliant | Solder Shot | Pb100(100) | Bag, 1 lb (454g) | Leaded | 622°F 328°C | ||||||||||||||||||
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NC191SNL35T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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85-9601-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 0.118 3.00mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 9 AWG, 11 SWG | Spool, 22.05 lbs (10kg) | Leaded | 361°F 183°C | |||||||||||||||||
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397982 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C502 | Obsolete | Not Applicable | 0.015 0.38mm | Non-RoHS Compliant | 0.551lb 249.93g | 26 AWG | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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TS391SNL250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||||||
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SMD3SW.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||||||
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NC2SWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | ||||||||||||||||
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24-6337-9715 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||
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TS391SNL | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||||||
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NC191SNL50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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SMDLTLFP15T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Jar | 2015 | Active | Not Applicable | 63.5mm | ROHS3 Compliant | No SVHC | 57.15mm | 63.5mm | 15g | Solder Paste, Two Part Mix | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 0.53 oz (15g) | Lead Free | 281°F 138°C | No-Clean | ||||||||
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70-0102-0618 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EP256 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 49.38 oz (1.4kg) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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24-7150-9710 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | Rosin Mildly Activated (RMA) |
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SMDSW.020 8OZ Chip Quik Inc.
SMDSW.020 8OZ datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 24.6290
RFQ -
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SMDLTLFP15T4 Chip Quik Inc.
CHIP QUIK SMDLTLFP15T4 SOLDER PASTE, SN, BI, AG, 138DEG C, 15G
Price: 0.0000
RFQ -
70-0102-0618 Kester Solder
70-0102-0618 datasheet pdf and Solder product details from Kester Solder stock available at Utmel
Price: 0.0000
RFQ -
24-7150-9710 Kester Solder
285 Rosin Mildly Activated Core 62% Tin 36% Lead 2% Silver Solder Wire
Price: 0.0000
RFQ