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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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SMDAG100-S-1 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | Ag100(100) | Bag, 1 oz (28g) | Lead Free | 1762°F 961°C | ||||||||||||||||||
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SMD2185-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.018 0.46mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||
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SMD3SW.031 .7OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 21 SWG | Tube, 0.7 oz (19.85g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||||||
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SMDSW.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | No-Clean, Water Soluble | ||||||||||||||||
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4915-112G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2006 | 4915 | Obsolete | Not Applicable | 0.040 1.02mm | Wire Solder | 65°F~80°F 18°C~27°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 4 oz (113.40g) | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | |||||||||||||
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24-6337-8213 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | 88 | Obsolete | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | ||||||||||||
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24-7068-6411 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 331 | Active | Not Applicable | 0.062 1.57mm | ROHS3 Compliant | Lead Free | 062 | 1lb 453.59g | 14 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | ||||||||
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24-5050-0068 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.125 3.18mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn50Pb50 (50/50) | 8 AWG, 10 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~420°F 183°C~216°C | Rosin Activated (RA) | ||||||||||||
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SMDLTLFP10T5 | Chip Quik Inc. | 25.7828 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||||
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70-1302-0511 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | R231 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | |||||||||||||||
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4860-18G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Bulk | 2009 | 4860 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 0.04lb 18.14g | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Tube, 0.63 oz (18g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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4887-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4880 | Active | Not Applicable | 0.050 1.27mm | Non-RoHS Compliant | 1lb 453.59g | 16 AWG | Wire Solder | Sn63Pb37 (63/37) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||
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4894-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4890 | Active | Not Applicable | 0.025 0.64mm | Non-RoHS Compliant | 0.5lb 226.8g | 22 AWG | Wire Solder | Sn60Pb40 (60/40) | 22 AWG, 23 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F~376°F 183°C~191°C | Rosin Activated (RA) | |||||||||||
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4912-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2006 | 4912 | Obsolete | Not Applicable | 0.020 0.51mm | Wire Solder | 65°F~80°F 18°C~27°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | |||||||||||||
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NC191AX50T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 1.76 oz (50g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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24-6337-9713 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 285 | Active | Not Applicable | 0.031 0.79mm | 82.55mm | Non-RoHS Compliant | Contains Lead | 63.5mm | 82.55mm | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||
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70-1709-0820 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | R500 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | ||||||||||||||
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24-6337-9717 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.025 0.64mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||
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04-0595-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | Active | 1 (Unlimited) | Non-RoHS Compliant | Bar Solder | Pb95Sn5 (95/5) | Bar, 1.66 lbs (750g) | Leaded | 574°F~597°F 301°C~314°C | ||||||||||||||||||
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MMF006620 | Micro-Measurements (Division of Vishay Precision Group) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb36.65Sb0.35 (63/36.65/0.35) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||||||
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SMD2SWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||
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SMD2195-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||
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4915-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Spool | 2006 | 4915 | Obsolete | Not Applicable | 0.040 1.02mm | Wire Solder | 65°F~80°F 18°C~27°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~430°F 217°C~221°C | No-Clean | |||||||||||||
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SMD2200-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | ||||||||||||||
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SMD2SWLF.020 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 2 oz (56.70g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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NC191SNL50 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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SS-S031AS | Easy Braid Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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24-7150-8802 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean | ||||||||||||
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70-2102-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Jar | 2004 | R562 | Active | Not Applicable | Non-RoHS Compliant | 1.1lbs 499g | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||
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70-0403-0910 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EnviroMark™ 828 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble |
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SMDLTLFP10T5 Chip Quik Inc.
SMDLTLFP10T5 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 25.7828
RFQ -
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4860-18G MG Chemicals
Solder,22 AWG,0.032 DIA,SN63/PB37,0.6 OZ,NO CLEAN;Pocket Pak Solder
Price: 0.0000
RFQ -
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MMF006620 Micro-Measurements (Division of Vishay Precision Group)
361A-20R SOLDER TIN-LEAD-ANTIMON
Price: 0.0000
RFQ -
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