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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Lifecycle Status Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Connector Type Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Number of Poles Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Reach Compliance Code Lead Pitch Height Width Housing Color Mounting Type Weight Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Max Current Rating Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Body Material Body Length or Diameter Body Breadth Insulation Material Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Circuit Application Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Max Voltage Rating (AC) Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Current Rating Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post
20-8190-310C 20-8190-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 20 EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 20 (2 x 10) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
2-2129710-6 2-2129710-6 TE Connectivity AMP Connectors 36.2465
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0.00000000 download 5 Weeks ACTIVE (Last Updated: 3 days ago) Solder, Surface Mount Thermoplastic Tray 2016 Active Not Applicable Solder 105°C -25°C Gold 1823 RoHS Compliant UL94 V-0 500mA Black Surface Mount LGA Open Frame Signal 0.5A UL94 V-0 30.0μin 0.76μm 500mA 3647 Copper Alloy Copper Alloy
614-93-624-31-018000 614-93-624-31-018000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 614 no Active 1 (Unlimited) Solder EAR99 Gold Straight 17.7mm 24 30.5mm Non-RoHS Compliant Copper 3A 24 DIP SOCKET 2.79mm 17.8mm Through Hole -55°C~125°C 150V 8536.90.40.00 10mOhm 10GOhm DIP, 0.6 (15.24mm) Row Spacing e0 Polychlorinated 2 Carrier, Open Frame 15.24 mm 0.100 2.54mm Tin-Lead 30.0μin 0.76μm 200.0μin 5.08μm 24 (2 x 12) Beryllium Copper Brass Alloy 0.170 4.32mm 0.100 2.54mm
12-6513-10T 12-6513-10T Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 12 EAR99 Gold 12 ROHS3 Compliant UL94 V-0 3A LOW PROFILE; UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.175mm e3 0.7 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 12 (2 x 6) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
06-1518-00 06-1518-00 Aries Electronics 1.0915
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 Active 1 (Unlimited) Solder EAR99 Gold 6 ROHS3 Compliant UL94 V-0 3A 6 STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.2 (5.08mm) Row Spacing 3.175mm e4 105°C 0.3 inch 2 RECTANGULAR 0.1 inch RND PIN-SKT 0.1 inch Open Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 6 (2 x 3) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
40-3553-10 40-3553-10 Aries Electronics 0.0000
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0.00000000 download 4 Weeks Polyphenylene Sulfide (PPS), Glass Filled Bulk 2013 55 yes Active 1 (Unlimited) Solder EAR99 Tin 40 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing e3 Closed Frame 1A UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 200.0μin 5.08μm 40 (2 x 20) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
110-43-210-10-002000 110-43-210-10-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 2013 110 yes Active 1 (Unlimited) Solder EAR99 Gold 8 ROHS3 Compliant Lead Free 8 Through Hole -55°C~125°C DIP, 0.2 (5.08mm) Row Spacing e3 Open Frame 3A 0.100 2.54mm 30.0μin 0.76μm 30.0μin 0.76μm 10 (2 x 5), 8 Loaded Beryllium Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm
4814-3000-CP 4814-3000-CP 3M 0.0000
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0.00000000 download 9 Weeks Through Hole Polyester, Glass Filled Tube 2006 4800 Active 1 (Unlimited) DIP, Socket Solder 14 85°C -25°C Female Tin Straight 10.16mm 14 17.65mm RoHS Compliant UL94 V-0 Lead Free Nickel, Tin Tin 1A 14 Unknown 5.207mm 10.16mm Through Hole -25°C~85°C 100V 5GOhm DIP, 0.3 (7.62mm) Row Spacing Polyester 2 Open Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Tin 35.4μin 0.90μm 35.0μin 0.90μm 14 (2 x 7) Phosphor Bronze Phosphor Bronze 0.100 2.54mm
200-6325-9UN-1900 200-6325-9UN-1900 3M 0.0000
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0.00000000 download 8 Weeks Through Hole Polyethersulfone (PES) Bulk 2001 Textool™ Active 1 (Unlimited) Solder 150°C -55°C Gold 625 RoHS Compliant Lead Free Gold, Nickel Gold 1A 625 76.2mm Through Hole 453.59237g -55°C~150°C PGA, ZIF (ZIP) 25 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm 625 (25 x 25) Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm
24-3575-18 24-3575-18 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 24 EAR99 Tin 24 ROHS3 Compliant UL94 V-0 1A UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 2.794mm Closed Frame UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 200.0μin 5.08μm 24 (2 x 12) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
19-0501-20 19-0501-20 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 501 Active 1 (Unlimited) Wire Wrap 19 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1A SIP 2.54mm Through Hole -55°C~105°C SIP 10.668mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Tin 200.0μin 5.08μm 200.0μin 5.08μm 19 (1 x 19) Phosphor Bronze Phosphor Bronze 0.420 10.67mm 0.100 2.54mm
522-93-441-21-000002 522-93-441-21-000002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
515-93-072-11-042003 515-93-072-11-042003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 72 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA72
110-91-632-41-605000 110-91-632-41-605000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant IC SOCKET
DIP628-001BLF DIP628-001BLF Amphenol ICC (FCI) 0.0000
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0.00000000 Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Tube 2007 Obsolete 1 (Unlimited) DIP, Socket Solder EAR99 Gold Straight 17.78mm 28 35.56mm RoHS Compliant UL94 V-0 Copper 17.8mm Through Hole 8536.69.40.40 DIP, 0.6 (15.24mm) Row Spacing 3.175mm e3 0.7 inch Polychlorinated 2 RECTANGULAR RND PIN-SKT 0.1 inch Open Frame UL94 V-0 15.24 mm 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 28 (2 x 14) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
3-1437532-4 3-1437532-4 TE Connectivity AMP Connectors 0.0000
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0.00000000 Through Hole 2005 500 Obsolete 1 (Unlimited) Wire Wrap EAR99 Gold Straight 28 RoHS Compliant Lead Free Through Hole 8536.69.40.40 DIP, 0.6 (15.24mm) Row Spacing Closed Frame UL94 V-0 0.100 2.54mm 28 (2 x 14) 0.510 12.95mm 0.100 2.54mm
126-91-624-41-002000 126-91-624-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks 2016 Active Non-RoHS Compliant IC SOCKET
223-33-306-41-101000 223-33-306-41-101000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 PLASTIC yes Active EAR99 GOLD (30) OVER NICKEL (100) 6 Non-RoHS Compliant NOT SPECIFIED DIP SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET DIP6
126-41-650-41-002000 126-41-650-41-002000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 download 3 Weeks Active ROHS3 Compliant IC SOCKET
48-6551-16 48-6551-16 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Polyphenylene Sulfide (PPS), Glass Filled Bulk 2013 55 yes Active 1 (Unlimited) Solder EAR99 Nickel Boron 48 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing Closed Frame 1A UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 48 (2 x 24) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
115-43-422-61-001000 115-43-422-61-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
614-13-101-13-061001 614-13-101-13-061001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 101 ROHS3 Compliant NOT SPECIFIED LOW PROFILE 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA101
218-3341-00-0602J 218-3341-00-0602J 3M 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled Tube 2000 Textool™ Active 1 (Unlimited) DIP Press-Fit 18 150°C -55°C Female Gold Straight 15.2mm 18 18 50.1mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 18 DIP No SVHC 2.54mm 11.9mm Connector -55°C~125°C 1GOhm DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing Glass, Polysulfone Polysulfone 2 Closed Frame 2.54mm 1A UL94 V-0 7.62 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm 18 (2 x 9) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
511-91-072-09-001001 511-91-072-09-001001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (10) OVER NICKEL (100) 72 Non-RoHS Compliant BERYLLIUM COPPER PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA72
XR2A-2811-N XR2A-2811-N Omron Electronics Inc-EMC Div 0.0000
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0.00000000 download 10 Weeks Through Hole Polybutylene Terephthalate (PBT), Glass Filled Bulk 2002 XR2 Active 1 (Unlimited) Solder EAR99 Female Gold Straight 17.78mm 28 35.56mm RoHS Compliant Copper 1A Through Hole -55°C~125°C 300V 8536.69.40.40 20mOhm 1GOhm 1A DIP, 0.6 (15.24mm) Row Spacing e4 Polybutylene 2 Open Frame UL94 V-0 15.24 mm 300V 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 28 (2 x 14) Beryllium Copper Beryllium Copper 0.126 3.20mm 0.100 2.54mm
48-6553-18 48-6553-18 Aries Electronics 0.0000
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0.00000000 6 Weeks Polyetheretherketone (PEEK), Glass Filled Bulk 55 yes Active 1 (Unlimited) Solder EAR99 Nickel Boron 48 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole -55°C~250°C 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.54mm 2.99 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V Closed Frame 1A UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 48 (2 x 24) Beryllium Nickel Beryllium Nickel 0.110 2.78mm 0.100 2.54mm
5916716-1 5916716-1 TE Connectivity AMP Connectors 0.0000
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0.00000000 download Thermoplastic Tray Obsolete 1 (Unlimited) Solder EAR99 Gold 321 STANDARD: UL 94V-0, LOW PROFILE unknown Through Hole 8536.69.40.40 PGA, ZIF (ZIP) e3 Open Frame UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 30.0μin 0.76μm 321 (19 x 19) Copper Alloy Copper Alloy 0.080 2.03mm 0.100 2.54mm
511-91-072-09-001003 511-91-072-09-001003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
116-41-628-41-003000 116-41-628-41-003000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant IC SOCKET
28-3574-10 28-3574-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 28 EAR99 Gold 28 ROHS3 Compliant UL94 V-0 Gold, Tin 1A STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 2.794mm e3 Closed Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 28 (2 x 14) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
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