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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface Reach Compliance Code Density Frequency Height Width Mounting Type Operating Temperature Technology Operating Mode Height Seated (Max) HTS Code Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Ambient Temperature Range High Supplier Device Package Max Junction Temperature (Tj) Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Access Time (Max) Programmable Type Data Retention Time-Min Endurance Write Protection
    EPCS16SI8N EPCS16SI8N Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 2010 EPCS Obsolete 3 (168 Hours) 8 3A991.B.1.B.1 4.9mm RoHS Compliant 8-SOIC (0.154, 3.90mm Width) compliant 40MHz 1.75mm 3.9mm Surface Mount -40°C~85°C CMOS SYNCHRONOUS 8542.32.00.51 1 e4 Nickel/Palladium/Gold (Ni/Pd/Au) DUAL GULL WING 260 3.3V 30 EPCS16 YES 1.27mm R-PDSO-G8 3V Not Qualified 3.3V 3.6V 85°C 135°C 16Mb FLASH 0.015mA 2.7V~3.6V 16MX1 1 16777216 bit SERIAL In System Programmable 100000 Write/Erase Cycles
    AT17LV128-10NC AT17LV128-10NC Rochester Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube Obsolete 1 (Unlimited) Non-RoHS Compliant 8-SOIC (0.154, 3.90mm Width) Surface Mount 0°C~70°C 8-SOIC 128kb 3V~3.6V 4.75V~5.25V Serial EEPROM
    XC17S200AVQ44C XC17S200AVQ44C Rochester Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray no Obsolete 3 (168 Hours) 44 10mm Non-RoHS Compliant 44-TQFP unknown 10mm Surface Mount 0°C~70°C CMOS SYNCHRONOUS 1.2mm 1 e0 TIN LEAD QUAD GULL WING 225 3.3V 30 44 YES 0.8mm S-PQFP-G44 3V COMMERCIAL 3.6V 2Mb 3V~3.6V 1335840X1 1 1335840 bit CONFIGURATION MEMORY SERIAL OTP
    AT17LV002-10TQU AT17LV002-10TQU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Tray 1997 yes Active 3 (168 Hours) 44 10mm ROHS3 Compliant Tin 44 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 44-TQFP 2-Wire, Serial 2 Mb 15MHz 10mm Surface Mount -40°C~85°C CMOS SYNCHRONOUS 1.2mm 1 10mA e3 QUAD GULL WING 260 3.3V 40 AT17LV002 0.8mm 3V Not Qualified 3.3/5V 3.6V EEPROM 3V~3.6V 4.5V~5.5V 2MX1 1 0.00035A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
    EPC1PC8CC EPC1PC8CC Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube EPC Obsolete 1 (Unlimited) 8-DIP (0.300, 7.62mm) Through Hole 0°C~70°C EPC1 8-PDIP 1Mb 3V~3.6V 4.75V~5.25V OTP
    XC18V01SOG20C XC18V01SOG20C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Tube 1999 yes Active 3 (168 Hours) 20 EAR99 3.3V 12.827mm ROHS3 Compliant Lead Free No 20 20-SOIC (0.295, 7.50mm Width) 1 Mb 7.5184mm Surface Mount 0°C~70°C CMOS 2.6416mm 1 e3 Matte Tin (Sn) DUAL GULL WING 260 3.3V 30 XC18V01 20 YES 1.27mm 3V Flash Memories 3.6V 0.025mA 3V~3.6V 128KX8 8 CONFIGURATION MEMORY PARALLEL/SERIAL 33MHz 0.01A 15 ns In System Programmable 20
    AT17LV65-10PI AT17LV65-10PI Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1997 Obsolete 1 (Unlimited) Non-RoHS Compliant 8-DIP (0.300, 7.62mm) Through Hole -40°C~85°C AT17LV65 8-PDIP 64kb 3V~3.6V 4.5V~5.5V Serial EEPROM
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