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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface REACH SVHC Reach Compliance Code Density Frequency Height Width Mounting Type Weight Operating Temperature Technology Operating Supply Current Operating Mode Height Seated (Max) HTS Code Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Output Characteristics Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Programmable Type Data Retention Time-Min Endurance Write Protection Write Cycle Time-Max (tWC) I/O Type
    XQ17V16-DIE0628 XQ17V16-DIE0628 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Non-RoHS Compliant
    XC1765ELPC20C XC1765ELPC20C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 2000 no Obsolete 3 (168 Hours) 20 EAR99 8.9662mm Non-RoHS Compliant Contains Lead 20 USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS 20-LCC (J-Lead) not_compliant 8.9662mm Surface Mount 0°C~70°C CMOS SYNCHRONOUS 4.572mm 8542.32.00.61 1 e0 Tin/Lead (Sn85Pb15) QUAD J BEND 225 3.3V 30 XC1765EL 20 YES 1.27mm 3V Not Qualified 3.3V 3.6V 3-STATE 65kb 0.005mA 3V~3.6V 64KX1 1 65536 bit CONFIGURATION MEMORY SERIAL 2.5MHz 0.00005A OTP COMMON
    AT17F16A-30CU AT17F16A-30CU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 17 Weeks Surface Mount Tube 1997 yes Active 3 (168 Hours) 8 3.3V 5.99mm ROHS3 Compliant Lead Free Gold No 8 8-TDFN 2-Wire, Serial 16 Mb 10MHz 5.99mm Surface Mount -40°C~85°C CMOS 1.14mm 1 50mA e4 DUAL 260 3.3V 40 AT17F16A 1.27mm 2.97V 3.63V 2.97V~3.63V 16MX1 1 CONFIGURATION MEMORY FLASH 0.03ms
    XC17S10XLPD8C XC17S10XLPD8C Xilinx Inc. 6.7762
    Add to Cart

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1999 Obsolete Not Applicable 8 EAR99 9.3599mm Non-RoHS Compliant Contains Lead 8 8-DIP (0.300, 7.62mm) not_compliant 7.62mm Through Hole 0°C~70°C CMOS SYNCHRONOUS 4.5974mm 1 e0 DUAL 3.3V XC17S10XL 8 NO 2.54mm 3V Not Qualified 3.3V 3.6V 3-STATE 100kb 0.005mA 3V~3.6V 95752X1 1 95752 bit MEMORY CIRCUIT 10MHz 0.00005A OTP COMMON
    AT17LV256-10PU AT17LV256-10PU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Through Hole Tube 1997 yes Active 1 (Unlimited) 8 10.16mm ROHS3 Compliant Lead Free No 8 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 8-DIP (0.300, 7.62mm) 2-Wire No SVHC 256 kb 12.5MHz 5.334mm 7.11mm Through Hole 930.006106mg -40°C~85°C CMOS 10mA 1 10mA e3 Matte Tin (Sn) - annealed DUAL 3.3V AT17LV256 2.54mm 3V 3.3V 3.6V 256Kb EEPROM 3V~3.6V 4.5V~5.5V 256KX1 0.00015A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
    EPC2LC20N EPC2LC20N Intel 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 2014 EPC Obsolete 3 (168 Hours) 20 EAR99 8.9662mm RoHS Compliant IT CAN ALSO OPERATE AT 5V SUPPLY 20-LCC (J-Lead) compliant 8.9662mm Surface Mount 0°C~70°C CMOS SYNCHRONOUS 4.572mm 8542.32.00.51 1 e3 Matte Tin (Sn) - annealed QUAD J BEND 245 3.3V 40 EPC2 YES 1.27mm S-PQCC-J20 3V Flash Memories Not Qualified 3.3/5V 3.6V 1.6Mb 0.05mA 3V~3.6V 4.75V~5.25V 1695680X1 1 1695680 bit CONFIGURATION MEMORY SERIAL 12.5MHz 0.0001A In System Programmable
    AT17LV256-10NU AT17LV256-10NU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 14 Weeks Surface Mount Tube 1997 yes Active 1 (Unlimited) 8 5V 5mm ROHS3 Compliant Lead Free No 8 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 8-SOIC (0.154, 3.90mm Width) 2-Wire, Serial No SVHC 256 kb 33MHz 1.5mm 3.99mm Surface Mount -40°C~85°C CMOS 10mA 1 10mA e3 Matte Tin (Sn) - annealed DUAL GULL WING 260 3.3V 40 AT17LV256 1.27mm 3V 3.3V 3.6V 256Kb EEPROM 3V~3.6V 4.5V~5.5V 256KX1 0.00015A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
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