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Configuration Proms for FPGAs
Additional Feature
- 4 WIRE INTERFACE TO FLEX 8000 DEVICES
- ALSO OPERATES AT 5V SUPPLY
- IT CAN ALSO OPERATE AT 5V SUPPLY
- IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
- IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
- USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS
Contact Plating
- Copper, Silver, Tin
- Gold
- Lead, Tin
- Tin
ECCN Code
- 3A001.A.2.C
- 3A001.B.1.A
- 3A991.B.1
- 3A991.B.1.A
- 3A991.B.1.B.1
- 3A991.B.2.A
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 25 Weeks
- 30 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
HTS Code
- 8542.32.00.51
- 8542.32.00.61
- 8542.32.00.71
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
Manufacturer Package Identifier
- XCF02SVOG20C
Max Operating Temperature
- 125°C
- 70°C
- 85°C
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2 (1 Year)
- 3
- 3 (168 Hours)
- Not Applicable
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 100
- 16
- 20
- 24
- 32
- 44
- 48
- 64
- 8
- 88
Number of Terminals
- 100
Number of Terminations
- 100
- 16
- 20
- 24
- 32
- 44
- 48
- 64
- 8
- 88
Operating Temperature
- -40°C~85°C
- 0°C~70°C
Package / Case
- 100-BQFP
- 16-SOIC (0.295, 7.50mm Width)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 24-LBGA
- 24-TBGA
- 32-TQFP
- 44-LCC (J-Lead)
- 44-TQFP
- 48-TFBGA, CSPBGA
- 48-TFSOP (0.724, 18.40mm Width)
- 64-TBGA
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-TDFN
- 88-LFBGA
- FBGA
- PDIP
- PLCC
- PQFP
- SOIC
Packaging
- Bulk
- Tray
- Tube
Part Status
- Active
- Discontinued
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2004
- 2005
- 2006
- 2007
- 2008
- 2010
- 2014
- 2015
- 2016
- 2017
- 2018
Series
- EPC
- EPCQ
- EPCQ-A
- EPCQ-L
- EPCS
- EPCV
Subcategory
- Flash Memories
- OTP ROMs
Supplier Device Package
- 100-PQFP (20x14)
- 16-SOIC
- 20-PLCC (9x9)
- 20-SOIC
- 20-TSSOP
- 32-TQFP (7x7)
- 44-PLCC (16.6x16.6)
- 44-TQFP (10x10)
- 8-LAP
- 8-LAP (6x6)
- 8-PDIP
- 8-SOIC
- 8-TSOP
- 88-UBGA (11x8)
Surface Mount
- NO
- YES
Technology
- CMOS
- MOS
Terminal Finish
- MATTE TIN
- MATTE TIN (472) OVER COPPER
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL (39) PALLADIUM (2) GOLD
- NICKEL PALLADIUM GOLD
- Nickel/Gold (Ni/Au)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Termination
- SMD/SMT
- Through Hole
Type
- NOR TYPE
Weight
- 1.758804g
- 540.001716mg
- 665.986997mg
- 722.005655mg
- 930.006106mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Reach Compliance Code | Density | Width | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Memory Size | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Programmable Type | Data Retention Time-Min | Endurance | I/O Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
XC18V02PC44C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 1998 | no | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 16.5862mm | Non-RoHS Compliant | Contains Lead | No | 44 | 44-LCC (J-Lead) | 2 Mb | 16.5862mm | Surface Mount | 0°C~70°C | CMOS | 4.572mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 30 | XC18V02 | 44 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 256KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 20MHz | 0.01A | 20 ns | In System Programmable | 20 | 20000 Write/Erase Cycles | ||||||||||||||
 |
XC18V01SOG20C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 1999 | yes | Active | 3 (168 Hours) | 20 | EAR99 | 3.3V | 12.827mm | ROHS3 Compliant | Lead Free | No | 20 | 20-SOIC (0.295, 7.50mm Width) | 1 Mb | 7.5184mm | Surface Mount | 0°C~70°C | CMOS | 2.6416mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 3.3V | 30 | XC18V01 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 128KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 20 | |||||||||||||||
 |
XC17S50APD8C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1999 | no | Obsolete | Not Applicable | 8 | EAR99 | 3.3V | 9.3599mm | Non-RoHS Compliant | Contains Lead | No | 8 | 8-DIP (0.300, 7.62mm) | 1 Mb | 7.62mm | Through Hole | 0°C~70°C | CMOS | 4.5974mm | 1 | e0 | DUAL | 225 | 3.3V | 30 | XC17S50A | 8 | NO | 2.54mm | 3V | 3.6V | 3-STATE | 500kb | 0.015mA | 3V~3.6V | 559200X1 | 1 | CONFIGURATION MEMORY | SERIAL | 0.001A | OTP | COMMON | |||||||||||||||||||
 |
XC18V512PCG20C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 1999 | yes | Active | 3 (168 Hours) | 20 | EAR99 | 3.3V | 8.9662mm | ROHS3 Compliant | No | 20 | 20-LCC (J-Lead) | 512 kb | 8.9662mm | Surface Mount | 0°C~70°C | CMOS | 4.572mm | 1 | e3 | Matte Tin (Sn) | QUAD | J BEND | 245 | 3.3V | 30 | XC18V512 | 20 | YES | 1.27mm | 3V | Flash Memories | 3.6V | 0.025mA | 3V~3.6V | 64KX8 | 8 | CONFIGURATION MEMORY | PARALLEL/SERIAL | 33MHz | 0.01A | 15 ns | In System Programmable | 20 | ||||||||||||||||
|
XC17S20PD8C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1999 | no | Obsolete | Not Applicable | 8 | EAR99 | 9.3599mm | Non-RoHS Compliant | Contains Lead | 8 | 8-DIP (0.300, 7.62mm) | not_compliant | 7.62mm | Through Hole | 0°C~70°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e0 | DUAL | 225 | 5V | 30 | XC17S20 | 8 | NO | 2.54mm | 4.75V | Not Qualified | 5V | 5.25V | 3-STATE | 200kb | 0.01mA | 4.75V~5.25V | 1 | MEMORY CIRCUIT | 10MHz | 0.00005A | OTP | COMMON | |||||||||||||||||||
 |
EPC8QC100N | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | EPC | Obsolete | 3 (168 Hours) | 100 | EAR99 | 20mm | RoHS Compliant | 100-BQFP | compliant | 14mm | Surface Mount | 0°C~70°C | CMOS | SYNCHRONOUS | 2.15mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 245 | 3.3V | 40 | EPC8 | YES | 0.65mm | R-PQFP-G100 | 3V | Flash Memories | Not Qualified | 3.3V | 3.6V | 8MB | 0.09mA | 3V~3.6V | 512KX16 | 16 | 8388608 bit | CONFIGURATION MEMORY | PARALLEL | 66.7MHz | 0.00015A | In System Programmable | |||||||||||||||||
|
XC1765ELPD8C | Xilinx | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2000 | Obsolete | Not Applicable | 8 | EAR99 | 9.3599mm | Non-RoHS Compliant | Contains Lead | 8 | USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS | 8-DIP (0.300, 7.62mm) | not_compliant | 7.62mm | Through Hole | 0°C~70°C | CMOS | SYNCHRONOUS | 4.5974mm | 1 | e0 | DUAL | 225 | 3.3V | 30 | XC1765EL | 8 | NO | 2.54mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 65kb | 0.005mA | 3V~3.6V | 64KX1 | 1 | 65536 bit | CONFIGURATION MEMORY | SERIAL | 2.5MHz | 0.00005A | OTP | COMMON |
-
XC18V02PC44C Xilinx
Surface Mount Tube Configuration Proms for FPGAs 3 (168 Hours) In System Programmable Active XC18V02
Price: 0.0000
RFQ -
XC18V01SOG20C Xilinx
Surface Mount Tube Configuration Proms for FPGAs 3 (168 Hours) In System Programmable Active XC18V01
Price: 0.0000
RFQ -
XC17S50APD8C Xilinx
Through Hole 500kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S50A
Price: 0.0000
RFQ -
XC18V512PCG20C Xilinx
Surface Mount Tray Configuration Proms for FPGAs 3 (168 Hours) In System Programmable Active XC18V512
Price: 0.0000
RFQ -
XC17S20PD8C Xilinx
Through Hole 200kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC17S20 not_compliant
Price: 0.0000
RFQ -
EPC8QC100N Intel
Surface Mount 8MB Mb Tray Configuration Proms for FPGAs 3 (168 Hours) In System Programmable EPC Obsolete EPC8 compliant
Price: 0.0000
RFQ -
XC1765ELPD8C Xilinx
Through Hole 65kb Mb Tube Configuration Proms for FPGAs Not Applicable OTP Obsolete XC1765EL not_compliant
Price: 0.0000
RFQ
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