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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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Configuration Proms for FPGAs

Additional Feature

  • 4 WIRE INTERFACE TO FLEX 8000 DEVICES
  • ALSO OPERATES AT 5V SUPPLY
  • IT CAN ALSO OPERATE AT 5V SUPPLY
  • IT CAN ALSO OPERATES AT 2.5, 3.3 VOLT NOMINAL
  • IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO
  • USED FOR STORING THE CONFIGURATION BITSTREAMS OF XILINX FPGAS

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.B.1.A
  • 3A991.B.1
  • 3A991.B.1.A
  • 3A991.B.1.B.1
  • 3A991.B.2.A
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 25 Weeks
  • 30 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks

HTS Code

  • 8542.32.00.51
  • 8542.32.00.61
  • 8542.32.00.71
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4

Manufacturer Package Identifier

  • XCF02SVOG20C

Max Operating Temperature

  • 125°C
  • 70°C
  • 85°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • Not Applicable

Mount

  • Surface Mount
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Number of Terminals

  • 100

Number of Terminations

  • 100
  • 16
  • 20
  • 24
  • 32
  • 44
  • 48
  • 64
  • 8
  • 88

Operating Temperature

  • -40°C~85°C
  • 0°C~70°C

Package / Case

  • 100-BQFP
  • 16-SOIC (0.295, 7.50mm Width)
  • 20-LCC (J-Lead)
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 24-LBGA
  • 24-TBGA
  • 32-TQFP
  • 44-LCC (J-Lead)
  • 44-TQFP
  • 48-TFBGA, CSPBGA
  • 48-TFSOP (0.724, 18.40mm Width)
  • 64-TBGA
  • 8-DIP (0.300, 7.62mm)
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-TDFN
  • 88-LFBGA
  • FBGA
  • PDIP
  • PLCC
  • PQFP
  • SOIC

Packaging

  • Bulk
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Obsolete

Pbfree Code

  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2010
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • EPC
  • EPCQ
  • EPCQ-A
  • EPCQ-L
  • EPCS
  • EPCV

Subcategory

  • Flash Memories
  • OTP ROMs

Supplier Device Package

  • 100-PQFP (20x14)
  • 16-SOIC
  • 20-PLCC (9x9)
  • 20-SOIC
  • 20-TSSOP
  • 32-TQFP (7x7)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 8-LAP
  • 8-LAP (6x6)
  • 8-PDIP
  • 8-SOIC
  • 8-TSOP
  • 88-UBGA (11x8)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • MOS

Terminal Finish

  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • NICKEL (39) PALLADIUM (2) GOLD
  • NICKEL PALLADIUM GOLD
  • Nickel/Gold (Ni/Au)
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT
  • Through Hole

Type

  • NOR TYPE

Weight

  • 1.758804g
  • 540.001716mg
  • 665.986997mg
  • 722.005655mg
  • 930.006106mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Additional Feature Package / Case Interface REACH SVHC Reach Compliance Code Density Frequency Height Width Mounting Type Weight Operating Temperature Technology Operating Supply Current Operating Mode Height Seated (Max) Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Base Part Number Pin Count Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Voltage Output Characteristics Memory Size Memory Type Supply Current-Max Voltage - Supply Organization Memory Width Memory Density Memory IC Type Parallel/Serial Clock Frequency Standby Current-Max Access Time (Max) Programmable Type Data Retention Time-Min Endurance Write Protection Write Cycle Time-Max (tWC) I/O Type
    XC17S150APD8C XC17S150APD8C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1999 no Obsolete Not Applicable 8 EAR99 3.3V 9.3599mm Non-RoHS Compliant Contains Lead No 8 8-DIP (0.300, 7.62mm) 1 Mb 7.62mm Through Hole 0°C~70°C CMOS 4.5974mm 1 e0 DUAL 225 3.3V 30 XC17S150A 8 NO 2.54mm 3V 3.6V 3-STATE 1.5Mb 0.005mA 3V~3.6V 1040096X1 1 CONFIGURATION MEMORY SERIAL 0.00005A OTP COMMON
    AT17LV010-10JU AT17LV010-10JU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Surface Mount Tube 1997 yes Active 2 (1 Year) 20 5V 9.04mm ROHS3 Compliant Lead Free Tin No 20 IT CAN OPERATES ON 4.75-5.25 RANGE SUPPLY VOLTAGE ALSO 20-LCC (J-Lead) 2-Wire, Serial No SVHC 1 Mb 10MHz 3.68mm 9.04mm Surface Mount 722.005655mg -40°C~85°C CMOS 10mA 1 10mA e3 QUAD J BEND 3.3V AT17LV010 1.27mm 5V EEPROM 3V~3.6V 1MX1 0.0002A Serial EEPROM 90 100000 Write/Erase Cycles HARDWARE
    XC17S20PD8I XC17S20PD8I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube 1999 Obsolete Not Applicable 8 EAR99 9.3599mm Non-RoHS Compliant Contains Lead 8 8-DIP (0.300, 7.62mm) not_compliant 7.62mm Through Hole -40°C~85°C CMOS SYNCHRONOUS 4.5974mm 1 e0 DUAL 5V XC17S20 8 NO 2.54mm 4.5V Not Qualified 5V 5.5V 3-STATE 200kb 0.01mA 4.5V~5.5V 1 MEMORY CIRCUIT 10MHz 0.00005A OTP COMMON
    XC18V01SOG20C XC18V01SOG20C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 10 Weeks Tube 1999 yes Active 3 (168 Hours) 20 EAR99 3.3V 12.827mm ROHS3 Compliant Lead Free No 20 20-SOIC (0.295, 7.50mm Width) 1 Mb 7.5184mm Surface Mount 0°C~70°C CMOS 2.6416mm 1 e3 Matte Tin (Sn) DUAL GULL WING 260 3.3V 30 XC18V01 20 YES 1.27mm 3V Flash Memories 3.6V 0.025mA 3V~3.6V 128KX8 8 CONFIGURATION MEMORY PARALLEL/SERIAL 33MHz 0.01A 15 ns In System Programmable 20
    XC17S100AVOG8C XC17S100AVOG8C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tray 1999 yes Obsolete 3 (168 Hours) 3A991.B.1 3.3V RoHS Compliant No 8 8-SOIC (0.154, 3.90mm Width) 1 Mb Surface Mount 0°C~70°C XC17S100A 8 3V~3.6V OTP
    AT17F040A-30JU AT17F040A-30JU Microchip Technology 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 17 Weeks Surface Mount Tube 1997 yes Active 2 (1 Year) 20 3.3V 9.04mm ROHS3 Compliant Lead Free Tin 20 20-LCC (J-Lead) 2-Wire, Serial 4 Mb 10MHz 3.68mm 9.04mm Surface Mount 722.005655mg -40°C~85°C CMOS 50mA SYNCHRONOUS 1 50mA e3 QUAD J BEND 245 3.3V 40 AT17F040A 1.27mm 2.97V Not Qualified 3.63V 2.97V~3.63V 4MX1 CONFIGURATION MEMORY FLASH 0.03ms
    XC17S40XLSO20I XC17S40XLSO20I Rochester Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Tube Obsolete 3 (168 Hours) 20 12.8mm Non-RoHS Compliant 20-SOIC (0.295, 7.50mm Width) unknown 7.5mm Surface Mount -40°C~85°C CMOS SYNCHRONOUS 2.65mm 1 e0 TIN LEAD DUAL GULL WING 3.3V 20 YES 1.27mm R-PDSO-G20 3V COMMERCIAL 3.6V 400kb 3V~3.6V 330696X1 1 330696 bit MEMORY CIRCUIT OTP
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