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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
User

Items : %s%s

Microprocessors

Additional Feature

  • 16 MIPS; BURST BUS; 5 PIPELINE STAGES
  • 24MHZ NOMINAL CLOCK AVAILABLE
  • ADDRESSABLE REGISTER (ARA)
  • ALSO OPERATES AT 1V NOMINAL SUPPLY
  • ALSO OPERATES AT 1V SUPPLY NOM
  • ALSO OPERATES AT 2.85 V MINIMUM SUPPLY
  • ALSO OPERATES AT 3.3 V
  • ALSO OPERATES AT 5V SUPPLY
  • ALSO OPERATES AT 600 MHZ
  • ALSO OPERATES AT MIN 0.912 V
  • ALSO REQUIRES 1.8V OR 2.5V SUPPLY
  • ALSO REQUIRES 1.8V OR 3.3V SUPPLY
  • ALSO REQUIRES 2.5V AND 3.3V SUPPLY
  • ALSO REQUIRES 2.5V OR 3.3V SUPPLY
  • ALSO REQUIRES 3.3V I/O SUPPLY
  • ALSO REQUIRES 3.3V SUPPLY
  • ALSO REQUIRES 3V OR 3.3V SUPPLY
  • ALSO REQUIRES 5V SUPPLY
  • ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.
  • BARREL SHIFTER
  • BURST BUS
  • BURST BUS; 5 PIPELINE STAGES
  • CAN ALSO OPERATE WITH 5V SUPPLY
  • DRAM MEMORY REFRESH COUNTER
  • DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
  • DRAM REFRESH COUNTER
  • DYNAMIC BUS SIZING;UPTO 9.2 MIPS
  • IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
  • IT ALSO OPERATES IN 600 MHZ AT 0.9V SUPPLY
  • IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY
  • LOW POWER TAKEN FROM SLEEP MODE
  • OPERATING CASE TEMPERATURE 0 TO 100 C
  • OPERATING CASE TEMPERATURE 0 TO 85 C
  • OPERATING CASE TEMPERTURE 0 TO 100 C
  • OPERATING CASE TEMPERTURE 0 TO 85 C
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 20 MIPS MAX; 7.5 MIPS SUSTAINED; BURST BUS
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS
  • PIPELINED ARCHITECTURE
  • REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
  • REGISTER SCOREBOARDING; BURST BUS
  • REQUIRES 3.3V SUPPLY FOR I/O
  • SEATED HGT-CALCULATED

Connector Type

  • Connector
  • IDC
  • Pin

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Silver, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.A.3
  • 3A991
  • 3A991.A.1
  • 3A991.A.2
  • 5A002
  • 5A002.A
  • 5A002.A.1
  • 5A002.A.4
  • 5A991
  • 5A992
  • 5A992.C
  • 5A992C
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 111 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 21 Weeks
  • 22 Weeks
  • 23 Weeks
  • 24 Weeks
  • 25 Weeks
  • 26 Weeks
  • 3 Weeks
  • 4 Weeks
  • 5 Weeks
  • 52 Weeks
  • 53 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

HTS Code

  • 8542.31.00.01
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e3/e4
  • e4
  • e6
  • e8

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 1 week ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 2 weeks ago)
  • ACTIVE (Last Updated: 23 hours ago)
  • ACTIVE (Last Updated: 3 days ago)
  • ACTIVE (Last Updated: 3 weeks ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 5 days ago)
  • ACTIVE (Last Updated: 6 days ago)
  • ACTIVE (Last Updated: 7 months ago)
  • NRND (Last Updated: 1 week ago)
  • NRND (Last Updated: 2 days ago)
  • NRND (Last Updated: 2 weeks ago)
  • NRND (Last Updated: 3 days ago)
  • NRND (Last Updated: 4 days ago)
  • NRND (Last Updated: 5 days ago)

Manufacturer Package Identifier

  • AM1808BZWT3
  • AM1808EZCED4
  • AM5716AABCDEA
  • AMIC120BZDNA30
  • AT91SAM9G45C-CU
  • FCBGA 760
  • LFBGA-361

Max Operating Temperature

  • 100°C
  • 105°C
  • 110°C
  • 115°C
  • 125°C
  • 150°C
  • 55°C
  • 57°C
  • 64°C
  • 65°C
  • 66°C
  • 67.4°C
  • 67°C
  • 68°C
  • 69.1°C
  • 69.8°C
  • 69°C
  • 70°C
  • 71.4°C
  • 72.6°C
  • 72.7°C
  • 72°C
  • 73°C
  • 74°C
  • 75°C
  • 76.2°C
  • 76°C
  • 77°C
  • 79°C
  • 81.3°C
  • 83°C
  • 85°C
  • 87°C
  • 88°C
  • 90°C
  • 95°C

Min Operating Temperature

  • -20°C
  • -25°C
  • -30°C
  • -40°C
  • -55°C
  • -65°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2
  • 2 (1 Year)
  • 2A (4 Weeks)
  • 2A (4 Weeks)
  • 3
  • 3 (168 Hours)
  • 3 (168 Hours)
  • 4
  • 4 (72 Hours)
  • 4 (72 Hours)
  • 5
  • 5 (48 Hours)
  • Not Applicable

Mount

  • Box
  • Edge
  • Socket
  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole
  • Wall

Number of Pins

  • 100
  • 1023
  • 1031
  • 1088
  • 1089
  • 114
  • 1155
  • 1156
  • 128
  • 1284
  • 1288
  • 1295
  • 132
  • 1356
  • 1366
  • 144
  • 160
  • 168
  • 176
  • 179
  • 184
  • 196
  • 2
  • 20
  • 2011
  • 204
  • 208
  • 217
  • 24
  • 240
  • 241
  • 247
  • 255
  • 256
  • 272
  • 28
  • 289
  • 292
  • 296
  • 298
  • 3
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 357
  • 360
  • 361
  • 364
  • 368
  • 370
  • 388
  • 399
  • 4
  • 40
  • 413
  • 416
  • 417
  • 420
  • 423
  • 432
  • 437
  • 44
  • 441
  • 449
  • 473
  • 478
  • 479
  • 48
  • 480
  • 481
  • 483
  • 484
  • 491
  • 492
  • 495
  • 515
  • 516
  • 52
  • 520
  • 5284
  • 540
  • 544
  • 559
  • 561
  • 60
  • 603
  • 604
  • 615
  • 620
  • 64
  • 668
  • 672
  • 676
  • 68
  • 684
  • 689
  • 722
  • 740
  • 760
  • 771
  • 775
  • 783
  • 8
  • 80
  • 827
  • 831
  • 838
  • 84
  • 940
  • 956
  • 988
  • 994

Number of Terminations

  • 100
  • 1023
  • 114
  • 128
  • 1295
  • 1313
  • 132
  • 1329
  • 1366
  • 144
  • 160
  • 168
  • 169
  • 176
  • 179
  • 184
  • 196
  • 20
  • 204
  • 206
  • 208
  • 217
  • 225
  • 228
  • 233
  • 236
  • 24
  • 240
  • 241
  • 247
  • 255
  • 256
  • 265
  • 272
  • 28
  • 289
  • 297
  • 298
  • 3
  • 304
  • 32
  • 320
  • 324
  • 347
  • 352
  • 356
  • 357
  • 360
  • 361
  • 364
  • 369
  • 370
  • 372
  • 388
  • 40
  • 400
  • 404
  • 413
  • 416
  • 42
  • 420
  • 423
  • 425
  • 432
  • 437
  • 44
  • 441
  • 449
  • 457
  • 473
  • 478
  • 479
  • 48
  • 480
  • 483
  • 484
  • 486
  • 488
  • 489
  • 491
  • 492
  • 515
  • 516
  • 52
  • 520
  • 525
  • 529
  • 538
  • 541
  • 544
  • 559
  • 569
  • 576
  • 603
  • 604
  • 609
  • 620
  • 621
  • 624
  • 625
  • 64
  • 668
  • 672
  • 676
  • 68
  • 684
  • 689
  • 740
  • 760
  • 771
  • 775
  • 780
  • 783
  • 8
  • 80
  • 838
  • 84
  • 85
  • 896
  • 940
  • 956
  • 988

Operating Temperature

  • -10°C~70°C TA
  • -20°C~105°C TJ
  • -20°C~70°C TA
  • -20°C~75°C TA
  • -20°C~85°C TA
  • -20°C~85°C TC
  • -30°C~70°C TA
  • -40°C~100°C TA
  • -40°C~100°C TC
  • -40°C~105°C
  • -40°C~105°C TA
  • -40°C~105°C TJ
  • -40°C~110°C TC
  • -40°C~110°C TJ
  • -40°C~115°C TA
  • -40°C~125°C TA
  • -40°C~125°C TJ
  • -40°C~70°C TA
  • -40°C~85°C
  • -40°C~85°C TA
  • -40°C~85°C TC
  • -40°C~90°C TJ
  • -40°C~95°C TA
  • -40°C~95°C TC
  • -45°C~85°C TA
  • -55°C~125°C TC
  • -55°C~125°C TJ
  • -55°C~175°C TJ
  • -55°C~85°C TA
  • 0°C~100°C TC
  • 0°C~100°C TJ
  • 0°C~105°C
  • 0°C~105°C TA
  • 0°C~105°C TC
  • 0°C~125°C TA
  • 0°C~70°C
  • 0°C~70°C TA
  • 0°C~85°C TA
  • 0°C~85°C TC
  • 0°C~85°C TJ
  • 0°C~90°C TA
  • 0°C~90°C TJ
  • 0°C~95°C
  • 0°C~95°C TA
  • 0°C~95°C TJ

Package / Case

  • 100-BFQFP
  • 100-BQFP
  • 100-LQFP
  • 100-QFP
  • 1020-BBGA, FCBGA
  • 1023-BBGA, FCBGA
  • 1023-BCBGA, FCCBGA
  • 1023-BFBGA, FCBGA
  • 1031-BFBGA, FCBGA
  • 1089-BFBGA, FCBGA
  • 114-BCPGA
  • 114-BPGA
  • 1150-LGA Module
  • 1151-LGA Module
  • 1155-LGA Module
  • 128-BPGA
  • 128-BQFP
  • 128-LQFP
  • 1292-BBGA, FCBGA
  • 1292-BFBGA, FCBGA
  • 1295-BBGA, FCBGA
  • 132-BCQFP
  • 132-BPGA Exposed Pad
  • 132-BQFP Bumpered
  • 132-QFP
  • 1366-LGA
  • 144-BCQFP
  • 144-BQFP
  • 144-LBGA
  • 144-LQFP
  • 144-TQFP
  • 168-PGA
  • 169-LFBGA
  • 176-LFBGA
  • 176-LQFP Exposed Pad
  • 179-BEPGA
  • 179-PGA
  • 182-BEPGA
  • 184-BCQFP
  • 1932-BBGA, FCBGA
  • 196-LFBGA
  • 196-TFBGA, CSBGA
  • 2011-LGA Module
  • 2011-LGA, FC
  • 204-TFBGA
  • 206-BPGA
  • 208-BFQFP
  • 208-BFQFP Exposed Pad
  • 208-LQFP
  • 208-QFP
  • 211-VFLGA
  • 217-LFBGA
  • 225-LFBGA
  • 233-TFBGA
  • 240-BFCQFP
  • 240-BFQFP
  • 241-BEPGA
  • 247-LFBGA
  • 255-BBGA, FCBGA
  • 255-BCBGA Exposed Pad
  • 255-BCBGA, FCCBGA
  • 256-BBGA
  • 256-BGA
  • 256-LBGA
  • 256-LFBGA
  • 256-LQFP
  • 256-MAPBGA
  • 256-TFBGA
  • 257-TFBGA
  • 265-LFBGA
  • 272-BBGA
  • 272-LFBGA
  • 289-BGA
  • 289-LFBGA
  • 289-TFBGA
  • 292-LFBGA
  • 297-LFBGA
  • 298-LFBGA
  • 304-LBGA Exposed Pad
  • 320-LFBGA
  • 324-BGA
  • 324-LFBGA
  • 324-TFBGA
  • 352-BBGA
  • 352-LBGA
  • 354-LFBGA
  • 357-BBGA
  • 357-BGA
  • 360-BBGA Exposed Pad
  • 360-BBGA, FCBGA
  • 360-BCBGA
  • 360-BCBGA, FCCBGA
  • 360-CBGA, FCCBGA
  • 360-CLGA, FCCLGA
  • 361-LFBGA
  • 361-TFBGA
  • 364-LFBGA
  • 3647-LGA Module
  • 369-LFBGA
  • 40-DIP (0.600, 15.24mm)
  • 40-DIP (0.620, 15.75mm)
  • 400-LFBGA
  • 404-LFBGA
  • 416-BGA
  • 416-LFBGA
  • 423-LFBGA, FCBGA
  • 425-FBGA
  • 432-LBGA
  • 432-TFBGA
  • 44-LCC (J-Lead)
  • 44-LQFP
  • 448-BFBGA
  • 448-FBGA Exposed Pad
  • 448-LFBGA
  • 449-FBGA
  • 457-FBGA
  • 457-LFBGA
  • 473-LFBGA
  • 480-LBGA Exposed Pad
  • 483-BCBGA, FCCBGA
  • 484-BBGA Exposed Pad
  • 486-LFBGA
  • 486-LFBGA, FCBGA
  • 488-TFBGA
  • 489-LFBGA
  • 491-LFBGA
  • 492-BBGA
  • 515-VFBGA, FCBGA
  • 515-WFBGA, FCBGA
  • 516-BBGA
  • 516-BBGA Exposed Pad
  • 520-FBGA, FCBGA
  • 520-LFBGA
  • 525-FBGA, FCBGA
  • 529-FBGA
  • 529-LFBGA
  • 538-LFBGA, FCBGA
  • 541-LFBGA
  • 561-FBGA
  • 569-LFBGA
  • 620-BBGA Exposed Pad
  • 621-FBGA, FCBGA
  • 624-FBGA, FCBGA
  • 624-LFBGA
  • 624-LFBGA, FCBGA
  • 625-BFBGA, FCBGA
  • 64-CDIP (0.900, 22.86mm)
  • 64-DIP (0.750, 19.05mm)
  • 64-LQFP
  • 64-QFP
  • 668-BBGA Exposed Pad
  • 672-LBGA
  • 68-BCPGA
  • 68-CPGA
  • 68-LCC (J-Lead)
  • 684-BFBGA, FCBGA
  • 689-BBGA Exposed Pad
  • 740-LBGA
  • 760-BFBGA, FCBGA
  • 760-LFBGA
  • 780-BBGA, FCBGA
  • 780-BFBGA
  • 780-BFBGA, FCBGA
  • 780-FBGA
  • 780-FBGA, FCBGA
  • 783-BBGA, FCBGA
  • 784-BBGA, FCBGA
  • 80-BQFP
  • 84-LCC (J-Lead)
  • 896-BFBGA, FCBGA
  • 988-PGA Module
  • 994-BCBGA, FCCBGA
  • BGA
  • CDIP
  • DIP
  • FBGA
  • FCBGA
  • LCC
  • LGA
  • LQFP
  • MAPBGA
  • Module
  • PDIP
  • PLCC
  • PQFP
  • QFN
  • QFP
  • SOIC
  • TFBGA
  • TQFP

Packaging

  • Box
  • Box|Tray
  • Bulk
  • Cut Tape (CT)
  • Each
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray
  • Tray|Box
  • Tube

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • LTB
  • Not For New Designs
  • NRND
  • Obsolete
  • Preliminary
  • Unconfirmed

Pbfree Code

  • no
  • yes

Published

  • 1993
  • 1994
  • 1995
  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • AT91SAM
  • Automotive, AEC-Q100
  • Broadwell
  • Broadwell-EP
  • C29x Crypto
  • Conroe
  • EP7
  • EP9
  • eZ80® Acclaim!®
  • Haswell
  • i.MX1
  • i.MX21
  • i.MX23
  • i.MX25
  • i.MX27
  • i.MX28
  • i.MX31
  • i.MX35
  • i.MX50
  • i.MX51
  • i.MX53
  • i.MX6
  • i.MX6D
  • i.MX6DL
  • i.MX6DP
  • i.MX6G
  • i.MX6Q
  • i.MX6QP
  • i.MX6S
  • i.MX6SL
  • i.MX6SLL
  • i.MX6SX
  • i.MX6UL
  • i.MX6Y
  • i.MX7D
  • i.MX7S
  • i.MX7ULP
  • i.MX8MD
  • i.MX8MM
  • i.MX8MN
  • i.MX8MQ
  • i.MXL
  • i.MXS
  • i186
  • i386
  • i486
  • i960
  • Interprise™
  • Ivy Bridge
  • Ivy Bridge-EP
  • Kaby Lake
  • M680x0
  • M683xx
  • Merom
  • Mobile Celeron
  • Mobile Pentium II
  • MPC52xx
  • MPC6xx
  • MPC74xx
  • MPC7xx
  • MPC82xx
  • MPC83xx
  • MPC85xx
  • MPC86xx
  • MPC8xx
  • OMAP-35xx
  • OMAP-59xx
  • OMAP-L1x
  • Penryn
  • QorIQ P1
  • QorIQ P2
  • QorIQ P3
  • QorIQ P4
  • QorIQ P5
  • QorIQ Qonverge B
  • QorIQ Qonverge BSC
  • QorIQ T1
  • QorIQ T2
  • QorIQ T4
  • QorIQ®
  • QorIQ® Layerscape
  • QorlQ LS1
  • Rabbit®
  • RZ/A1H
  • RZ/A1L
  • RZ/A1LC
  • RZ/A1LU
  • RZ/A1M
  • RZ/N1D
  • RZ/N1L
  • RZ/N1S
  • SA-110
  • SAC™
  • SAM9CN
  • SAM9G
  • SAM9M
  • SAM9N
  • SAM9X
  • SAM9X60
  • SAM9XE
  • SAMA5D2
  • SAMA5D3
  • SAMA5D4
  • Sandy Bridge
  • Sandy Bridge-EP
  • SCC
  • SIAP™
  • Sitara™
  • Skylake
  • SPEAr®
  • STM32MP1
  • Vybrid, VF3xx
  • Vybrid, VF3xxR
  • Vybrid, VF5xx
  • Vybrid, VF5xxR
  • Vybrid, VF6xx
  • Wolfdale
  • Yonah
  • Yorkfield
  • Z180
  • Z80
  • ZIP™

Supplier Device Package

  • 100-PQFP (19x19)
  • 100-PQFP (20x14)
  • 100-QFP (14x20)
  • 100-TQFP (14x14)
  • 100-VQFP (14x14)
  • 1023-FCCBGA (33x33)
  • 1023-FCPBGA (33x33)
  • 114-PGA (34.55x34.55)
  • 1150-FCLGA
  • 1150-LGA
  • 1151-FCLGA
  • 1151-LGA
  • 1155-FCLGA
  • 1155-FCLGA (37.5x37.5)
  • 1155-LGA (37.5x37.5)
  • 1295-FCPBGA (37.5x37.5)
  • 132-CPGA
  • 132-CQFP (24x24)
  • 132-PGA (34.5x34.5)
  • 132-PQFP (24.13x24.13)
  • 132-PQFP (46x46)
  • 1366-LGA
  • 144-CQFP (26.77x26.77)
  • 144-LQFP (20x20)
  • 168-PGA
  • 176-HLQFP (24x24)
  • 179-PGA (47.24x47.24)
  • 184-CQFP (31.3x31.3)
  • 196-QFP
  • 2011-LGA
  • 206-PGA (47.25x47.25)
  • 208-LQFP
  • 208-PQFP (28x28)
  • 208-SQFP (28x28)
  • 211-FCLGA (9.6x9.6)
  • 217-LFBGA (15x15)
  • 225-MAPBGA (13x13)
  • 240-FQFP (32x32)
  • 241-PGA (47.24x47.24)
  • 255-CI-CGA (21x21)
  • 255-FCCBGA (21x21)
  • 255-PBGA (21x21)
  • 256-BGA (17x17)
  • 256-CABGA (17x17)
  • 256-MAPBGA (17x17)
  • 256-PBGA (17x17)
  • 256-PBGA (23x23)
  • 272-PBGA (27x27)
  • 289-BGA (19x19)
  • 289-MAPBGA (14x14)
  • 292-LFBGA (17x17)
  • 298-NFBGA (13x13)
  • 304-TBGA (31x31)
  • 320-LFBGA (13x13)
  • 324-NFBGA(15x15)
  • 324-TFBGA (15x15)
  • 352-TBGA (35x35)
  • 357-PBGA (25x25)
  • 360-CBGA (25x25)
  • 360-FCCBGA (25x25)
  • 360-PBGA (25x25)
  • 361-NFBGA (13x13)
  • 361-NFBGA (16x16)
  • 369-PBGA (19x19)
  • 400-MAPBGA (17x17)
  • 416-PBGA (27x27)
  • 423-FCBGA (16x16)
  • 425-TEPBGA I (19x19)
  • 432-MAPBGA (13x13)
  • 448-PBGA w/Heat Spreader (23x23)
  • 457-MAPBGA (14x14)
  • 473-MAPBGA (19x19)
  • 478-PGA
  • 480-TBGA (37.5x37.5)
  • 483-HTCE-CBGA (29x29)
  • 491-NFBGA (17x17)
  • 515-POP-FCBGA (12x12)
  • 515-POP-FCBGA (14x14)
  • 516-FPBGA (27x27)
  • 516-TEPBGA (27x27)
  • 525-FCPBGA (19x19)
  • 561-TEPBGA I (23x23)
  • 615-BGA (35.15x31.15)
  • 620-PBGA (29x29)
  • 624-FCBGA (21x21)
  • 64-QFP (14x14)
  • 668-PBGA-PGE (29x29)
  • 672-TBGA (35x35)
  • 68-PLCC (24.21x24.21)
  • 684-FCBGA (23x23)
  • 689-TEPBGA II (31x31)
  • 740-TBGA (37.5x37.5)
  • 775-LGA
  • 780-FCPBGA (23x23)
  • 783-FCPBGA (29x29)
  • 988-PGA
  • 988-PGA (37.5x37.5)
  • 994-FCCBGA (33x33)

Surface Mount

  • NO
  • YES

Terminal Finish

  • Gold (Au)
  • MATTE TIN
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • NOT SPECIFIED
  • TIN
  • Tin (Sn)
  • TIN BISMUTH
  • TIN COPPER/TIN SILVER
  • TIN LEAD
  • TIN LEAD SILVER
  • TIN SILVER
  • TIN SILVER COPPER
  • TIN SILVER COPPER OVER NICKEL
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn80Pb20)
  • Tin/Lead (Sn85Pb15)
  • Tin/Lead/Silver (Sn/Pb/Ag)
  • TIN/NICKEL PALLADIUM GOLD
  • TIN/SILVER
  • Tin/Silver (Sn/Ag)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
  • Tin/Silver/Copper - with Nickel barrier
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT

Transistor Element Material

  • SILICON

USB

  • USB 1.1 (2)
  • USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • USB 2.0 (1)
  • USB 2.0 (1), USB 3.0 (1)
  • USB 2.0 (2)
  • USB 2.0 (3)
  • USB 2.0 (3), USB 2.0 + PHY (1)
  • USB 2.0 + HSIC
  • USB 2.0 + PHY (1)
  • USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • USB 2.0 + PHY (2)
  • USB 2.0 + PHY (3)
  • USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
  • USB 2.0 + PHY (4)
  • USB 2.0 OTG + PHY (1)
  • USB 2.0 OTG + PHY (2)
  • USB 3.0 (2)

Weight

  • 1.241794g
  • 1.428504g
  • 1.486592g
  • 1.623294g
  • 1.662955g
  • 1.713814g
  • 1.724048g
  • 1.758663g
  • 1.758804g
  • 10.060849g
  • 10.163049g
  • 10.630703g
  • 10.784102g
  • 11.162596g
  • 11.227488g
  • 11.285492g
  • 11.436396g
  • 11.529496g
  • 12.834991g
  • 12.927383g
  • 12.964294g
  • 12.96659g
  • 13.095892g
  • 13.971014g
  • 14.084298g
  • 2.089502g
  • 2.094208g
  • 2.096504g
  • 2.169986g
  • 2.1737g
  • 2.267508g
  • 2.514603g
  • 2.587007g
  • 2.668711g
  • 2.784008g
  • 205.307246mg
  • 274.791928mg
  • 284.997756mg
  • 29.780891g
  • 3.193404g
  • 3.336087g
  • 3.420001g
  • 3.534392g
  • 3.663807g
  • 3.695587g
  • 3.803287g
  • 360.605934mg
  • 4.086896g
  • 4.31131g
  • 4.358994g
  • 4.374388g
  • 4.543691g
  • 4.617712g
  • 4.634155g
  • 4.634807g
  • 4.724505g
  • 4.743102g
  • 4.801956g
  • 5.177388g
  • 5.247213g
  • 5.438686g
  • 5.496887g
  • 5.503805g
  • 5.67084g
  • 5.819307g
  • 5.821943g
  • 5.854205g
  • 5.976306g
  • 530.703073g
  • 6.069208g
  • 6.610599g
  • 6.718043g
  • 685.207974mg
  • 7.349897g
  • 7.994395g
  • 789.392471mg
  • 838.692292mg
  • 9.256006g
  • 9.283193g
  • 911.607266mg
  • 919.403384mg
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    P1024NSN5BFB P1024NSN5BFB Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

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    Mult: 1

    		 0.00000000 125°C 0°C RoHS Compliant 561 FBGA 667MHz 2.380311g Halogen Free 2 RISC 32kB Cache 16 32b 16
    KMPC8313CZQAFFB KMPC8313CZQAFFB Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
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    RFQ

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    		 0.00000000 1 (Unlimited) 360 105°C 0°C 25mm RoHS Compliant Contains Lead LOW POWER TAKEN FROM SLEEP MODE 1.6GHz 25mm CMOS BOTTOM BALL 245 1.25V 30 360 OTHER YES S-CBGA-B360 Microprocessors Not Qualified Halogen Free 1 36 YES YES 64 FLOATING POINT MICROPROCESSOR, RISC 32 YES
    XPC850SRZT50BU XPC850SRZT50BU Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 3 (168 Hours) 256 95°C 0°C 23mm RoHS Compliant Contains Lead BGA 50MHz 23mm CMOS 2.35mm BOTTOM BALL NOT SPECIFIED 3.3V NOT SPECIFIED 256 YES Microprocessors Not Qualified 3.3V 3.465V Not Halogen Free 1 26 YES YES 32 FIXED POINT MICROPROCESSOR, RISC 32 YES
    MPC8323ECZQAFDC MPC8323ECZQAFDC Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

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    Mult: 1

    		 0.00000000 Surface Mount no 3 (168 Hours) 516 5A002 105°C -40°C 27mm RoHS Compliant No 516 1.05V 950mV 333MHz 4.634807g CMOS 2.55mm e0 Tin/Lead/Silver (Sn/Pb/Ag) BOTTOM BALL 260 1V INDUSTRIAL Microprocessors Halogen Free 1 333MHz YES YES FLOATING POINT 32b MICROPROCESSOR, RISC 32 YES
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    RFQ

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    Mult: 1

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    MC8641VU1000GB MC8641VU1000GB Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

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    		 0.00000000 Bulk 3 (168 Hours) 105°C 0°C 33mm RoHS Compliant No 994 1GHz 5.438686g CMOS 2.77mm e2 Tin/Silver (Sn/Ag) BOTTOM BALL 245 0.95V 30 YES 0.9V 1V Halogen Free 1 PowerPC 1GHz 16 YES YES FLOATING POINT 32b MICROPROCESSOR 32 YES
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    MPC850DEZQ66BUR2 MPC850DEZQ66BUR2 Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 no 95°C 0°C 3.3V RoHS Compliant Contains Lead No 256 BGA 66MHz 1.724048g Not Halogen Free 1 66MHz 8kB 32b
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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

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    MPC8349EZUAJFB MPC8349EZUAJFB Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

    		 0.00000000 download Bulk 3 357 5A992 95°C 0°C 1.8V 25mm RoHS Compliant Lead Free No 357 BGA 133MHz 2.094208g CMOS 2.52mm e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 245 1.8V 30 357 YES Microprocessors Halogen Free 1 133MHz 8kB 32 YES YES FIXED POINT 32b MICROPROCESSOR, RISC 32 YES
    KMPC855TVR80D4 KMPC855TVR80D4 Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Bulk 3 (168 Hours) 357 95°C 0°C 3.3V 25mm RoHS Compliant Lead Free 357 80MHz 2.096504g CMOS 2.52mm e1 Tin/Silver/Copper (Sn/Ag/Cu) BOTTOM BALL 245 3.3V 30 357 YES Not Qualified 3.465V Halogen Free 1 32 YES YES FIXED POINT 32b MICROPROCESSOR, RISC 32 YES
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