Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | REACH SVHC | Height | Width | Outside Diameter | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SMD3SW.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||||||
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SMDSWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 2 oz (56.70g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
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SMD2SW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD2 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||||
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NCSW.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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TS991SNL500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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SMD2SW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 1 oz (28.35g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||||||
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1844641 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | HF212 | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | SnAg3.8Cu0.7Bi3Sb1.4Ni0.15 | Jar, 17.64 oz (500g) | Lead Free | 408°F~424°F 209°C~218°C | No-Clean | ||||||||||||||||
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1769646 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | HF212 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F 217°C | No-Clean | ||||||||||||||
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NC191LT10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.35 oz (10g), 5cc | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||
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NC191LT35 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 280°F 138°C | No-Clean | |||||||||||||||
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SSLTNC-T5-50G | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn42Bi57Ag1 (42/57/1) | Jar, 1.76 oz (50g) | Lead Free | 279°F 137°C | No-Clean | ||||||||||||||||
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25-7040-0061 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.062 1.57mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3.5 (96.5/3.5) | 14 AWG, 16 SWG | Spool, 4 lbs (1.81kg) | Lead Free | 430°F 221°C | Rosin Activated (RA) | ||||||||||||
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SMDSWLF.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | 0.062lb 28.12g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||
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SMDSWLTLFP32 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2015 | Active | 1 (Unlimited) | 0.030 0.76mm | ROHS3 Compliant | Wire Solder | Bi57Sn42Ag1 (57/42/1) | 21 AWG, 22 SWG | Lead Free | 281°F 138°C | |||||||||||||||||
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SMD2SWLF.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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386832 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | 370 | Active | Not Applicable | 0.064 1.63mm | Non-RoHS Compliant | 1.1lbs 499g | 14 AWG | Wire Solder | Sn60Pb40 (60/40) | 14 AWG, 16 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | |||||||||||
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BARSN42BI57AG1 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn42Bi57Ag1 (42/57/1) | Bar, 1 lb (454g) | Lead Free | 280°F 138°C | ||||||||||||||||||
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24-6337-6403 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 331 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Unknown | 787.4 μm | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | |||||||
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24-6040-0069 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.125 3.18mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 8 AWG, 10 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||||
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SMD4300AX10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Syringe | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | Water Soluble | |||||||||||||
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WS991SNL35T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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1354296 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2000 | WS200™ | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 21.16 oz (600g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||||
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437756 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 366 | Obsolete | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn50Pb48.5Cu1.5 (50/48.5/1.5) | 20 AWG, 21 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~420°F 183°C~216°C | Rosin Activated (RA) | ||||||||||||||||
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24-6337-8807 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 245 | Active | 1 (Unlimited) | 0.020 0.51mm | 101.6mm | Non-RoHS Compliant | Contains Lead | 60.325mm | 60.325mm | 1lb 453.59g | 24 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | ||||||
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70-1302-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | R231 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | |||||||||||||||
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NC2SWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||||
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386849 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | 2000 | C400 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | No-Clean | |||||||||||||||||
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92-6040-0039 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 44 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||||||
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4860P-250G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2014 | 4860 | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 35°F~50°F 2°C~10°C | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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92-7068-9835 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.025 0.64mm | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean |
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TS991SNL500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)
Price: 0.0000
RFQ -
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WS991SNL35T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn96.5/Ag3.0/Cu0.5 T4 (35g syri
Price: 0.0000
RFQ -
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NC2SWLF.015 1OZ Chip Quik Inc.
Solder LF Solder Wire 99.3/0.7 Tin/Copper No-Clean .015 1oz
Price: 0.0000
RFQ -
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