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Solder
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | Package / Case | REACH SVHC | Height | Width | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
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07-6337-0050 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2011 | ULTRAPURE® | Active | 1 (Unlimited) | Non-RoHS Compliant | Lead Free | Bar Solder | Sn63Pb37 (63/37) | Bar, 10 lbs (4.54kg) | Leaded | 361°F 183°C | |||||||||||||||||
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24-6337-8802 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Unknown | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||||
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BARSN99.3CU0.7 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (454g) | Lead Free | 441°F 227°C | |||||||||||||||||||
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SMD4300SNL500T5C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||||||||
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1434501 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318M | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 350°F 177°C | No-Clean | |||||||||||||||||
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92-6337-8872 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.047 1.19mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 17 AWG, 18 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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70-1302-0510 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | R231 | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 4 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||||||||
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70-3213-0811 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | NXG1 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 8 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||||
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24-7068-9716 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 285 | Active | 1 (Unlimited) | 0.040 1.02mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Mildly Activated (RMA) | |||||||||||||
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92-6337-8801 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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SMD4300SNL250T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||||||
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70-3213-0810 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | NXG1 | Active | 1 (Unlimited) | 25.4μm | ROHS3 Compliant | 25.4μm | 25.4μm | Solder Paste | 32°F~50°F 0°C~10°C | 8 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||
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92-6040-0026 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2016 | 44 | Obsolete | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | |||||||||||||||
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544784 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | WS200™ | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | Water Soluble | |||||||||||||||
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91-6337-9815 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.015 0.38mm | Wire Solder | Sn63Pb37 (63/37) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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1434504 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318M | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 350°F 177°C | No-Clean | |||||||||||||||||
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24-6337-0652 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2007 | OR421 | Active | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||||
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SMDBI100-S-16 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | Bi100(100) | Bag, 1 lb (454g) | Lead Free | 521°F 271°C | |||||||||||||||||||
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BARSN63PB37 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn63Pb37 (63/37) | Bar, 1 lb (454g) | Leaded | 361°F 183°C | |||||||||||||||||||
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796065 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.015 0.38mm | RoHS Compliant | 26 AWG | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F 217°C | No-Clean | |||||||||||||
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RASWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 2 oz (56.70g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | |||||||||||||||||
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NC191SNL15 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||||||
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SMD291AX | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Syringe | Active | Not Applicable | 127mm | Non-RoHS Compliant | Contains Lead | 25.4mm | 76.2mm | 0.033lb 14.97g | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | Leaded | 361°F 183°C | No-Clean | ||||||||||
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WBNCSAC20-4OZ | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Lead Free | 430°F 221°C | No-Clean | ||||||||||||||||||
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SMD291SNL50T6 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 1.76 oz (50g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | |||||||||||||||
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SMD2150 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.010 0.25mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||||||||
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24-7068-1411 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2007 | 48 | Active | 1 (Unlimited) | 0.093 2.36mm | ROHS3 Compliant | Lead Free | 217 | 453.59237g | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 11 AWG, 13 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Rosin Activated (RA) | |||||||||||
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70-1608-0804 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | R276 | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 3.53 oz (100g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | |||||||||||||||
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24-7050-8813 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2015 | 44 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | RoHS Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.3Ag3.7 (96.3/3.7) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~444°F 221°C~223°C | Rosin Activated (RA) | |||||||||||||
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24-6337-8814 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 245 | Active | 1 (Unlimited) | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | 1lb 453.59g | 16 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean |
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BARSN63PB37 Chip Quik Inc.
BARSN63PB37 datasheet pdf and Solder product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
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