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Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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TS991SNL35T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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SMD2200 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | ||||||||||
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4895-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4890 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1lb 453.59g | 20 AWG | Wire Solder | Sn60Pb40 (60/40) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~376°F 183°C~191°C | Rosin Activated (RA) | |||||||
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NC3SWLF.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3.5 (96.5/3.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F 221°C | No-Clean | ||||||||||||
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SMD4300AX500T4C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | |||||||||
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24-7050-9718 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.025 0.64mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.3Ag3.7 (96.3/3.7) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Lead Free | 430°F~444°F 221°C~223°C | Rosin Mildly Activated (RMA) | ||||||||
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24-9574-1404 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Wire | Spool | 2007 | 48 | Active | Not Applicable | 0.050 1.27mm | ROHS3 Compliant | Lead Free | 453.59237g | Wire Solder | 50°F~104°F 10°C~40°C | Sn99.3Cu0.7 (99.3/0.7) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | Rosin Activated (RA) | |||||
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70-0202-0519 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | EP256HA | Active | 1 (Unlimited) | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 24.69 oz (700g) | Leaded | 361°F 183°C | No-Clean | |||||||||||
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24-7150-8801 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn62Pb36Ag2 (62/36/2) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 354°F 179°C | No-Clean | ||||||||
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27-7050-0655 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | OR421 | Obsolete | 1 (Unlimited) | 0.062 1.57mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.3Ag3.7 (96.3/3.7) | 14 AWG, 16 SWG | Spool, 18 lbs (8.16kg) | Lead Free | 430°F~444°F 221°C~223°C | Water Soluble | ||||||||||||
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96-6337-9531 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 268 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Date of Manufacture | Sn63Pb37 (63/37) | 20 AWG, 22 AWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||
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NCSWLF.015 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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SMDSWLT.040 50G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.040 1.02mm | ROHS3 Compliant | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 18 AWG, 19 SWG | Spool, 1.8 oz (50g) | Lead Free | 280°F 138°C | No-Clean, Rosin Activated (RA) | |||||||||||
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TS391LT10 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 281°F 138°C | No-Clean | ||||||||||
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SMD291SNLT4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | ||||||||||
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WS991LT35T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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SMD4300SNL500T4C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | |||||||||
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SMD3SW.020 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 1 oz (28.35g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | ||||||||||||
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NC191AX35 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | |||||||||||
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RASWLF.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 21 AWG, 20 SWG | Spool, 1 oz (28.35g) | Lead Free | 422°F~428°F 217°C~220°C | Rosin Activated (RA) | ||||||||||||
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SMD2SWLF.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||
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NC2SW.015 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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SMDAG100-S-0.25 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | ROHS3 Compliant | Solder Shot | Ag100(100) | Bag, 0.25 oz (7g) | Lead Free | 1762°F 961°C | ||||||||||||||
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395465 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | C502 | Active | Not Applicable | 0.064 1.63mm | Non-RoHS Compliant | 1lb 453.59g | 14 AWG | Wire Solder | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||
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26-7150-0060 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2016 | 44 | Obsolete | 1 (Unlimited) | 0.062 1.57mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn62Pb36Ag2 (62/36/2) | 14 AWG, 16 SWG | Spool, 5 lbs (2.27kg) | Leaded | 354°F 179°C | Rosin Activated (RA) | ||||||||
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386824 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | 370 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | 1lb 453.59g | Wire Solder | Sn60Pb40 (60/40) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||
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96-7069-9515 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 268 | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 17.64 oz (500g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||
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733024 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C400 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | 59°F~86°F 15°C~30°C | Sn95.5Ag3.8Cu0.7 (95.5/3.8/0.7) | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | Lead Free | 423°F 217°C | No-Clean | |||||||||
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SMD291SNL500T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||
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840933 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C502 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | 361°F 183°C | No-Clean |
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TS991SNL35T3 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T3 (35g syringe)
Price: 0.0000
RFQ -
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NCSWLF.015 2OZ Chip Quik Inc.
Solder LF Solder Wire 96.5/3/0.5 Tin/Silver/Copper No-Clean .015 2oz
Price: 0.0000
RFQ -
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WS991LT35T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn42/Bi57.6/Ag0.4 T4 (35g syrin
Price: 0.0000
RFQ -
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NC2SW.015 8OZ Chip Quik Inc.
Solder Solder Wire 60/40 Tin/Lead (Sn60/Pb40) No-Clean .015 8oz
Price: 0.0000
RFQ -
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