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  • STM32F103C8T6
  • MFI343S00177
  • can I ask you a question please?
  • STM32F407VET6
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CPLDs

Additional Feature

  • 1 EXTERNAL CLOCK
  • 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
  • 10 MACROCELLS; VARIABLE PRODUCT TERMS
  • 128 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS
  • 192 MACROCELLS; SHARED INPUT/CLOCK
  • 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • 256 MACROCELLS
  • 256 MACROCELLS; 16 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3
  • 256 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 36 MACROCELLS
  • 484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 512 MACROCELLS
  • 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 580 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 64 MACROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 676 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 72 MACROCELLS
  • 72 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • ALSO OPERATES WITH 3.3V SUPPLY VOLTAGE
  • CAN ALSO OPERATE WITH A 3.3V SUPPLY
  • CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • CONFIGURABLE I/O OPERATION WITH 3.3V+/-0.3 OR 5V+/-0.25
  • CONFIGURABLE I/O OPERATION WITH 3.3V+/-0.3 OR 5V+/-0.5
  • FOR SHIPPING METHOD CONTACT SALES
  • IN SYSTEM PROGRAMMABLE
  • IN-SYSTEM PROGRAMMABLE; 4 EXTERNAL CLOCKS
  • IT ALSO OPERATE WITH 2.5 TO 5.5, 2.3 TO 5.5V
  • IT ALSO OPERATE WITH 2.5 TO 5.5,2.3 TO 5.5 V
  • IT ALSO OPERATE WITH 4.5 TO 5.5 V AND 3 TO 3.6V
  • IT CAN ALSO HAVE AN INPUT VOLTAGE OF 3.3V
  • IT CAN ALSO OPERATE AT 3.3V
  • LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • LABS INTERCONNECTED BY PIA; 4 LABS; 64 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • MACROCELLS INTERCONNECTED BY PIA; 1 LAB; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • NO
  • PAL
  • PAL BLOCKS INTERCONNECTED BY PIA; 2 PAL BLOCKS; 4 EXTERNAL CLOCKS; SHARED INPUT/CLOCK
  • PAL WITH MACROCELLS; 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • POWER -UP RESET; SECURITY FUSE
  • PROGRAMMABLE OUTPUT POLARITY
  • REAL DIGITAL DESIGN TECHNOLOGY
  • REAL DIGITAL DESIGN TECHNOLOGY, XILIK00225-1
  • REAL DIGITAL DESIGN TECHNOLOGY, XILIK00255-1
  • REGISTER PRELOAD; POWER-ON RESET
  • REGISTER PRELOAD; POWER-UP RESET
  • USE IPLSI2032VE-300 FOR NEW DESIGNS
  • USE ISPLSI 2128VE-250 FOR NEW DESIGNS
  • YES

Contact Plating

  • Copper, Silver, Tin
  • Gold, Tin
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.A.7.A
  • 3A991
  • 3A991.D
  • EAR99

Factory Lead Time

  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 3 Weeks
  • 37 Weeks
  • 4 Weeks
  • 41 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

HTS Code

  • 8542.31.00.01
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e3/e4
  • e4
  • e6

JTAG BST

  • YES

Manufacturer Package Identifier

  • EPM3064ATI44-10N
  • EPM9320ARI208-10

Max Operating Temperature

  • 100°C
  • 105°C
  • 125°C
  • 130°C
  • 70°C
  • 75°C
  • 85°C
  • 90 °C
  • 90°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0 °C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • 4 (72 Hours)
  • 5
  • 5 (48 Hours)
  • 6 (Time on Label)

Mount

  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 128
  • 132
  • 144
  • 160
  • 169
  • 176
  • 192
  • 20
  • 208
  • 24
  • 240
  • 256
  • 28
  • 280
  • 292
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 372
  • 388
  • 40
  • 44
  • 472
  • 48
  • 484
  • 49
  • 56
  • 64
  • 672
  • 676
  • 68
  • 84

Number of Terminals

  • 100
  • 144
  • 44
  • 49

Number of Terminations

  • 100
  • 120
  • 128
  • 132
  • 14
  • 144
  • 160
  • 169
  • 176
  • 192
  • 20
  • 208
  • 22
  • 24
  • 240
  • 256
  • 272
  • 28
  • 280
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 388
  • 40
  • 44
  • 48
  • 484
  • 49
  • 56
  • 64
  • 672
  • 676
  • 68
  • 69
  • 8
  • 84

Operating Temperature

  • -40°C~100°C TJ
  • -40°C~105°C TA
  • -40°C~105°C TJ
  • -40°C~125°C TA
  • -40°C~125°C TJ
  • -40°C~130°C TJ
  • -40°C~85°C
  • -40°C~85°C TA
  • -55°C~125°C TA
  • -55°C~125°C TC
  • 0°C~70°C TA
  • 0°C~75°C TA
  • 0°C~85°C TJ
  • 0°C~90°C TJ

Package / Case

  • 100-BQFP
  • 100-LBGA
  • 100-LFBGA
  • 100-LQFP
  • 100-TFBGA
  • 100-TQFP
  • 12-UFQFN
  • 12-WFDFN Exposed Pad
  • 120-BQFP
  • 128-BQFP
  • 128-LQFP
  • 132-LFBGA, CSPBGA
  • 132-TFBGA, CSPBGA
  • 132-VFBGA
  • 14-UFQFN
  • 144-BGA
  • 144-LQFP
  • 144-TFBGA
  • 144-TFBGA, CSPBGA
  • 16-UFQFN Exposed Pad
  • 160-BPGA
  • 160-BQFP
  • 160-LQFP
  • 169-LFBGA
  • 176-LQFP
  • 192-BPGA
  • 20-DIP (0.300, 7.62mm)
  • 20-LCC (J-Lead)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 20-UFQFN
  • 208-BFQFP
  • 208-BFQFP Exposed Pad
  • 208-BGA
  • 22-UFQFN
  • 24-CDIP (0.300, 7.62mm)
  • 24-DIP (0.300, 7.62mm)
  • 24-SOIC (0.295, 7.50mm Width)
  • 24-TSSOP (0.173, 4.40mm Width)
  • 240-BFQFP Exposed Pad
  • 256-BBGA
  • 256-BGA
  • 256-LBGA
  • 256-TFBGA
  • 272-BBGA
  • 28-CLCC
  • 28-LCC (J-Lead)
  • 28-SSOP (0.209, 5.30mm Width)
  • 280-TFBGA, CSPBGA
  • 292-BGA
  • 304-BFQFP
  • 32-VFQFN Exposed Pad
  • 324-BBGA
  • 324-BGA
  • 324-LBGA
  • 352-LBGA
  • 352-LBGA Exposed Pad, Metal
  • 356-LBGA
  • 388-BBGA
  • 40-CDIP (0.600, 15.24mm)
  • 40-CDIP (0.600, 15.24mm) Window
  • 40-DIP (0.600, 15.24mm)
  • 44-CLCC (J-Lead)
  • 44-CLCC, Window (J-Lead)
  • 44-LCC (J-Lead)
  • 44-LQFP
  • 44-TQFP
  • 48-FBGA, CSPBGA
  • 48-LQFP
  • 48-TQFP
  • 48-VFQFN Exposed Pad
  • 484-BBGA
  • 49-LFBGA
  • 56-LFBGA, CSPBGA
  • 64-TFBGA
  • 64-TFBGA, CSPBGA
  • 64-TQFP
  • 64-TQFP Exposed Pad
  • 64-VFBGA, CSPBGA
  • 672-BBGA
  • 676-BBGA
  • 68-LCC (J-Lead)
  • 68-TFBGA
  • 8-UFQFN
  • 8-WFDFN Exposed Pad
  • 84-LCC (J-Lead)
  • A
  • BGA
  • CDIP
  • CLCC
  • DIP
  • FBGA
  • FCBGA
  • J
  • LCC
  • LQFP
  • PDIP
  • PLCC
  • PQFP
  • Q
  • QFP
  • S
  • SOIC
  • TFBGA
  • TQFP

Packaging

  • Bulk
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Not For New Designs
  • Obsolete

Pbfree Code

  • icon-pbfree yes
  • no
  • yes

Published

  • 1994
  • 1995
  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2012
  • 2013
  • 2014
  • 2016

Series

  • ATF15xx
  • ATF2500C(L)
  • ATF750C(L)
  • ATF750LVC
  • ATV2500B(L) and BQ(L)
  • CoolRunner II
  • CoolRunner XPLA3
  • Delta 39K™ ISR™
  • GAL®16LV8
  • GAL®16V8
  • GAL®18V10
  • GAL®20RA10
  • GAL®20V8
  • GAL®22LV10
  • GAL®22V10
  • GAL®26CV12
  • GAL®26V12
  • ispGAL™22LV10
  • ispGAL™22V10
  • ispLSI® 1000
  • ispLSI® 1000E
  • ispLSI® 1000EA
  • ispLSI® 2000A
  • ispLSI® 2000E
  • ispLSI® 2000VE
  • ispLSI® 3000
  • ispLSI® 5000VA
  • ispLSI® 5000VE
  • ispMACH® 4000B
  • ispMACH® 4000C
  • ispMACH® 4000V
  • ispMACH® 4000Z
  • ispMACH® 4000ZE
  • ispMACH® 4A
  • ispMACH™ 5000VG
  • ispXPLD® 5000MB
  • ispXPLD® 5000MC
  • ispXPLD® 5000MV
  • LA-ispMACH
  • LA-MachXO
  • MACH® 4
  • MACH® 5
  • MAX® 3000A
  • MAX® 7000
  • MAX® 7000A
  • MAX® 7000B
  • MAX® 7000S
  • MAX® 9000
  • MAX® 9000A
  • MAX® II
  • MAX® V
  • Ultra37000™
  • Ultralogic™
  • XA9500XL XA
  • XC9500
  • XC9500XL
  • XC9500XV

Subcategory

  • Field Programmable Gate Arrays
  • Programmable Logic Devices

Supplier Device Package

  • 0402-3P
  • 100-FBGA (11x11)
  • 100-PQFP (14x20)
  • 100-PQFP (20x14)
  • 100-TQFP (14x14)
  • 128-TQFP (14x14)
  • 144-TQFP (20x20)
  • 160-PQFP (28x28)
  • 160-TQFP (24x24)
  • 169-UBGA (11x11)
  • 176-TQFP (24x24)
  • 208-PQFP (28x28)
  • 208-RQFP (28x28)
  • 24-PDIP
  • 24-SO
  • 240-RQFP (32x32)
  • 256-BGA (27x27)
  • 256-FBGA (17x17)
  • 256-FPBGA (17x17)
  • 256-FTBGA (17x17)
  • 256-MBGA (11x11)
  • 256-PBGA (27x27)
  • 256-SBGA (27x27)
  • 28-PLCC (11.51x11.51)
  • 28-PLCC (11.5x11.5)
  • 304-RQFP (40x40)
  • 352-MBGA (35x35)
  • 352-SBGA (35x35)
  • 388-BGA (30x30)
  • 40-Cerdip
  • 40-PDIP
  • 44-PLCC (16.51x16.51)
  • 44-PLCC (16.58x16.58)
  • 44-PLCC (16.59x16.59)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 44-VQFP (10x10)
  • 48-CSBGA (7x7)
  • 48-TQFP
  • 48-TQFP (7x7)
  • 484-FPBGA (23x23)
  • 49-UBGA (7x7)
  • 56-CSBGA (6x6)
  • 676-FPBGA (31x31)
  • 68-PLCC (24.23x24.23)
  • 68-PLCC (24x24)
  • 84-PLCC (29.31x29.31)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • TTL

Terminal Finish

  • GOLD
  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • Matte Tin/Copper (Sn/Cu)
  • MATTE TIN/NICKEL PALLADIUM GOLD
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN BISMUTH
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Bismuth (Sn/Bi)
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn/Pb) - hot dipped
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Position

  • BOTTOM
  • DUAL
  • PERPENDICULAR
  • QUAD

Termination

  • SMD/SMT
  • Through Hole

Weight

  • 1.182714g
  • 1.319103g
  • 1.758804g
  • 1.764389g
  • 2.386605g
  • 3.740011g
  • 5.953513g
  • 503.487531mg
  • 6.777889g
  • 657.000198mg
  • 9.071791g
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Pbfree Code Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Radiation Hardening Number of Pins Additional Feature Package / Case Reach Compliance Code Width Technology Height Seated (Max) HTS Code JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Pin Count Temperature Grade Surface Mount Terminal Pitch JESD-30 Code Operating Temperature (Max) Subcategory Qualification Status Supply Voltage-Max (Vsup) Propagation Delay Turn On Delay Time Frequency (Max) Memory Type Number of I/O Organization Clock Frequency Number of Gates Output Function Number of Macro Cells Number of Logic Blocks (LABs) JTAG BST Speed Grade In-System Programmable Programmable Logic Type
    XCR3128XL-6CS144C XCR3128XL-6CS144C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 no 3 144 EAR99 70°C 0°C 3.3V 12mm Non-RoHS Compliant 144 YES not_compliant 12mm CMOS 1.2mm e0 BOTTOM BALL 240 3.3V 30 144 COMMERCIAL YES Programmable Logic Devices Not Qualified 6 ns 175MHz EEPROM 108 MACROCELL 128 8 YES 6 YES EE PLD
    XCR3256XL-12CS280C XCR3256XL-12CS280C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks 2003 no Active 3 280 EAR99 70°C 0°C 3.3V Non-RoHS Compliant 280 YES not_compliant CMOS 1.2mm 8542.39.00.01 e0 Tin/Lead (Sn63Pb37) BOTTOM BALL 240 3.3V 30 280 COMMERCIAL YES 0.8mm Programmable Logic Devices Not Qualified 3.6V 12 ns 88MHz EEPROM 164 MACROCELL 256 16 YES 12 YES EE PLD
    XC95144XV-5TQ100C XC95144XV-5TQ100C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 3 100 70°C 0°C 2.5V 14mm RoHS Compliant No 100 YES TQFP 14mm CMOS 1.6mm e0 QUAD GULL WING 225 2.5V 30 100 COMMERCIAL YES Programmable Logic Devices 2.62V 5 ns 5 ns 222.2MHz FLASH 81 MACROCELL 144 8 YES 5 YES
    XC95288-20BGG352C XC95288-20BGG352C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 1996 yes Discontinued 3 352 EAR99 5V 35mm Non-RoHS Compliant 35mm CMOS 1.7mm e1 Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) BOTTOM BALL 260 5V 30 352 COMMERCIAL YES 1.27mm S-PBGA-B352 70°C Not Qualified 20 ns 192 0 DEDICATED INPUTS, 192 I/O 50MHz MACROCELL 8 FLASH PLD
    XC9572XL10VQ44C0818 XC9572XL10VQ44C0818 Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 1996 70°C 0°C 3.3V Non-RoHS Compliant No 44 10 ns 100MHz FLASH 4 10
    XCR3064XL-10CS48C XCR3064XL-10CS48C Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 Surface Mount Bulk no 3 48 EAR99 70°C 0°C 3.3V 7mm RoHS Compliant Contains Lead No 48 YES 7mm CMOS 1.8mm e0 Tin/Lead (Sn63Pb37) BOTTOM BALL 240 3.3V 30 48 COMMERCIAL 0.8mm Programmable Logic Devices 3.6V 10 ns 10 ns 95MHz EEPROM 40 1500 MACROCELL 64 4 YES 10 YES EE PLD
    XC9536-15VQG44I XC9536-15VQG44I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 1996 yes Discontinued 3 44 EAR99 85°C -40°C 5V 10mm RoHS Compliant No 44 YES 10mm CMOS 1.2mm e3 Matte Tin (Sn) QUAD GULL WING 260 5V 30 44 INDUSTRIAL YES Programmable Logic Devices 15 ns 55.6MHz FLASH 34 0 DEDICATED INPUTS, 34 I/O MACROCELL 36 8 YES 15 YES
    XC95288XV-10CS280I XC95288XV-10CS280I Xilinx 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 3 280 EAR99 85°C -40°C 2.5V RoHS Compliant No 280 YES CMOS 1.2mm 8542.39.00.01 e0 Tin/Lead (Sn63Pb37) BOTTOM BALL 240 2.5V 30 280 INDUSTRIAL YES 0.8mm Programmable Logic Devices 2.62V 10 ns 10 ns 100MHz FLASH 192 0 DEDICATED INPUTS, 192 I/O MACROCELL 288 16 YES 10 YES
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