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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
User

Items : %s%s

Microprocessors

Additional Feature

  • 16 MIPS; BURST BUS; 5 PIPELINE STAGES
  • 24MHZ NOMINAL CLOCK AVAILABLE
  • ADDRESSABLE REGISTER (ARA)
  • ALSO OPERATES AT 1V NOMINAL SUPPLY
  • ALSO OPERATES AT 1V SUPPLY NOM
  • ALSO OPERATES AT 2.85 V MINIMUM SUPPLY
  • ALSO OPERATES AT 3.3 V
  • ALSO OPERATES AT 5V SUPPLY
  • ALSO OPERATES AT 600 MHZ
  • ALSO OPERATES AT MIN 0.912 V
  • ALSO REQUIRES 1.8V OR 2.5V SUPPLY
  • ALSO REQUIRES 1.8V OR 3.3V SUPPLY
  • ALSO REQUIRES 2.5V AND 3.3V SUPPLY
  • ALSO REQUIRES 2.5V OR 3.3V SUPPLY
  • ALSO REQUIRES 3.3V I/O SUPPLY
  • ALSO REQUIRES 3.3V SUPPLY
  • ALSO REQUIRES 3V OR 3.3V SUPPLY
  • ALSO REQUIRES 5V SUPPLY
  • ALSO WORKING TWO CELL MODE AT 2.4V NOM. SUPPLY.
  • BARREL SHIFTER
  • BURST BUS
  • BURST BUS; 5 PIPELINE STAGES
  • CAN ALSO OPERATE WITH 5V SUPPLY
  • DRAM MEMORY REFRESH COUNTER
  • DRAM REFRESH CONTROL UNIT; PROGRAMMABLE INTERRUPT CONTROLLER
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; EMULATION HARDWARE
  • DRAM REFRESH CONTROLLER; 3 PROGRAMMABLE TIMERS; NUMERIC COPROCESSOR INTERFACE
  • DRAM REFRESH COUNTER
  • DYNAMIC BUS SIZING;UPTO 9.2 MIPS
  • IT ALSO OPERATES IN 0.95V MINIMUM SUPPLY
  • IT ALSO OPERATES IN 600 MHZ AT 0.9V SUPPLY
  • IT ALSO OPERATES IN 800 MHZ AT 0.9V SUPPLY
  • LOW POWER TAKEN FROM SLEEP MODE
  • OPERATING CASE TEMPERATURE 0 TO 100 C
  • OPERATING CASE TEMPERATURE 0 TO 85 C
  • OPERATING CASE TEMPERTURE 0 TO 100 C
  • OPERATING CASE TEMPERTURE 0 TO 85 C
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 20 MIPS MAX; 7.5 MIPS SUSTAINED; BURST BUS
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
  • OPTEMP SPECIFIED AS TC; REGISTER SCOREBOARDING; BURST BUS
  • PIPELINED ARCHITECTURE
  • REGISTER SCOREBOARDING; 25 MIPS MAX; 9.4 MIPS SUSTAINED; BURST BUS
  • REGISTER SCOREBOARDING; BURST BUS
  • REQUIRES 3.3V SUPPLY FOR I/O
  • SEATED HGT-CALCULATED

Connector Type

  • Connector
  • IDC
  • Pin

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Lead, Tin
  • Silver, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.A.3
  • 3A991
  • 3A991.A.1
  • 3A991.A.2
  • 5A002
  • 5A002.A
  • 5A002.A.1
  • 5A002.A.4
  • 5A991
  • 5A992
  • 5A992.C
  • 5A992C
  • EAR99

Factory Lead Time

  • 1 Weeks
  • 10 Weeks
  • 11 Weeks
  • 111 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 21 Weeks
  • 22 Weeks
  • 23 Weeks
  • 24 Weeks
  • 25 Weeks
  • 26 Weeks
  • 3 Weeks
  • 4 Weeks
  • 5 Weeks
  • 52 Weeks
  • 53 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

HTS Code

  • 8542.31.00.01
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e3/e4
  • e4
  • e6
  • e8

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 1 week ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 2 weeks ago)
  • ACTIVE (Last Updated: 23 hours ago)
  • ACTIVE (Last Updated: 3 days ago)
  • ACTIVE (Last Updated: 3 weeks ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 5 days ago)
  • ACTIVE (Last Updated: 6 days ago)
  • ACTIVE (Last Updated: 7 months ago)
  • NRND (Last Updated: 1 week ago)
  • NRND (Last Updated: 2 days ago)
  • NRND (Last Updated: 2 weeks ago)
  • NRND (Last Updated: 3 days ago)
  • NRND (Last Updated: 4 days ago)
  • NRND (Last Updated: 5 days ago)

Manufacturer Package Identifier

  • AM1808BZWT3
  • AM1808EZCED4
  • AM5716AABCDEA
  • AMIC120BZDNA30
  • AT91SAM9G45C-CU
  • FCBGA 760
  • LFBGA-361

Max Operating Temperature

  • 100°C
  • 105°C
  • 110°C
  • 115°C
  • 125°C
  • 150°C
  • 55°C
  • 57°C
  • 64°C
  • 65°C
  • 66°C
  • 67.4°C
  • 67°C
  • 68°C
  • 69.1°C
  • 69.8°C
  • 69°C
  • 70°C
  • 71.4°C
  • 72.6°C
  • 72.7°C
  • 72°C
  • 73°C
  • 74°C
  • 75°C
  • 76.2°C
  • 76°C
  • 77°C
  • 79°C
  • 81.3°C
  • 83°C
  • 85°C
  • 87°C
  • 88°C
  • 90°C
  • 95°C

Min Operating Temperature

  • -20°C
  • -25°C
  • -30°C
  • -40°C
  • -55°C
  • -65°C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2
  • 2 (1 Year)
  • 2A (4 Weeks)
  • 2A (4 Weeks)
  • 3
  • 3 (168 Hours)
  • 3 (168 Hours)
  • 4
  • 4 (72 Hours)
  • 4 (72 Hours)
  • 5
  • 5 (48 Hours)
  • Not Applicable

Mount

  • Box
  • Edge
  • Socket
  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole
  • Wall

Number of Pins

  • 100
  • 1023
  • 1031
  • 1088
  • 1089
  • 114
  • 1155
  • 1156
  • 128
  • 1284
  • 1288
  • 1295
  • 132
  • 1356
  • 1366
  • 144
  • 160
  • 168
  • 176
  • 179
  • 184
  • 196
  • 2
  • 20
  • 2011
  • 204
  • 208
  • 217
  • 24
  • 240
  • 241
  • 247
  • 255
  • 256
  • 272
  • 28
  • 289
  • 292
  • 296
  • 298
  • 3
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 357
  • 360
  • 361
  • 364
  • 368
  • 370
  • 388
  • 399
  • 4
  • 40
  • 413
  • 416
  • 417
  • 420
  • 423
  • 432
  • 437
  • 44
  • 441
  • 449
  • 473
  • 478
  • 479
  • 48
  • 480
  • 481
  • 483
  • 484
  • 491
  • 492
  • 495
  • 515
  • 516
  • 52
  • 520
  • 5284
  • 540
  • 544
  • 559
  • 561
  • 60
  • 603
  • 604
  • 615
  • 620
  • 64
  • 668
  • 672
  • 676
  • 68
  • 684
  • 689
  • 722
  • 740
  • 760
  • 771
  • 775
  • 783
  • 8
  • 80
  • 827
  • 831
  • 838
  • 84
  • 940
  • 956
  • 988
  • 994

Number of Terminations

  • 100
  • 1023
  • 114
  • 128
  • 1295
  • 1313
  • 132
  • 1329
  • 1366
  • 144
  • 160
  • 168
  • 169
  • 176
  • 179
  • 184
  • 196
  • 20
  • 204
  • 206
  • 208
  • 217
  • 225
  • 228
  • 233
  • 236
  • 24
  • 240
  • 241
  • 247
  • 255
  • 256
  • 265
  • 272
  • 28
  • 289
  • 297
  • 298
  • 3
  • 304
  • 32
  • 320
  • 324
  • 347
  • 352
  • 356
  • 357
  • 360
  • 361
  • 364
  • 369
  • 370
  • 372
  • 388
  • 40
  • 400
  • 404
  • 413
  • 416
  • 42
  • 420
  • 423
  • 425
  • 432
  • 437
  • 44
  • 441
  • 449
  • 457
  • 473
  • 478
  • 479
  • 48
  • 480
  • 483
  • 484
  • 486
  • 488
  • 489
  • 491
  • 492
  • 515
  • 516
  • 52
  • 520
  • 525
  • 529
  • 538
  • 541
  • 544
  • 559
  • 569
  • 576
  • 603
  • 604
  • 609
  • 620
  • 621
  • 624
  • 625
  • 64
  • 668
  • 672
  • 676
  • 68
  • 684
  • 689
  • 740
  • 760
  • 771
  • 775
  • 780
  • 783
  • 8
  • 80
  • 838
  • 84
  • 85
  • 896
  • 940
  • 956
  • 988

Operating Temperature

  • -10°C~70°C TA
  • -20°C~105°C TJ
  • -20°C~70°C TA
  • -20°C~75°C TA
  • -20°C~85°C TA
  • -20°C~85°C TC
  • -30°C~70°C TA
  • -40°C~100°C TA
  • -40°C~100°C TC
  • -40°C~105°C
  • -40°C~105°C TA
  • -40°C~105°C TJ
  • -40°C~110°C TC
  • -40°C~110°C TJ
  • -40°C~115°C TA
  • -40°C~125°C TA
  • -40°C~125°C TJ
  • -40°C~70°C TA
  • -40°C~85°C
  • -40°C~85°C TA
  • -40°C~85°C TC
  • -40°C~90°C TJ
  • -40°C~95°C TA
  • -40°C~95°C TC
  • -45°C~85°C TA
  • -55°C~125°C TC
  • -55°C~125°C TJ
  • -55°C~175°C TJ
  • -55°C~85°C TA
  • 0°C~100°C TC
  • 0°C~100°C TJ
  • 0°C~105°C
  • 0°C~105°C TA
  • 0°C~105°C TC
  • 0°C~125°C TA
  • 0°C~70°C
  • 0°C~70°C TA
  • 0°C~85°C TA
  • 0°C~85°C TC
  • 0°C~85°C TJ
  • 0°C~90°C TA
  • 0°C~90°C TJ
  • 0°C~95°C
  • 0°C~95°C TA
  • 0°C~95°C TJ

Package / Case

  • 100-BFQFP
  • 100-BQFP
  • 100-LQFP
  • 100-QFP
  • 1020-BBGA, FCBGA
  • 1023-BBGA, FCBGA
  • 1023-BCBGA, FCCBGA
  • 1023-BFBGA, FCBGA
  • 1031-BFBGA, FCBGA
  • 1089-BFBGA, FCBGA
  • 114-BCPGA
  • 114-BPGA
  • 1150-LGA Module
  • 1151-LGA Module
  • 1155-LGA Module
  • 128-BPGA
  • 128-BQFP
  • 128-LQFP
  • 1292-BBGA, FCBGA
  • 1292-BFBGA, FCBGA
  • 1295-BBGA, FCBGA
  • 132-BCQFP
  • 132-BPGA Exposed Pad
  • 132-BQFP Bumpered
  • 132-QFP
  • 1366-LGA
  • 144-BCQFP
  • 144-BQFP
  • 144-LBGA
  • 144-LQFP
  • 144-TQFP
  • 168-PGA
  • 169-LFBGA
  • 176-LFBGA
  • 176-LQFP Exposed Pad
  • 179-BEPGA
  • 179-PGA
  • 182-BEPGA
  • 184-BCQFP
  • 1932-BBGA, FCBGA
  • 196-LFBGA
  • 196-TFBGA, CSBGA
  • 2011-LGA Module
  • 2011-LGA, FC
  • 204-TFBGA
  • 206-BPGA
  • 208-BFQFP
  • 208-BFQFP Exposed Pad
  • 208-LQFP
  • 208-QFP
  • 211-VFLGA
  • 217-LFBGA
  • 225-LFBGA
  • 233-TFBGA
  • 240-BFCQFP
  • 240-BFQFP
  • 241-BEPGA
  • 247-LFBGA
  • 255-BBGA, FCBGA
  • 255-BCBGA Exposed Pad
  • 255-BCBGA, FCCBGA
  • 256-BBGA
  • 256-BGA
  • 256-LBGA
  • 256-LFBGA
  • 256-LQFP
  • 256-MAPBGA
  • 256-TFBGA
  • 257-TFBGA
  • 265-LFBGA
  • 272-BBGA
  • 272-LFBGA
  • 289-BGA
  • 289-LFBGA
  • 289-TFBGA
  • 292-LFBGA
  • 297-LFBGA
  • 298-LFBGA
  • 304-LBGA Exposed Pad
  • 320-LFBGA
  • 324-BGA
  • 324-LFBGA
  • 324-TFBGA
  • 352-BBGA
  • 352-LBGA
  • 354-LFBGA
  • 357-BBGA
  • 357-BGA
  • 360-BBGA Exposed Pad
  • 360-BBGA, FCBGA
  • 360-BCBGA
  • 360-BCBGA, FCCBGA
  • 360-CBGA, FCCBGA
  • 360-CLGA, FCCLGA
  • 361-LFBGA
  • 361-TFBGA
  • 364-LFBGA
  • 3647-LGA Module
  • 369-LFBGA
  • 40-DIP (0.600, 15.24mm)
  • 40-DIP (0.620, 15.75mm)
  • 400-LFBGA
  • 404-LFBGA
  • 416-BGA
  • 416-LFBGA
  • 423-LFBGA, FCBGA
  • 425-FBGA
  • 432-LBGA
  • 432-TFBGA
  • 44-LCC (J-Lead)
  • 44-LQFP
  • 448-BFBGA
  • 448-FBGA Exposed Pad
  • 448-LFBGA
  • 449-FBGA
  • 457-FBGA
  • 457-LFBGA
  • 473-LFBGA
  • 480-LBGA Exposed Pad
  • 483-BCBGA, FCCBGA
  • 484-BBGA Exposed Pad
  • 486-LFBGA
  • 486-LFBGA, FCBGA
  • 488-TFBGA
  • 489-LFBGA
  • 491-LFBGA
  • 492-BBGA
  • 515-VFBGA, FCBGA
  • 515-WFBGA, FCBGA
  • 516-BBGA
  • 516-BBGA Exposed Pad
  • 520-FBGA, FCBGA
  • 520-LFBGA
  • 525-FBGA, FCBGA
  • 529-FBGA
  • 529-LFBGA
  • 538-LFBGA, FCBGA
  • 541-LFBGA
  • 561-FBGA
  • 569-LFBGA
  • 620-BBGA Exposed Pad
  • 621-FBGA, FCBGA
  • 624-FBGA, FCBGA
  • 624-LFBGA
  • 624-LFBGA, FCBGA
  • 625-BFBGA, FCBGA
  • 64-CDIP (0.900, 22.86mm)
  • 64-DIP (0.750, 19.05mm)
  • 64-LQFP
  • 64-QFP
  • 668-BBGA Exposed Pad
  • 672-LBGA
  • 68-BCPGA
  • 68-CPGA
  • 68-LCC (J-Lead)
  • 684-BFBGA, FCBGA
  • 689-BBGA Exposed Pad
  • 740-LBGA
  • 760-BFBGA, FCBGA
  • 760-LFBGA
  • 780-BBGA, FCBGA
  • 780-BFBGA
  • 780-BFBGA, FCBGA
  • 780-FBGA
  • 780-FBGA, FCBGA
  • 783-BBGA, FCBGA
  • 784-BBGA, FCBGA
  • 80-BQFP
  • 84-LCC (J-Lead)
  • 896-BFBGA, FCBGA
  • 988-PGA Module
  • 994-BCBGA, FCCBGA
  • BGA
  • CDIP
  • DIP
  • FBGA
  • FCBGA
  • LCC
  • LGA
  • LQFP
  • MAPBGA
  • Module
  • PDIP
  • PLCC
  • PQFP
  • QFN
  • QFP
  • SOIC
  • TFBGA
  • TQFP

Packaging

  • Box
  • Box|Tray
  • Bulk
  • Cut Tape (CT)
  • Each
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray
  • Tray|Box
  • Tube

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • LTB
  • Not For New Designs
  • NRND
  • Obsolete
  • Preliminary
  • Unconfirmed

Pbfree Code

  • no
  • yes

Published

  • 1993
  • 1994
  • 1995
  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017
  • 2018

Series

  • AT91SAM
  • Automotive, AEC-Q100
  • Broadwell
  • Broadwell-EP
  • C29x Crypto
  • Conroe
  • EP7
  • EP9
  • eZ80® Acclaim!®
  • Haswell
  • i.MX1
  • i.MX21
  • i.MX23
  • i.MX25
  • i.MX27
  • i.MX28
  • i.MX31
  • i.MX35
  • i.MX50
  • i.MX51
  • i.MX53
  • i.MX6
  • i.MX6D
  • i.MX6DL
  • i.MX6DP
  • i.MX6G
  • i.MX6Q
  • i.MX6QP
  • i.MX6S
  • i.MX6SL
  • i.MX6SLL
  • i.MX6SX
  • i.MX6UL
  • i.MX6Y
  • i.MX7D
  • i.MX7S
  • i.MX7ULP
  • i.MX8MD
  • i.MX8MM
  • i.MX8MN
  • i.MX8MQ
  • i.MXL
  • i.MXS
  • i186
  • i386
  • i486
  • i960
  • Interprise™
  • Ivy Bridge
  • Ivy Bridge-EP
  • Kaby Lake
  • M680x0
  • M683xx
  • Merom
  • Mobile Celeron
  • Mobile Pentium II
  • MPC52xx
  • MPC6xx
  • MPC74xx
  • MPC7xx
  • MPC82xx
  • MPC83xx
  • MPC85xx
  • MPC86xx
  • MPC8xx
  • OMAP-35xx
  • OMAP-59xx
  • OMAP-L1x
  • Penryn
  • QorIQ P1
  • QorIQ P2
  • QorIQ P3
  • QorIQ P4
  • QorIQ P5
  • QorIQ Qonverge B
  • QorIQ Qonverge BSC
  • QorIQ T1
  • QorIQ T2
  • QorIQ T4
  • QorIQ®
  • QorIQ® Layerscape
  • QorlQ LS1
  • Rabbit®
  • RZ/A1H
  • RZ/A1L
  • RZ/A1LC
  • RZ/A1LU
  • RZ/A1M
  • RZ/N1D
  • RZ/N1L
  • RZ/N1S
  • SA-110
  • SAC™
  • SAM9CN
  • SAM9G
  • SAM9M
  • SAM9N
  • SAM9X
  • SAM9X60
  • SAM9XE
  • SAMA5D2
  • SAMA5D3
  • SAMA5D4
  • Sandy Bridge
  • Sandy Bridge-EP
  • SCC
  • SIAP™
  • Sitara™
  • Skylake
  • SPEAr®
  • STM32MP1
  • Vybrid, VF3xx
  • Vybrid, VF3xxR
  • Vybrid, VF5xx
  • Vybrid, VF5xxR
  • Vybrid, VF6xx
  • Wolfdale
  • Yonah
  • Yorkfield
  • Z180
  • Z80
  • ZIP™

Supplier Device Package

  • 100-PQFP (19x19)
  • 100-PQFP (20x14)
  • 100-QFP (14x20)
  • 100-TQFP (14x14)
  • 100-VQFP (14x14)
  • 1023-FCCBGA (33x33)
  • 1023-FCPBGA (33x33)
  • 114-PGA (34.55x34.55)
  • 1150-FCLGA
  • 1150-LGA
  • 1151-FCLGA
  • 1151-LGA
  • 1155-FCLGA
  • 1155-FCLGA (37.5x37.5)
  • 1155-LGA (37.5x37.5)
  • 1295-FCPBGA (37.5x37.5)
  • 132-CPGA
  • 132-CQFP (24x24)
  • 132-PGA (34.5x34.5)
  • 132-PQFP (24.13x24.13)
  • 132-PQFP (46x46)
  • 1366-LGA
  • 144-CQFP (26.77x26.77)
  • 144-LQFP (20x20)
  • 168-PGA
  • 176-HLQFP (24x24)
  • 179-PGA (47.24x47.24)
  • 184-CQFP (31.3x31.3)
  • 196-QFP
  • 2011-LGA
  • 206-PGA (47.25x47.25)
  • 208-LQFP
  • 208-PQFP (28x28)
  • 208-SQFP (28x28)
  • 211-FCLGA (9.6x9.6)
  • 217-LFBGA (15x15)
  • 225-MAPBGA (13x13)
  • 240-FQFP (32x32)
  • 241-PGA (47.24x47.24)
  • 255-CI-CGA (21x21)
  • 255-FCCBGA (21x21)
  • 255-PBGA (21x21)
  • 256-BGA (17x17)
  • 256-CABGA (17x17)
  • 256-MAPBGA (17x17)
  • 256-PBGA (17x17)
  • 256-PBGA (23x23)
  • 272-PBGA (27x27)
  • 289-BGA (19x19)
  • 289-MAPBGA (14x14)
  • 292-LFBGA (17x17)
  • 298-NFBGA (13x13)
  • 304-TBGA (31x31)
  • 320-LFBGA (13x13)
  • 324-NFBGA(15x15)
  • 324-TFBGA (15x15)
  • 352-TBGA (35x35)
  • 357-PBGA (25x25)
  • 360-CBGA (25x25)
  • 360-FCCBGA (25x25)
  • 360-PBGA (25x25)
  • 361-NFBGA (13x13)
  • 361-NFBGA (16x16)
  • 369-PBGA (19x19)
  • 400-MAPBGA (17x17)
  • 416-PBGA (27x27)
  • 423-FCBGA (16x16)
  • 425-TEPBGA I (19x19)
  • 432-MAPBGA (13x13)
  • 448-PBGA w/Heat Spreader (23x23)
  • 457-MAPBGA (14x14)
  • 473-MAPBGA (19x19)
  • 478-PGA
  • 480-TBGA (37.5x37.5)
  • 483-HTCE-CBGA (29x29)
  • 491-NFBGA (17x17)
  • 515-POP-FCBGA (12x12)
  • 515-POP-FCBGA (14x14)
  • 516-FPBGA (27x27)
  • 516-TEPBGA (27x27)
  • 525-FCPBGA (19x19)
  • 561-TEPBGA I (23x23)
  • 615-BGA (35.15x31.15)
  • 620-PBGA (29x29)
  • 624-FCBGA (21x21)
  • 64-QFP (14x14)
  • 668-PBGA-PGE (29x29)
  • 672-TBGA (35x35)
  • 68-PLCC (24.21x24.21)
  • 684-FCBGA (23x23)
  • 689-TEPBGA II (31x31)
  • 740-TBGA (37.5x37.5)
  • 775-LGA
  • 780-FCPBGA (23x23)
  • 783-FCPBGA (29x29)
  • 988-PGA
  • 988-PGA (37.5x37.5)
  • 994-FCCBGA (33x33)

Surface Mount

  • NO
  • YES

Terminal Finish

  • Gold (Au)
  • MATTE TIN
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • NOT SPECIFIED
  • TIN
  • Tin (Sn)
  • TIN BISMUTH
  • TIN COPPER/TIN SILVER
  • TIN LEAD
  • TIN LEAD SILVER
  • TIN SILVER
  • TIN SILVER COPPER
  • TIN SILVER COPPER OVER NICKEL
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn80Pb20)
  • Tin/Lead (Sn85Pb15)
  • Tin/Lead/Silver (Sn/Pb/Ag)
  • TIN/NICKEL PALLADIUM GOLD
  • TIN/SILVER
  • Tin/Silver (Sn/Ag)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
  • Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
  • Tin/Silver/Copper - with Nickel barrier
  • Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)

Termination

  • SMD/SMT

Transistor Element Material

  • SILICON

USB

  • USB 1.1 (2)
  • USB 1.1 + PHY (1), USB 2.0 + PHY (1)
  • USB 2.0 (1)
  • USB 2.0 (1), USB 3.0 (1)
  • USB 2.0 (2)
  • USB 2.0 (3)
  • USB 2.0 (3), USB 2.0 + PHY (1)
  • USB 2.0 + HSIC
  • USB 2.0 + PHY (1)
  • USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
  • USB 2.0 + PHY (2)
  • USB 2.0 + PHY (3)
  • USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
  • USB 2.0 + PHY (4)
  • USB 2.0 OTG + PHY (1)
  • USB 2.0 OTG + PHY (2)
  • USB 3.0 (2)

Weight

  • 1.241794g
  • 1.428504g
  • 1.486592g
  • 1.623294g
  • 1.662955g
  • 1.713814g
  • 1.724048g
  • 1.758663g
  • 1.758804g
  • 10.060849g
  • 10.163049g
  • 10.630703g
  • 10.784102g
  • 11.162596g
  • 11.227488g
  • 11.285492g
  • 11.436396g
  • 11.529496g
  • 12.834991g
  • 12.927383g
  • 12.964294g
  • 12.96659g
  • 13.095892g
  • 13.971014g
  • 14.084298g
  • 2.089502g
  • 2.094208g
  • 2.096504g
  • 2.169986g
  • 2.1737g
  • 2.267508g
  • 2.514603g
  • 2.587007g
  • 2.668711g
  • 2.784008g
  • 205.307246mg
  • 274.791928mg
  • 284.997756mg
  • 29.780891g
  • 3.193404g
  • 3.336087g
  • 3.420001g
  • 3.534392g
  • 3.663807g
  • 3.695587g
  • 3.803287g
  • 360.605934mg
  • 4.086896g
  • 4.31131g
  • 4.358994g
  • 4.374388g
  • 4.543691g
  • 4.617712g
  • 4.634155g
  • 4.634807g
  • 4.724505g
  • 4.743102g
  • 4.801956g
  • 5.177388g
  • 5.247213g
  • 5.438686g
  • 5.496887g
  • 5.503805g
  • 5.67084g
  • 5.819307g
  • 5.821943g
  • 5.854205g
  • 5.976306g
  • 530.703073g
  • 6.069208g
  • 6.610599g
  • 6.718043g
  • 685.207974mg
  • 7.349897g
  • 7.994395g
  • 789.392471mg
  • 838.692292mg
  • 9.256006g
  • 9.283193g
  • 911.607266mg
  • 919.403384mg
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Mount Packaging Pbfree Code Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Radiation Hardening Number of Pins Additional Feature Package / Case Interface Max Supply Voltage Reach Compliance Code Min Supply Voltage Frequency Width Weight Technology Height Seated (Max) HTS Code Evaluation Kit JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Pin Count Temperature Grade Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Halogen Free Number of Cores Core Architecture Speed Frequency (Max) Memory Size Memory Type RAM Size Address Bus Width Boundary Scan Low Power Mode External Data Bus Width Format Data Bus Width Bus Compatibility uPs/uCs/Peripheral ICs Type Number of Serial I/Os Communication Protocol Bit Size Integrated Cache
    P4040NSE1NNB P4040NSE1NNB Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
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    RFQ

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    Mult: 1

    		 0.00000000 3 (168 Hours) 256 95°C -40°C 23mm RoHS Compliant Contains Lead BGA 66MHz 23mm CMOS 2.35mm e0 TIN LEAD BOTTOM BALL 220 3.3V 30 256 YES Microprocessors Not Qualified 3.3V 3.465V Not Halogen Free 1 26 YES YES 32 FIXED POINT MICROPROCESSOR, RISC 32 YES
    KXPC8255VVIFBC KXPC8255VVIFBC Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
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    Mult: 1

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    MC68SZ328AVM66 MC68SZ328AVM66 Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

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    Mult: 1

    		 0.00000000 70°C 0°C RoHS Compliant 196 BGA 66MHz 1
    MC68M360ZP25VLR2 MC68M360ZP25VLR2 Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
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    RFQ

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    Mult: 1

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    KMPC8547EVUAUJ KMPC8547EVUAUJ Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
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    RFQ

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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

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    Mult: 1

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    RFQ

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    RFQ

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    Mult: 1

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    MPC8548ECVUAUJ MPC8548ECVUAUJ Freescale Semiconductor, Inc. (NXP Semiconductors) 0.0000
    RFQ

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    Mult: 1

    		 0.00000000 1 (Unlimited) 783 5A002 105°C -40°C 1.1V 29mm RoHS Compliant 11.227488g CMOS 3.38mm 8542.31.00.01 e2 Tin/Silver (Sn/Ag) BOTTOM BALL 1.1V 783 INDUSTRIAL YES 1mm S-CBGA-B783 Microprocessors Not Qualified 1.11.8/2.52.5/3.3V 1.155V Not Halogen Free 1333 MHz 1.333GHz 64 YES YES FLOATING POINT 32b MICROPROCESSOR 32 YES
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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

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    RFQ

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    Mult: 1

    		 0.00000000 Bulk 3 (168 Hours) 100 EAR99 85°C -40°C RoHS Compliant Contains Lead LQFP 20MHz HCMOS QUAD GULL WING NOT SPECIFIED 5V NOT SPECIFIED 100 INDUSTRIAL YES 0.5mm Microprocessors Not Qualified 5V Not Halogen Free 1 24 YES NO 16 68000 SERIAL IO/COMMUNICATION CONTROLLER, LAN 4 16
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