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A2F060M3E-FG256I

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Manufacturer No:

A2F060M3E-FG256I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F060M3E-FG256I

Package:

256-LBGA

Datasheet:

A2F060M3E-FG256I

Description:

-40°C~100°C TJ 256 Pin A2F060M3E System On ChipSmartFusion? Series MCU - 26, FPGA - 66 I/OMin 1.425V VMax 1.575V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.It has been assigned a package 256-LBGA by its manufacturer for this system on a chip.The SoC chip provides users with reliable performance because it is implemented with 16KB RAM.A MCU, FPGA technique is used for the SoC design's internal architecture.It is a member of the SmartFusion? series.As a rule of thumb, the average operating temperature for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 60K Gates, 1536D-Flip-Flops.A state-of-the-art Tray package houses this SoC system on a chip.MCU - 26, FPGA - 66 I/Os are included in this SoC part.The flash is set to 128KB.A search for A2F060M3E will result in system on chips that have similar specs and purposes.The wireless SoC works at a frequency of 80MHz.This SoC meaning utilizes a core architecture of ARM as its foundation.256 pins are present on this computer SoC.In order for the SoC computing to start, -40°C is just about right.This SoC system on chip is designed to operate at a temperature of 100°C.The maximum supply voltage is rated as 1.575V.A minimum of 1.425V power is supplied to it.

ARM? Cortex?-M3 processor.


16KB RAM.
Built on MCU, FPGA.
128KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F060M3E-FG256I System On Chip (SoC) applications.

  • Efficient hardware for training of neural networks
  • Networked sensors
  • Personal Computers
  • Industrial automation devices
  • Efficient hardware for inference of neural networks
  • Fitness
  • Central inverter
  • POS Terminals
  • Vending machines
  • Central alarm system
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Purchasing and Inquiry

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From $40.00 basic shipping fee depend on zone and country.
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From $40.00 basic shipping fee depend on zone and country.
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From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F060M3E-FG256I

technical specifications, attributes, parameters and parts with similar specifications to A2F060M3E-FG256I.

  • Type
    Parameter
    Select All
  • Package / Case

    256-LBGA

  • Number of Pins

    256

  • Supplier Device Package

    256-FPBGA (17x17)

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®

  • Part Status

    Obsolete

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    100°C

  • Min Operating Temperature

    -40°C

  • Frequency

    80MHz

  • Base Part Number

    A2F060M3E

  • Operating Supply Voltage

    1.5V

  • Interface

    EBI/EMI, I2C, SPI, UART, USART

  • Max Supply Voltage

    1.575V

  • Min Supply Voltage

    1.425V

  • Number of I/O

    MCU - 26, FPGA - 66

  • Speed

    80MHz

  • RAM Size

    16KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Core Architecture

    ARM

  • Max Frequency

    100MHz

  • Number of Logic Blocks (LABs)

    8

  • Primary Attributes

    ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops

  • Flash Size

    128KB

  • RoHS Status

    Non-RoHS Compliant

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