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A2F500M3G-FGG256I

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Manufacturer No:

A2F500M3G-FGG256I

Manufacturer:

Microsemi

HK JDW NO:

523-A2F500M3G-FGG256I

Package:

256-LBGA

Datasheet:

A2F500M3G-FGG256I

Description:

-40°C~100°C TJ 256 Pin A2F500M3G System On ChipSmartFusion? Series MCU - 25, FPGA - 66 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


There are ARM? Cortex?-M3 core processors in this SoC.According to the manufacturer, this system on a chip has a package of 256-LBGA.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.Internally, this SoC design uses the MCU, FPGA technique.SmartFusion? is the series name of this system on chip SoC.The average operating temps for this SoC meaning should be -40°C~100°C TJ.A significant feature of this SoC security is the combination of ProASIC?3 FPGA, 500K Gates, 11520 D-Flip-Flops.It is packaged in a state-of-the-art Tray package.This SoC part has a total of MCU - 25, FPGA - 66 I/Os.As for its flash size, it is 512KB.By searching A2F500M3G, you will find system on chips with similar specs and purposes.A wireless SoC that operates at a frequency of 80MHz is what the wireless SoC does.There is no doubt that the SoC meaning is based on the core architecture of ARM.The computer SoC has 256 pins.It just takes -40°C for the SoC computing to start up, and that is all it needs.As far as the design temperature of this SoC system on chip is concerned, the maximum working temperature is 100°C.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


A2F500M3G-FGG256I System On Chip (SoC) applications.

  • PC peripherals
  • Embedded systems
  • Sensor network-on-chip (sNoC)
  • Servo drive control module
  • Special Issue Editors
  • Functional safety for critical applications in the automotive
  • Remote control
  • AC drive control module
  • Robotics
  • Mobile computing
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

A2F500M3G-FGG256I

technical specifications, attributes, parameters and parts with similar specifications to A2F500M3G-FGG256I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Package / Case

    256-LBGA

  • Number of Pins

    256

  • Supplier Device Package

    256-FPBGA (17x17)

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    100°C

  • Min Operating Temperature

    -40°C

  • Frequency

    80MHz

  • Base Part Number

    A2F500M3G

  • Interface

    EBI/EMI, Ethernet, I2C, SPI, UART, USART

  • Operating Supply Current

    2mA

  • Number of I/O

    MCU - 25, FPGA - 66

  • Speed

    80MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DMA, POR, WDT

  • Connectivity

    EBI/EMI, Ethernet, I2C, SPI, UART/USART

  • Architecture

    MCU, FPGA

  • Core Architecture

    ARM

  • Number of Gates

    500000

  • Max Frequency

    100MHz

  • Number of Logic Blocks (LABs)

    24

  • Primary Attributes

    ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops

  • Flash Size

    512KB

  • RoHS Status

    RoHS Compliant

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