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M2S050T-1FG484

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Manufacturer No:

M2S050T-1FG484

Manufacturer:

Microsemi

HK JDW NO:

523-M2S050T-1FG484

Package:

484-BGA

Datasheet:

M2S050T-1FG484

Description:

0°C~85°C TJ M2S050T System On ChipSmartFusion?2 Series 267 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC has been developed.According to the manufacturer, this system on a chip has a package of 484-BGA.A 64KB RAM SoC chip provides reliable performance to users.The internal architecture of this SoC design utilizes the MCU, FPGA technique.In the SmartFusion?2 series, this system on chip SoC is included.In general, this SoC meaning should operate at a temperature of 0°C~85°C TJ on a regular basis.One important thing to mark down is that this SoC meaning combines FPGA - 50K Logic Modules.Housed in the state-of-art Tray package.In total, this SoC part has 267 I/Os.This flash has a size of 256KB.It is possible to find system on chips that are similar in specs and purpose by searching for M2S050T.At 166MHz, the wireless SoC works.Based on the core architecture of ARM, the SoC meaning has a high level of performance.0°C is just enough for the SoC computing to start up.There is a maximum operating temperature of 85°C set for this SoC system on chip during its design.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S050T-1FG484 System On Chip (SoC) applications.

  • Efficient hardware for training of neural networks
  • AC-input BLDC motor drive
  • Remote control
  • Multiprocessor system-on-chips (MPSoCs)
  • Efficient hardware for inference of neural networks
  • Industrial sectors
  • Mobile market
  • Level
  • Robotics
  • Industrial AC-DC
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S050T-1FG484

technical specifications, attributes, parameters and parts with similar specifications to M2S050T-1FG484.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    8 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 1 month ago)

  • Package / Case

    484-BGA

  • Supplier Device Package

    484-FPBGA (23x23)

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Series

    SmartFusion®2

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    85°C

  • Min Operating Temperature

    0°C

  • Frequency

    166MHz

  • Base Part Number

    M2S050T

  • Interface

    CAN, Ethernet, I2C, SPI, UART, USART, USB

  • Number of I/O

    267

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Core Architecture

    ARM

  • Primary Attributes

    FPGA - 50K Logic Modules

  • Flash Size

    256KB

  • RoHS Status

    Non-RoHS Compliant

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