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M2S060-1FGG676I

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Manufacturer No:

M2S060-1FGG676I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S060-1FGG676I

Package:

676-BGA

Datasheet:

M2S060-1FGG676I

Description:

676 Terminations-40°C~100°C TJ System On ChipSmartFusion?2 Series 387 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


On this SoC, there is ARM? Cortex?-M3 core processor.It has been assigned a package 676-BGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides users with a high level of performance.The internal architecture of this SoC design is based on the MCU, FPGA technique.The SmartFusion?2 series contains this system on chip SoC.This SoC meaning should have an average operating temperature of -40°C~100°C TJ.This SoC security combines FPGA - 60K Logic Modules, an important feature to keep in mind.Housed in the state-of-art Tray package.This SoC part contains a total of 387 I/Os in total.As a rule of thumb, it is advised to use a power supply with a value of 1.2V.There are voltages higher than 1.26V that should be avoided when using the SoCs wireless.This SoC system on a chip can run on a power supply that is at least 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.The system on a chip uses 676 terminations in total.This system on a chip is just as capable as any other high-quality Field Programmable Gate Arrays.A SoC chip with 387 outputs is available.There is 1.2V power supply requirement for this system on chip SoC.This SoC chip has a total of 387 inputs that can be used.The logic system on chips contain 56520 logic cells.It has a 256KB flash.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.

There are a lot of Microsemi Corporation


M2S060-1FGG676I System On Chip (SoC) applications.

  • Medical
  • High-end PLC
  • Apple smart watch
  • Medical
  • Medical Pressure
  • Functional safety for critical applications in the aerospace
  • CNC control
  • Communication interfaces ( I2C, SPI )
  • AC drive control module
  • Smartphone accessories
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

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FedEx International, 5-7 business days.
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Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

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DHL(www.dhl.com)
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UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S060-1FGG676I

technical specifications, attributes, parameters and parts with similar specifications to M2S060-1FGG676I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 2 weeks ago)

  • Package / Case

    676-BGA

  • Surface Mount

    YES

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®2

  • JESD-609 Code

    e3

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    676

  • Terminal Finish

    MATTE TIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1mm

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B676

  • Number of Outputs

    387

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    387

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    387

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 60K Logic Modules

  • Number of Logic Cells

    56520

  • Flash Size

    256KB

  • Height Seated (Max)

    2.44mm

  • Length

    27mm

  • Width

    27mm

  • RoHS Status

    RoHS Compliant

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