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M2S060TS-1FCSG325

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Manufacturer No:

M2S060TS-1FCSG325

Manufacturer:

Microsemi

HK JDW NO:

523-M2S060TS-1FCSG325

Package:

325-TFBGA, CSPBGA

Datasheet:

M2S060TS-1FCSG325

Description:

325 Terminations0°C~85°C TJ System On ChipSmartFusion?2 Series 200 I/O1.2V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A core processor ARM? Cortex?-M3 is embedded in this SoC.The manufacturer assigns this system on a chip with a 325-TFBGA, CSPBGA package as per the manufacturer's specifications.The 64KB RAM implementation of this SoC chip ensures efficient performance for users.The SoC design uses MCU, FPGA architecture for its internal architecture.SmartFusion?2 is the series number of this system on chip SoC.It is recommended that this SoC meaning be operated at 0°C~85°C TJ on an average.As one of the most important things to note is that this SoC security combines FPGA - 60K Logic Modules together.This SoC system on a chip has been designed in a state-of-the-art Tray package.In total, this SoC part has 200 I/Os.A power supply with a 1.2V rating is recommended.It is unsafe to operate the SoCs wireless at voltages above 1.26V.It can feed on a power supply of at least 1.14V.A re-configurable FIELD PROGRAMMABLE GATE ARRAY can be used for a variety of designing purposes.It is really beneficial to have system on a chip since there are 325 terminations in total.As any high-quality Field Programmable Gate Arrays, it is a system on a chip of outstanding capabilities.You can have 200 user outputs for this SoC chip.There is 1.2V power supply requirement for this system on chip SoC.This SoC chip has a total of 200 inputs that can be used.Logic system on chips features 56520 logic cells.There is a flash of 256KB on it.Furthermore, this SoC processor also incorporates additional features similar to LG-MIN, WD-MIN which are available on other SoC processors also.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
LG-MIN, WD-MIN

There are a lot of Microsemi Corporation


M2S060TS-1FCSG325 System On Chip (SoC) applications.

  • Industrial transport
  • sequence controllers
  • Central inverter
  • Keyboard
  • Servo drive control module
  • Keywords
  • Video Imaging
  • Apple smart watch
  • Print Special Issue Flyer
  • Industrial automation devices
1. Purchase

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Tell us the model and quantity you need, our sales staff will reply the price in time.
EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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3. RFQ (Request for Quotations)

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Our sales will reply to your request by email within 24 hours.

IMPORTANT NOTICE

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2. Since inventories and prices may fluctuate to some extent, the sales manager is going to reconfirm the order and let you know if there are any updates.

4. Shipping Cost

Shipping starts at $40, but some countries will exceed $40. For example (South Africa, Brazil, India, Pakistan, Israel, etc.)
The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S060TS-1FCSG325

technical specifications, attributes, parameters and parts with similar specifications to M2S060TS-1FCSG325.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 3 weeks ago)

  • Package / Case

    325-TFBGA, CSPBGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2015

  • Series

    SmartFusion®2

  • JESD-609 Code

    e3

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    325

  • Terminal Finish

    MATTE TIN

  • Additional Feature

    LG-MIN, WD-MIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    0.5mm

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • JESD-30 Code

    S-PBGA-B325

  • Number of Outputs

    200

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Number of I/O

    200

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    200

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Primary Attributes

    FPGA - 60K Logic Modules

  • Number of Logic Cells

    56520

  • Flash Size

    256KB

  • Height Seated (Max)

    1.01mm

  • Length

    11mm

  • Width

    11mm

  • RoHS Status

    RoHS Compliant

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