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M2S090T-FGG676

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Manufacturer No:

M2S090T-FGG676

Manufacturer:

Microsemi

HK JDW NO:

523-M2S090T-FGG676

Package:

676-BGA

Datasheet:

M2S090T-FGG676

Description:

676 Terminations0°C~85°C TJ M2S090T System On ChipSmartFusion?2 Series 425 I/O1.2V

Quantity:

In Stock : 999

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Product Details

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This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.The manufacturer assigns this system on a chip with a 676-BGA package as per the manufacturer's specifications.The SoC chip provides users with reliable performance because it is implemented with 64KB RAM.The internal architecture of this SoC design utilizes the MCU, FPGA technique.SmartFusion?2 is the series name of this system on chip SoC.As a rule of thumb, the average operating temperature for this SoC meaning should be 0°C~85°C TJ.One important thing to mark down is that this SoC meaning combines FPGA - 90K Logic Modules.It comes in a state-of-the-art Tray package.Total I/Os on this SoC part are 425.Ideally, a power supply with a voltage of 1.2V should be used.It is considered hazardous to operate the SoCs wireless with a voltage higher than 1.26V.As a minimum, the power supply of the SoC system on a chip needs to be 1.14V.Depending on your specific needs, FIELD PROGRAMMABLE GATE ARRAY can be re-configured.It is really beneficial to have system on a chip since there are 676 terminations in total.In addition, it boasts impressive system on a chipming capabilities, just like other high-quality Field Programmable Gate Arrays.The SoC chip that comes with this module can be configured to have 425 outputs.A power supply of 1.2V is required.The SoC chip offers 425 inputs.There are 86316 logic cells in the logic system on chips.There is a flash of 512KB on it.It is possible to find system on chips that are similar in specs and purpose by searching for M2S090T.At 166MHz, the wireless SoC works.It uses ARM as its core architecture.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
512KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S090T-FGG676 System On Chip (SoC) applications.

  • Healthcare
  • Medical
  • Industrial robot
  • Industrial sectors
  • Industrial transport
  • Functional safety for critical applications in the industrial sectors
  • Cyber security for critical applications in the aerospace
  • Keyboard
  • Industrial automation devices
  • Self-aware system-on-chip (SoC)
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

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4. Shipping Cost

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Purchasing and Inquiry

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The fee is charged according to the rule of PayPal.
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Registered Mail(www.singpost.com)
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S090T-FGG676

technical specifications, attributes, parameters and parts with similar specifications to M2S090T-FGG676.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 3 weeks ago)

  • Package / Case

    676-BGA

  • Surface Mount

    YES

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    SmartFusion®2

  • JESD-609 Code

    e3

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Number of Terminations

    676

  • Terminal Finish

    MATTE TIN

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1.2V

  • Terminal Pitch

    1mm

  • Frequency

    166MHz

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Base Part Number

    M2S090T

  • JESD-30 Code

    S-PBGA-B676

  • Number of Outputs

    425

  • Qualification Status

    Not Qualified

  • Supply Voltage-Max (Vsup)

    1.26V

  • Power Supplies

    1.2V

  • Supply Voltage-Min (Vsup)

    1.14V

  • Interface

    CAN, Ethernet, I2C, SPI, UART, USART, USB

  • Number of I/O

    425

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Inputs

    425

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Core Architecture

    ARM

  • Primary Attributes

    FPGA - 90K Logic Modules

  • Number of Logic Cells

    86316

  • Flash Size

    512KB

  • Height Seated (Max)

    2.44mm

  • Length

    27mm

  • Width

    27mm

  • RoHS Status

    RoHS Compliant

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