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M2S050-FGG896

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Manufacturer No:

M2S050-FGG896

Manufacturer:

Microsemi

HK JDW NO:

523-M2S050-FGG896

Package:

896-BGA

Datasheet:

M2S050-FGG896

Description:

0°C~85°C TJ 896 Pin M2S050 System On ChipSmartFusion?2 Series 377 I/OMin 1.14V VMax 1.26V V

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


Based on the core processor(s) ARM? Cortex?-M3, this SoC is built.It has been assigned a package 896-BGA by its manufacturer for this system on a chip.With 64KB RAM implemented, this SoC chip provides reliable operation.Using the MCU, FPGA technique, this SoC design's internal architecture is simple.The system on a chip is part of the series SmartFusion?2.This SoC meaning should have an average operating temperature of 0°C~85°C TJ.In addition, this SoC security combines FPGA - 50K Logic Modules.Tray package houses this SoC system on a chip.An integral part of this SoC consists of a total of 377 I/Os.The flash size of the SoC meaning is 256KB.Searching M2S050 will bring up system on chips with similar specs and purposes.wireless SoCs operate at 166MHz.Core architecture of ARM underpins the SoC meaning.There is a 896-pin version of this computer SoC available.In order for the SoC computing to start up, 0°C is sufficient.In this SoC system on chip, 85°C represents its maximum operating temperature.Voltages up to 1.26V are specified for this SoC security.Power is provided to it at least to the extent that 1.14V is required.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S050-FGG896 System On Chip (SoC) applications.

  • Industrial AC-DC
  • Measurement testers
  • Defense
  • Fitness
  • Microcontroller based SoC ( RISC-V, ARM)
  • Smart appliances
  • Industrial sectors
  • Three phase UPS
  • Networked sensors
  • Central inverter
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EmailEmail for receiving inquiries: jindawei@hkjdwchip.com

2. Means of Payment

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4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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FedEx International, 5-7 business days.
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Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
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Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S050-FGG896

technical specifications, attributes, parameters and parts with similar specifications to M2S050-FGG896.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    12 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 1 month ago)

  • Package / Case

    896-BGA

  • Number of Pins

    896

  • Supplier Device Package

    896-FBGA (31x31)

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    SmartFusion®2

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    85°C

  • Min Operating Temperature

    0°C

  • Frequency

    166MHz

  • Base Part Number

    M2S050

  • Operating Supply Voltage

    1.2V

  • Interface

    CAN, Ethernet, I2C, SPI, UART, USART, USB

  • Max Supply Voltage

    1.26V

  • Min Supply Voltage

    1.14V

  • Memory Size

    164.3kB

  • Number of I/O

    377

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Number of Logic Elements/Cells

    56340

  • Core Architecture

    ARM

  • Number of Logic Blocks (LABs)

    4695

  • Primary Attributes

    FPGA - 50K Logic Modules

  • Flash Size

    256KB

  • Length

    31mm

  • Width

    31mm

  • Radiation Hardening

    No

  • RoHS Status

    RoHS Compliant

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